EE 587 SoC Design & Test. Partha Pande School of EECS Washington State University email@example.com. BOUNDARY SCAN. Motivation for Standard. Bed-of-nails printed circuit board tester gone We put components on both sides of PCB & replaced DIPs with flat packs to reduce inductance
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School of EECS
Washington State University
Get snapshot of normal chip input/output signals
Put data on bound. scan chain before next instr.