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Update on bump bonding. Detector preFPIX2I – UCD, 1 st detector delivered but inner row of wire bond pad not exposed; they need a few more chips and we will send them the re-diced sensors preFPIX2tb – AIT; expect to get up to 6 detectors. ATLAS Prototype 2 wafer. 1, 5 = STlad 2,6 = Stnod

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update on bump bonding
Update on bump bonding
  • Detector
    • preFPIX2I – UCD, 1st detector delivered but inner row of wire bond pad not exposed; they need a few more chips and we will send them the re-diced sensors
    • preFPIX2tb – AIT; expect to get up to 6 detectors.
atlas prototype 2 wafer
ATLAS Prototype 2 wafer
  • 1, 5 = STlad
  • 2,6 = Stnod
  • 3,4 = STsmd
  • Use 3,4 and 2 from Cis Wafers.
layout of sintef wafer
GREEN

FPIX1_SIP: A,C,D,F

FPIX1_SCP: B,E,G

BLUE

FPIX1_TIP5X1: TILIP

Bonding instructions:

Use C and D (FPIX1_SIP) and

B (FPIX1_SCP).

If the FPIX1 chips are still useable, please bond them to the FPIX1_TIP%X1 and produce a module.

Layout of SINTEF wafer
dummies
Dummies
  • Test of dummies – long term storage, thermal cycle, and irradiation.
  • Little change due to cooling and long term storage
  • Saw some changes due to irradiation (C060 up to 13 Mrad)

Need to understand what’s causing this

Will receive another batch irradiated to more than 10 Mrad

  • Selcuk – talk at LEB Workshop next month at Stockholm
  • Dummy assembly test: glue epoxy on top of the dummy assembly; do wire bonding on a few pads, repeat connectivity test; no change observed. Next do thermal cycle test; expect all the results this week
thinning
Thinning
  • We would like to thin the 8” wafer to 200 um from 750 um.
  • Checking out a few vendors (together with MCNC)
    • QBBS ( UV release tape)
    • APTEK (wax)
    • TRUE-Si (plasma etching, not touching the back side)
thinning cont
Thinning (cont)
  • We will chek the flatness, uniformity of the thinning here using touch probe, optically, interferometry (ANL)
  • 1st wafers received from MCNC (bumped 6” wafers)
    • Target thickness: 200 mm
    • Our measurement: 190 mm and 170 mm (SD about 25 mm); the thick one broke into two halves
summary
Summary
  • A lot of work need to be done on thinning and protection of the bumps
  • QBBS – look best out of the three in terms of bump protection
  • Have talked to MCNC about using photoresist to protect the bumps( not easy, very thick layer)
  • Have sent out to these companies 8” wafers to be thinned
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