Update on bump bonding. Detector preFPIX2I – UCD, 1 st detector delivered but inner row of wire bond pad not exposed; they need a few more chips and we will send them the re-diced sensors preFPIX2tb – AIT; expect to get up to 6 detectors. ATLAS Prototype 2 wafer. 1, 5 = STlad 2,6 = Stnod
Use C and D (FPIX1_SIP) and
If the FPIX1 chips are still useable, please bond them to the FPIX1_TIP%X1 and produce a module.
Need to understand what’s causing this
Will receive another batch irradiated to more than 10 Mrad