The Carolinas SMTA “New Component Technologies”. OVERVIEW. Component Trends 01005 LED PoP Printing Placement Reflow Rework Inspection. Component Trends. Component Trends. - The new smallest device is an 01005 -0.010” X 0.005” -0.4mm X 0.2mm -Just 1/4 the size of an 0201!.
-The new smallest device is an 01005
-0.010” X 0.005”
-0.4mm X 0.2mm
-Just 1/4 the size of an 0201!
Wall area W+LX2Xthickness
-PoP is not a problem
-LED’s must present flat
-01005 Component feeding
(1) Placement on the first tier
(3) Flux coating (second tier)
(4) Placement on the second tier (first chip)
(2) Mounted component height measurement
POP Placement Example
Component centering-Laser or Vision?
-The laser typically has approximately 3 x the pixels as a CCD or Digital camera.
-Laser is faster
-LED and 01005 use laser
-PoP use vision
Center of Nozzle
Light receiving elementsPlacement Process
“String Art”-The nozzle rotates the component through the laser finding the edge of the component by creating a shadow on the Laser Receiver. Based on the outline made by the String Art, the machine recognizes the difference between the nozzle location and component center, then adjusts the placement position.
Self Contained in Machine
How It Works
Correct for fiducials
Using the local fiducial function, the machine will check the solder paste position relative to the pad locations
Components are placed centered on the solder paste print, not the pads
Placement corrected for print offset
Example of Component Placement
Placement on PCB pads
Placement centered on solder paste print, not pads
Placement of component on misaligned stencil or stretched PCB
Placement centered on paste
→ Results are good up to about 0.1mm (half size of 01005), but neighboring pads can affect larger offsets
0201 ＆0402 chip
print 0.10 / placement 0
print 0.10 / placement 0.10
print 0.19 / placement 0.19
print 0.16 / placement 0
Comparison of Placement Offset
Results good even with larger offset
OPASS-offset placement after solder stenciling
-compensate for these problems.