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ITK-Inspired Layout Studies for Better Utopia Replacement

Explore Cartigny's layout discussions, inspired by ITK, aiming to enhance the concept of 'utopia'. Attend Elsing's talk for insights and check Cartigny's meeting details from 7/3/12. Considerations include optimizing hit numbers, Pt resolution, realism in designs, and implications for the physicist view. Tim's work focuses on tracking progress for a 130nm ASIC stave, addressing key issues like thickness, envelope correction, DCDC converters design, and list compilation for specifications documentation.

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ITK-Inspired Layout Studies for Better Utopia Replacement

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  1. Cartigny Layout Discussion (Tim)

  2. Origin • ITK inspired layout studies aimed at replacing ‘utopia’ with something better... • See Elsing talk at AUW • https://indico.cern.ch/getFile.py/access?contribId=203&sessionId=60&resId=0&materialId=slides&confId=158038 • Cartigny Meeting • 7/3/12 • https://indico.cern.ch/conferenceDisplay.py?confId=177242 • Considerations • Number of hits 11/14 (eliminate holes in coverage) • Pt resolution (maximise radius of last point • Minimise extrapolation distances between layers (

  3. The Physicist View

  4. Implications • Z stave of 1270mm-> 13 modules • Stub layer (2 modules long) • Barrel Radii:- • 415, 555, 700, 830, 915, 1000 • Barrel/endcap gap (active-active) or 140mm • Realism strikes back..... • IW / GV presentation to ITK-SC (8/5/12) – John Noviss’ work • See https://indico.cern.ch/getFile.py/access?contribId=4&sessionId=0&resId=1&materialId=slides&confId=187905

  5. Tim’s Work

  6. Issue • Need to keep track of what’s going on.... But • Mustn’t forget (get too deflected) from thinking about what a 130nm ASIC stave might be like! Eg..... • Thickness • The core COULD be as thin as 3mm reducing the envelope by 2mm (>10%) • Is the insertion envelope correct (could need to be greater?) • DCDC converters • Design of SMC area • Width • DCDC integration • SMC width • Need to keep things consistent.... • We URGENTLY need some way of compile lists of hard and ‘soft’ specifications and DOCUMENT progress.

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