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The latest update to NanoFabSimulator enhances several critical functionalities such as thermal oxidation, ion implantation, and sputtering processes. Key improvements include the removal of SiO2 doping post-oxidation, integration of ion milling and plasma etches with CF4 and SF6, and user-defined specifications for dopants, doses, and ion energies. Additionally, it introduces adaptive sputtering angles, eliminates erroneous deposition on shaded surfaces, and sets up a roadmap for future developments, including new code for various processes, online help resources, and instructional content.
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NanoFabSimulator Update Nick Reeder, May 17, 2012
Minor Updates • Thermal Oxidize code: No longer identifies SiO2 as doped after doped Si is oxidized. • Added ion mill, CF4, and SF6 plasma etches. • Had to make many assumptions, due to scarcity of data in Williams’ etch-rate tables. • Changed vertical and horizontal scales on display. • Question: What should height and width of displayed area be (in microns), and does this need to be adjustable by the user?
Updates to Implant Code • User now specifies dopant, dose, and ion energy. Code computes depth and doping concentration. • Thresholds for doping levels: • Undoped if concentration < 1012 ions/cm3 • n or p if 1012 concentration < 1016 • n+ or p+ if 1016 concentration < 1018 • n++ or p++ if 1018 concentration
Updates to Sputter Code • User now specifies sputtering angle, and code simulates deposition from that angle. • Fixed: sputter is no longer deposited on shaded surfaces. • Algorithm is iterative and time-consuming due to complexity of resulting contours.
To-Do List • Write new code for • Bake • Lift-off • Clean • Profilometer • Fix spin-coat code so that resist does not adhere to underside of horizontal surfaces. • In expose code, implement diffraction of UV in air and absorption within resist. • Add other dry etchants (listed in 3/30/12 meeting). • Fix evaporate, CVD, sputter, oxidize, develop, polish dialog boxes to ask user for correct parameters, and write code to compute depth from these values. • Write time-cost-quality code for all operations. • Write online help text. • Produce videos, photos, text for “Learning” tab.