1 / 19

SILICON DETECTOR PROJECTS @ DESY Zeuthen (up to now) By Wolfgang Lange, DESY Zeuthen

SILICON DETECTOR PROJECTS @ DESY Zeuthen (up to now) By Wolfgang Lange, DESY Zeuthen. OUTLINE. 2. Early Silicon Detectors in Zeuthen Silicon Detectors in H1 (BST, CST, FST, BST-PAD) Silicon Detectors in ZEUS (Barrel Detector) HERMES Recoil Detector Facilities and Collaborators.

teddys
Download Presentation

SILICON DETECTOR PROJECTS @ DESY Zeuthen (up to now) By Wolfgang Lange, DESY Zeuthen

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. SILICON DETECTOR PROJECTS @ DESY Zeuthen (up to now) By Wolfgang Lange, DESY Zeuthen

  2. OUTLINE 2 • Early Silicon Detectors in Zeuthen • Silicon Detectors in H1 (BST, CST, FST, BST-PAD) • Silicon Detectors in ZEUS (Barrel Detector) • HERMES Recoil Detector • Facilities and Collaborators Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  3. EARLY SILICON DETECTORS 3 • Development together with Werk für Fernsehelektronik Berlin (WF) • First silicon sensors in planar technology ~ 1987 • DC coupled, 50µm pitch on 2” wafers (up to 25*25 mm2 sensors), discrete readout via fanout, electronics mounted on PCBs • Soon switched to 4” technology: 50*50mm2 sensors • DC coupled, 50µm pitch, development of the first thick film hybrid, • use of the first readout ASIC (MX-2, Stanford University) • first application: calibration of the L3-central tracking chamber @ CERN • Development together with Halbleiterwerk Frankfurt/Oder (HFO) • and Institut für Halbleiterphysik Frankfurt/Oder (IHP) • - May 1989 first own production of DELPHI type sensors (IHP FF/O) • AC coupled, 25µm pitch (one indermediate strip, polysilicon resistors), • sensors used successfully until 1993 in different experiments • 1991 we started the development of our own sensor types (strip, pad). Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  4. SILICON DETECTORS IN H1 - OVERVIEW 4 FST (strips) CST (strips) electron beam proton beam BST (strips, pads) proton direction = forward direction Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  5. SILICON DETECTORS IN H1 - DETAILS 5 • Three different sensor types: R-Strip, Phi-Strip, Pad • Two different readout hybrids: S-Hybrid, Pad-Hybrid VERTEX Mechanical design: Carbon fiber reinforced plastic • Modular design of all components • Design as a “plug in” device with • remotely operated contact ring • (including all media connections • for N2 and H2O) • Separate inner and outer shielding • Cable- and media connections are • pre-installed to the contact ring Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  6. S(tandard) - DETECTOR MODULE 6 • universal detector module • for front and back side • low cost design with included strip line • and heat distributing Al bottom layer • standard circuitry (using APC 128 /decoder) • optimized for low common mode and • low noise (including ground plane) • 220 modules (spares included) produced for • both FST and BST Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  7. CST BARREL (NOT ZEUTHEN [ZÜRICH] BUT H1) 7 • CST barrel consists of two layers • completely covering the vertex • (beam pipe) • Ladders consist of 6 double sided sensors • with hybrids on both sides • hybrids are equipped with radhard readout • chips APC128 (DMILL) one ladder CST hybrid Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  8. BST PAD DETECTOR 8 • For the measurement of deep inelastic scattering • one needs to trigger on such events (vertex pointing) • Background suppression for SPACAL hits • (photon background) • Four planes (disks) with pad detectors which are • read out by the trigger system of H1 (trigger level 1) • Pad detector supplies trigger patterns (“masks” or • classified tracks, L1) as well as hit patterns (level 3) • Measurement of normalized counting rates per area • allows the use as “radiation monitor” Readout chain: sensor -> detector module -> repeater (pre-processing) -> H1 readout Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  9. BST PAD DETECTOR MODULE 9 AC coupled sensors with 32 (4 * 8) pads • ASIC “PRO/A”: • 32 channels • preamp / shaper / discriminator • adjustable gain (four steps) • subtraction of neighboring • channels possible • output ‘monostable’ or • ‘time over threshold’ • input current compensation • optional • over all test feature Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  10. PERFORMANCE PAD MODULE 10 • Tuning of all modules under HERA conditions with no beam -> ‘noise counts’ • Threshold scale calibrated with MIPs in a test beam • Most critical part after design: depletion voltage of sensor • -> careful decoupling and grounding mandatory • nearly 100% trigger efficiency with tuned system • -> tracks defined already with two hits in two planes “self triggered” spectrum of MIPs (pedestal added with external trigger) Threshold scans for different depletion voltage supplies Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  11. RESULTS - strip modules 11 • Excellent performance of strip modules (S-hybrid equipped with sensors from CIS Erfurt): S/N ≥ 30 spatial resolution ≤ 12 µm Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  12. RESULTS (continued) - spatial resolution 12 • FST alignment before alignment after alignment Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  13. ACTIVITIES FOR THE ZEUS Micro Vertex Detector 13 • No development of “real silicon” but development of parts: • flex foils for the interconnection of sensors and r/o hybrids • design, production and application of special glueing • techniques for flex foils on top of silicon (tooling included) • design and production of handling tools for • double sided silicon • DC measurement of a large quantity of sensors Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  14. HERMES RECOIL DETECTOR 14 Position of Recoil Detector Recoil Detector: Detection of low momentum ‘recoil’ protons Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  15. HERMES RECOIL DETECTOR - REQUIREMENTS 15 • REQUIREMENTS ON • Silicon Sensors • Detection area about 200*100mm2 • Spatial resolution in ‘phi’ about 1mm • low quantities needed (two layers) • therefore look for sensors available • - TIGRE Sensors (MICRON Ltd. UK) • R/O ELECTRONICS (R/O Chip) • - An analog pipeline chip is needed to • accommodate the HERMES trigger. • - A dynamic range of 70 MIP ( 280 fC). • - 10 MHz readout to match the HERA • frequency. • - Prefer a chip already used in HERMES • (Lambda Wheels - HELIX 128). Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  16. HERMES RECOIL DETECTOR - R/O TECHNIQUE (1) 16 1 “MIP” = 24 000 e-/h pairs +/- “MIP” = pos/neg charge on preamp Conclusions: - Linear response over +/-10 “MIP” - Saturated at ~15 “MIP” Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  17. HERMES RECOIL DETECTOR - R/O TECHNIQUE (2) 17 Solution: charge division charge division works nicely (and can be tuned to the needs) Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  18. HERMES RECOIL DETECTOR - PROTOTYPE 18 Sensor ZEUS hybrid Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  19. FACILITIES AND COLLABORATORS 19 • At DESYZeuthen we are able to perform (class 10k clean room): • Ultrasonic wire bonding (Au, Al, down to 17.5 µm wires) • Glueing with high mechanical precision and/or special hardening procedures (silver epoxies) • Measurements of single and double sided sensors on different probe stations • long term measurements (darkness, special atmosphere: N2 or similar) • chip testing (delivered probe cards can be adapted) • additional: electronics workshop with automatic SMD placement and soldering tools • mechanical workshop with NC machining/milling • at DESY Hamburg a ‘state of the art’ programmable wire bonder • Companies / Institutions we are used to work with: • - Sensors: CiS Erfurt (D), Micron Ltd. (UK), SINTEF Oslo (N), Hamamatsu (J) • chip design: IDE AS, Oslo (N) and ASIC Laboratory of University of Heidelberg (D) • probe cards: Wentworth Deutschland GmbH, München (D) • high precision printed circuit boards: Würth GmbH, Roth am See (D), Optiprint (CH) • thick film hybrids: Elbau GmbH, Berlin (D) Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

More Related