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The D0 Silicon Microstrip Tracker (D0SMT). Outline Design Detector Studies Coupling capacitors Radiation Damage LASER tests Electronics and readout Mechanical Assembly Production Testing Summary and prospects Installation in the spring of 2000. D0SMT Components. Major SMT Subsystems

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The d0 silicon microstrip tracker d0smt l.jpg
The D0 Silicon Microstrip Tracker (D0SMT)


  • Design

  • Detector Studies

    Coupling capacitors

    Radiation Damage

    LASER tests

  • Electronics and readout

  • Mechanical Assembly

  • Production Testing

  • Summary and prospects

  • Installation in the spring of 2000

  • D0smt components l.jpg
    D0SMT Components

    • Major SMT Subsystems

      • Single Sided Ladder (3 chip)

      • Double Sided 2o Ladder (9 chip)

      • Double Sided 90o Ladder (6 chip)

      • H Disk (SS back-to-back)

      • F Disk (DS)

    H disk l.jpg
    H DISK

    • Silicon IR = 94.5 mm, OR = 236 mm at wedge centerline

    • Readout mounts on outer silicon detector

    • Wedges alternate between two surfaces of a central cooling/support channel

    • Effective stereo angle = 15o

    F disk l.jpg
    F Disk

    • Silicon IR = 26 mm, OR = 105.27 mm at wedge centerline

    • Readout mounts outboard of silicon, which allows disk to fit within a gap of 8 mm

    • Wedges alternate between two surfaces of a centralcooling/support channel (beryllium)

    • Effective stereo angle = 30 degrees

    • p-side Trace angle = -15o with respect to wedge centerlinePitch = 50 μm

    • n-side Trace angle = +15o with respect to wedge centerlinePitch = 62.5 μm

    Capacitor studies l.jpg
    Capacitor Studies

    • In a double sided detector with grounded electronics, coupling capacitor breakdown will limit the lifetime of the detector.

    • Studies

      • Eliminate “black hole” effect in the SVX chip by bypassing parasitic transistor at the input (see VTX ‘96)

      • Effect of wirebonding on capacitor breakdown

        • 5-10% of capacitors fail at 50-100V after bonding (normally Vbd=140V) on SS detectors

        • No excess failures see on DS detectors with PECVD layer

    N side capacitor studies l.jpg
    n-side Capacitor Studies

    • When electronics are connected to the n-side of a detector with shorted capacitors we see an anomalous current from the amplifier input

      • Current is reduced when electronics is disconnected

      • Effect seen on n-side only

    • Caused by forward bias of the p-stop n junction

    Irradiation studies l.jpg
    Irradiation Studies

    • Expect ~1 Mrad exposure for the inner layer per 4fb1

    • Irradiation with

      • 8 GeV Protons from the Fermilab booster

      • 1 MeV Neutrons (Lowell Mass.)

    • Study

      • Evolution of deletion characteristics

      • Performance of detector and electronics

    Irradiation studies cluster size l.jpg
    Irradiation StudiesCluster size

    H disk irradiation l.jpg
    H Disk Irradiation

    Depletion voltage (volts)

    Neutron fluence (1013/cm2)

    Neff (1011/cm3)

    Neutron fluence (1013/cm2)

    Neutron studies l.jpg
    Neutron Studies

    Detector Studies using ~1 MeV neutron source

    Irradiation studies laser plateau l.jpg
    Irradiation StudiesLASER Plateau

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    Detector Production

    • Five detector types - 3-chip, 9-chip, 6-chip, F wedge, H wedge.

    • All radiation testing complete

    • laser and cosmic ray studies

      • Measure in-situ rise times

      • charge sharing distributions

    • Probe testing

      • 100 V capacitor breakdown test on each channel

      • CV or alpha test to measure depletion

      • IV Test

      • Spot checks on

        • Interstrip resistance

        • Coupling capacitance

        • Strip currents

    Micron detector delivery l.jpg
    Micron Detector Delivery

    Needed for


    Needed for


    D0smt electronics l.jpg
    D0SMT - Electronics

    • SVXII Chip - done and tested

      • Most issues involve bypassing and clock quality

      • Needs careful hybrid(HDI) design

    • HDIs - delivery pacing production

      • Single layer flex 4 mil pitch, 2 mil vias

    • Cables:

      • low mass, good frequency response (53 Mhz), low attenuation, no reflections, no radiation of clock signal to the calorimeter, fits in the allowed space.

      • High impedance stripline

      • 3 segments

        • low mass section of varying length

        • low mass fixed length

        • “high mass” high quality section

    • System tests underway now

    Where we were burned l.jpg
    Where we were “burned”

    • HDI flex circuit - good prototypes but no good production circuits

      • Find reliable company (Dyconex)

      • pay extra $$$

    • Detector delivery - ordered detectors 2 years early but waited for BABAR, H1…

      • still a serious problem

    • Cables

      • low mass, high impedance striplines are difficult

      • pay extra $$$

    • But we are now in production and expect to be on schedule

    Mechanical systems l.jpg
    Mechanical Systems

    • Design Philosophy

      • Build planar assemblies (ladders, wedges, disks) precisely under (Zeiss) CMM

      • Use mechanical tolerances to determine ladder placement in barrel (~15 mm)

    • Minimum Mass

      • Be support structures

      • Carbon fiber overall support

    Ladder assembly24 l.jpg
    Ladder Assembly

    • Match notches in Be support to posts in bulkhead

    • 15 micron tolerance on Notched and posts

    • 2 micron tolerances achieved in ladders

    Detector fiducials relative

    to beryllium notches

    Transverse offset from nominal (μm)

    Rise time studies l.jpg
    Rise Time Studies

    Use LASER to excite SSD, Monitor preamp

    Production testing l.jpg
    Production Testing

    • HDI Burn-in

      • Encapsulation

    • HDI Spot-check

      • Ladder assembly

    • Ladder Spot-check

      • Ladder repairs

    • Ladder burn-in

    • LASER Test

    • Insertion into detector

    Laser testing channel uniformity l.jpg
    Laser TestingChannel uniformity

    Laser testing channel gains l.jpg
    Laser TestingChannel Gains

    Summary l.jpg

    • We have achieved:

      • low mass flex/beryllium hybrids

      • SVX II chip, 53 MHz readout

      • Minimal dead area

      • Precise construction

      • A workable double sided design for “moderate” radiation doses

    • Now we just have to build another 787,968 channels