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ITRS 2003 Front End Process ITRS Conference December 2, 2003 Hsinchu, Taiwan. Starting Materials: H. Huff, D. Meyers Surface Preparation: J. Butterbaugh, J. Barnett Thermal Films: C. Osburn, H. Huff FEOL Etch: G. Smith, Y. Kim Doping: L. Larson, D. Mercer

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Presentation Transcript
fep technology working groups
Starting Materials: H. Huff, D. Meyers

Surface Preparation: J. Butterbaugh, J. Barnett

Thermal Films: C. Osburn, H. Huff

FEOL Etch: G. Smith, Y. Kim

Doping: L. Larson, D. Mercer

DRAM Trench Capacitor: Europe FEP, B. Vollmer, M. Gutsche

DRAM Stack Capacitor: Japan FEP, M. Kubota, K. Kaneda

Flash Memory: M. Alessandri, (Eur)H.K Kang (S. Kor

FeRAM: Japan FEP, M. Kubota

FEP Technology Working Groups
fep the grand challenges
Introduction of many new materials into the CMOS Logic and DRAM process flows (2003-2007)

High k gate dielectric layers

Dual metal gates

New DRAM storage capacitor structures and materials

New substrate materials such as SOI and strained silicon

Alternate memory devices and materials, e.g. MRAM, FeRAM

Beyond 2007, the probable introduction and CMOS integration of non-standard, dual-gate MOSFET’s e.g. FINFET

FEP- The Grand Challenges
mosfet scaling one scenario
2003-2007- Enhanced bulk devices

Strained silicon channels

Dual work function metal gates (for p-MOS and N-MOS

High-k gate dielectric

2008-2011- Planar fully depleted SOI

Incorporate bulk enhancements

Silicon film thickness ~0.4 Lgate

Elevated contacts

2012-2018- Fully Depleted Double Gate

MOSFET Scaling- One scenario
bulk scaling challenges year 2003 7
Bulk Scaling Challenges- Year 2003-7

2 metals replace dual doped poly

High-k replaces Silicon Oxynitride

NiSi replaces CoSi2

Strained Si:Ge replaces Si

1/2X every 4-6 years

Drain extension Rs problems

Metal/Silicon Contact Rs problems

Gate Length Scaling and 10% 3 CD Control !!!!!

fd soi scaling challenges 2008 2011
FD SOI Scaling Challenges 2008-2011
  • Challenges:
  • Dual metal gate integration
  • CD Control (10% 3)
  • Spacer integrity
  • Silicide/Si contact Rs
  • Active Layer t control
  • Hi-k integration
  • Zero Damage Cleaning
  • Box layer t control
  • Drain extension Rs and gate drain overlap
  • Epi-Bulk interface contamination

Dual metal gates (nMOS, pMOS)

Contact NiSi

Sidewall spacer

High-k Dielectric

Epi Elevated Contact

Box Layer

Strained Silicon Active Layer

Active layer thickness ~0.4 Lgate, must scale with gate length

double or tri gate device scaling 2011 2018
Double- or Tri-Gate Device Scaling 2011-2018

Silicon Fin Channel

Metal Gates 1 & 2

1

2

Source

Drain

Gate Dielectric Layer (not shown)

Buried Oxide Layer

= High N doping

= Light P doping

slide8

FIN FET Challenges

  • Challenges:
  • Gate CD Control
  • Metal Gate Integration
  • Fin Thickness control
  • Drain Extension parasitic resistance
  • Silicon/Silicide contact Resistance
  • Sidewall spacer integrity
  • High-k gate dielectric integration
  • Zero damage cleaning

Drain Extensions

Gate 1

Drain

Source

Gate 2

Sidewall Spacers

Hi-k Gate Dielectric Layers

Fin Thickness ~0.8 Lgate, must scale with gate length scaling

starting materials near term issues challenges
Production Ramp of SOI substrates-

Production capacity & capability

Metrology capability

New Substrate Materials Likely-

Strained silicon on bulk

Strained silicon on SOI

May be a family of products

Site Flatness (FEP Difficult Challenge)

Difficult to achieve

Wafer/chuck interactions add to overall non-flatness

Wafer/Chuck interactions poorly understood

Starting Materials, Near- Term Issues & Challenges
fep surface preparation
Near-tem red wall

FEP surface cleaning with very low silicon loss

FEP surface cleaning with very low silicon oxide loss

Cleaning process for newly introduced materials

High-k gate dielectric material(s)

Dual work function metal gates

DRAM High-k capacitor dielectric materials

Strained silicon

Cleaning of high aspect ratio structures

Stacked and Trench capacitors

Vias

Fragile structures limit cleaning options

FEP Surface Preparation
fep surface preparation near term red wall
FEP Surface-Preparation, Near-Term Red Wall

Note: Loss is defined as the average lost per pass, experienced after multiple cleaning passes: e.g. 0.2 Angstrom loss/pass is equivalent to 2 Angstrom loss after 10 cleaning passes

Dry strip and clean processes more complex process flows with more cleans, combined with more shallow structures combine to mandate low substrate loss cleaning processes

front end etch
10% 3 control of Gate Length represents a significant near term challenge

Lithography variances contribute to overall variance

Resist & Trim variances also contribute

Near Term work-arounds are assume to exist

Design for greater variance

Accept lesser binning yields

Front-End Etch
etch challenges
Etch Challenges

Work-arounds exist

fep thermal films
Most challenging issue remains the introduction of High-k gate dielectric layers

Candidate materials are emerging but none are free of major disadvantages

Interface states at channel and at polysilicon gate electrode

Poor charge carrier mobility

Threshold voltage shifts

CMOS integration challenges

High-k gate dielectric layers require introduction before 2007 for low standby power MOSFETS

Lowered gate leakage allowance (vs 2001 ITRS) for HP drives need High-k gate dielectric in 2007

Gate leakage for Low Standby Power Devices drives need for high-k gate dielectric in 2006

Gate Dielectric Layer Thickness control is emerging as an important challenge

STI added for 2003 Roadmap

FEP Thermal/Films
fep doping
Major challenges continue to surround the achievement of ultra-shallow, abrupt, highly activated drain extensions.

Drives innovation in ion implantation processes & equipments

Drives R&D for very rapid activation processes

Attempts at more sophisticated model-based forecasting of Source/Drain requirements have not yet yielded conclusive results

S/D requirements highly interactive with overall transistor design

S/D requirements for bulk devices are different from SOI and future non-planar double gate devices

Drain Extension requirements are listed as target values

Modeling of polysilicon gate depletion suggest that metal gates have potential to significantly extend the life of SiON gate dielectric materials

FEP/Doping
hp logic metal gate delays need for high k gate dielectric
HP Logic, Metal Gate Delays Need for High-k Gate Dielectric

Modeling done by H. Gossmann, Axcelis Technologies Inc.

dram stacked capacitor
Chip Size Model modified, based on survey of DRAM manufacturers

Storage cell area increased from prior ITRS

DRAM peripheral area decreased from prior ITRS

Need for very high-k storage capacitor dielectric materials (e.g. BST) delayed beyond 2009

Aluminum Oxide, Aluminates (e.g. HfAlOx) and Tantalum oxide remain capacitor materials of consideration for the 2003-9 time period

Capacitor structure migrates from MIS to MIM in order to avoid challenges regarding capacitor dielectric thickness

Total interlevel metal +dielectric (except storage node) is assumed to be 1.08nm at the 180nm node, and to decrease at a rate of 10% every three years.

Storage node heights, dielectric constants of high-k materials, and capacitor structures (cylinder, etc) remain unchanged from prior roadmaps

DRAM Stacked Capacitor