Update on bump bonding
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Update on bump bonding. Detector preFPIX2I – UCD, 1 st detector delivered but inner row of wire bond pad not exposed; they need a few more chips and we will send them the re-diced sensors preFPIX2tb – AIT; expect to get up to 6 detectors. ATLAS Prototype 2 wafer. 1, 5 = STlad 2,6 = Stnod

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Update on bump bonding

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Update on bump bonding

Update on bump bonding

  • Detector

    • preFPIX2I – UCD, 1st detector delivered but inner row of wire bond pad not exposed; they need a few more chips and we will send them the re-diced sensors

    • preFPIX2tb – AIT; expect to get up to 6 detectors.


Atlas prototype 2 wafer

ATLAS Prototype 2 wafer

  • 1, 5 = STlad

  • 2,6 = Stnod

  • 3,4 = STsmd

  • Use 3,4 and 2 from Cis Wafers.


Layout of sintef wafer

GREEN

FPIX1_SIP: A,C,D,F

FPIX1_SCP: B,E,G

BLUE

FPIX1_TIP5X1: TILIP

Bonding instructions:

Use C and D (FPIX1_SIP) and

B (FPIX1_SCP).

If the FPIX1 chips are still useable, please bond them to the FPIX1_TIP%X1 and produce a module.

Layout of SINTEF wafer


Dummies

Dummies

  • Test of dummies – long term storage, thermal cycle, and irradiation.

  • Little change due to cooling and long term storage

  • Saw some changes due to irradiation (C060 up to 13 Mrad)

    Need to understand what’s causing this

    Will receive another batch irradiated to more than 10 Mrad

  • Selcuk – talk at LEB Workshop next month at Stockholm

  • Dummy assembly test: glue epoxy on top of the dummy assembly; do wire bonding on a few pads, repeat connectivity test; no change observed. Next do thermal cycle test; expect all the results this week


Thinning

Thinning

  • We would like to thin the 8” wafer to 200 um from 750 um.

  • Checking out a few vendors (together with MCNC)

    • QBBS ( UV release tape)

    • APTEK (wax)

    • TRUE-Si (plasma etching, not touching the back side)


Thinning cont

Thinning (cont)

  • We will chek the flatness, uniformity of the thinning here using touch probe, optically, interferometry (ANL)

  • 1st wafers received from MCNC (bumped 6” wafers)

    • Target thickness: 200 mm

    • Our measurement: 190 mm and 170 mm (SD about 25 mm); the thick one broke into two halves


Aptek

APTEK


Update on bump bonding

QBBS


True si

TRUE_SI


Summary

Summary

  • A lot of work need to be done on thinning and protection of the bumps

  • QBBS – look best out of the three in terms of bump protection

  • Have talked to MCNC about using photoresist to protect the bumps( not easy, very thick layer)

  • Have sent out to these companies 8” wafers to be thinned


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