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News from IceMOS. Alessandro Mapelli CERN PH-DT. frame. baseline. Schedule update December 3 rd. today. Done.. First wafers sent to CERN. Bulk Si vs SOI flows. Silicon Etching. Etch measurements from the first 9 bulk silicon wafers. Channels etch 70um +/- 7um.

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news from icemos
News from IceMOS

Alessandro Mapelli




GTK Collaboration meeting

schedule update december 3 rd
Schedule update December 3rd


Done.. First wafers sent to CERN

GTK Collaboration meeting

bulk si vs soi flows
Bulk Si vs SOI flows

GTK Collaboration meeting

silicon etching
Silicon Etching
  • Etch measurements from the first 9 bulk silicon wafers

Channels etch 70um +/- 7um

Manifolds etch – total depth 285um +/- 25um


GTK Collaboration meeting

silicon etching1
Silicon Etching


GTK Collaboration meeting

first wafers have been shipped
First wafers have been shipped..
  • 3 bulk silicon wafers have been shipped on December 10th from IceMOS to CERN.
  • These wafers will be used to validate the last step of the fabrication process at EPFL with wafers from IceMOS.
  • It consists of the silicon etching with KOH to thin the acceptance area of the cooling plate.

GTK Collaboration meeting