NanoFabSimulator Update Nick Reeder, March 30, 2012
Update to Etch Code • Etch code asks user for etchant and time, and uses etch rates from Williams’ papers to compute amount of materials to remove. • For unknown rates, warns user and assumes 0. • Process is highly iterative, simulating one minute of etching at a time. Lengthy etch times take a while to execute.
Questions • One-minute etch resolution okay? • Etch rate assumptions okay? • Need to distinguish materials based on method of deposition? (E.g., wafer silicon vs. sputtered vs. evaporated….) • What parameter(s) should user provide for Polish operation?
Questions • Looking ahead to photolithography, how many states do we need to distinguish for photoresists? • Freshly applied • Soft-baked, unexposed • Soft-baked, exposed • Hard-baked, unexposed • Hard-baked, exposed • …?