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News from IceMOS. Alessandro Mapelli CERN PH-DT. frame. baseline. Schedule update December 3 rd. today. Done.. First wafers sent to CERN. Bulk Si vs SOI flows. Silicon Etching. Etch measurements from the first 9 bulk silicon wafers. Channels etch 70um +/- 7um.

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news from icemos
News from IceMOS

Alessandro Mapelli

CERN PH-DT

frame

baseline

GTK Collaboration meeting

schedule update december 3 rd
Schedule update December 3rd

today

Done.. First wafers sent to CERN

GTK Collaboration meeting

bulk si vs soi flows
Bulk Si vs SOI flows

GTK Collaboration meeting

silicon etching
Silicon Etching
  • Etch measurements from the first 9 bulk silicon wafers

Channels etch 70um +/- 7um

Manifolds etch – total depth 285um +/- 25um

IceMOS CONFIDENTIAL

GTK Collaboration meeting

silicon etching1
Silicon Etching

IceMOS CONFIDENTIAL

GTK Collaboration meeting

first wafers have been shipped
First wafers have been shipped..
  • 3 bulk silicon wafers have been shipped on December 10th from IceMOS to CERN.
  • These wafers will be used to validate the last step of the fabrication process at EPFL with wafers from IceMOS.
  • It consists of the silicon etching with KOH to thin the acceptance area of the cooling plate.

GTK Collaboration meeting

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