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Bump-Bonding/Thinning. Contact, possible collaboration, Simon Kwan FNAL, BTEV Developing plan 2003 small scale participation, learning curve 2004 trials of leading candidates for phenix chips who is interested, CO, others? Two leading companies

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bump bonding thinning
Bump-Bonding/Thinning
  • Contact, possible collaboration, Simon Kwan FNAL, BTEV
  • Developing plan
    • 2003 small scale participation, learning curve
    • 2004 trials of leading candidates for phenix chips
    • who is interested, CO, others?
  • Two leading companies
    • MCNC (Development) / Unitive (commercial) Nth. Car.
      • bump-first then thin
      • so far no success
    • AIT Advanced Interconnect Technologies (Hong Kong)
      • thin first then bump
      • success with 150micron 4” wafers

Craig Ogilvie

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