IST Workprogramme 2000

1. IST Workprogramme 2000 Microelectronics Optoelectronics Patrick.Van-hove@cec.eu.int European Commission INFSO E6

2. Organisation & Integration KA1Systems & services for the citizen KA3Multimediacontent & tools KA2 New methods of work & Electronic Commerce Cross Programme Themes KA4Essential technologies & infrastructure Research networking Future & emerging technologies

3. KAIV: Strategic Focus & Architecture Software, Systems & Services Nuts and Bolts of the e-Economy Simulation, Visualisation & Interfaces Computing, Communications & Networking Mobile & Satellite Communications & Systems Microsystems, Subsystems & Peripherals Micro- & Opto-electronics

4. KAIV: Main highlights • Strengthening infrastructure convergence • IP/Mobile/fixed • Broadcasting and communications • Higher visibility to networked embedded devices, and related architectures • Embedded devices, Software, real-time systems • Highlighting open source software and open systems • Includes a comprehensive range of take-up measures • Two-phase perspective • Integration in short to medium term • Higher performance and adaptivity in longer term

5. KAIV Micro- and Optoelectronics Connectivity Mobility Interactivity + + Info appliances CommunicationSystems (optoE) Applications System on Chip Focus:

6. 2000 Calls 4&5: Micro- and Opto- Call 5 Call 4 • Microelectronics - Optoelectronics • IST 2000 - IV.8.1(R&D) Microelectronics Design and Test • IST 2000 - IV.8.2(R&D) Application-Specific Microelectronics • IST 2000 - IV.8.3(R&D) Industrial µelectronics technologies: processes, equipment and materials • IST 2000 - IV.8.4 (R&D) Opto-electronic technologies • IST 2000 - IV.8.5 (R&D) Advanced micro and opto-electronics • IST 2000 - IV.8.6 (Take-up) µelectronics design and test. • IST 2000 - IV.8.7 (Take-up) Application Specific micro-electronics. • IST 2000 - IV.8.8 (Take-up) Industrial µelectronics technologies • IST 2000 - IV.8.9 (Take-up) Research training in microelectronics: Accompanying Measures

7. AL IV.8.4 Optoelectronic Technologies • Focus: Materials, devices and modules for: • High-speed routing • Data processing • Interconnections • Sensing • Application Areas: • Photonic networks (low-cost broad-band to-the-home applications) • Information and Communication Terminals

8. AL IV.8.5 Advanced Micro- and Opto-electronics: RTD (1) • Advanced processes, materials and devices • based on compound semiconductors and on SOI • very high frequency and low power communication • high power communication applications. • Cost/benefit vs Si and Si/SiGe for industrial use E.g. GaAs (and metamorphic compound), SiC, GaN and SOI. large bandwidth or local loop transmission. base stations and power amplifiers

9. AL IV.8.5 Advanced Micro- and Opto-electronics: RTD (2) • Very innovative • materials • processes • components for micro- and opto-electronics industries. new substrates, gate insulators for future devices new device principles for micro-electronics applications

10. EURACCESS: R&D Enabler CMOS <.1μm SCIENTIFIC ADVISORY BOARD Roadmap Projects stimulation / coordination INDUSTRIAL ADVISORY BOARD Orientation ORGANIZATION COMMITTEE Labs support organization,.... Lighter is better WAFER WEB LAB LAB LAB LAB LAB

11. 300mm E U R A C C E S S 300mm 300mm 450mm EURACCESS and ITRS Roadmap 98 99 00 01 02 03 04 05 06 07 08 09 10 year nm Isolated lines (MPU gates) Year of 1st product shipment 130 100 70 50 35 Integration Pilot Volume Production 200mm Modules Basic steps Volume Production Integration Pilot Advanced research Modules Basic steps Integration Pilot Volume Production Advanced research Integration Pilot Modules Basic steps Volume Production Precompetitive Advanced research Integration Pilot Volume Product Modules Basic steps Precompetitive

12. AL IV.8.5 Advanced Micro- and Opto-electronics: RTD (3) • Integration of opto- and micro- technologies (homogeneous and heterogeneous) • ultra-compact ICT components • synergy with basic CMOS processes • light emission, • photo-detection, • interconnection. Integration of compound semiconductor optical functions (emission, detection) on CMOS circuits Integration of passive optical components, Integration of MUX-DEMUX components;

13. Evaluation in IST for R&D projects CriteriaWeight(1)Threshold(2) Scientific/Technological Qualityand innovation 4>= 3 Community Added Valueand contribution to EU policy 1>= 2 Contribution to Comm. Social objectives 1- Economic Dev; S&T prospects(range of applications, exploitation, strategic impact, dissemination)2>= 3 Resources, Partnership, Management 2>= 2 1) Weight on a scale of 10 (sum 10) 2) Threshold with respect to score 0-5

14. “Take-up” Transfer toUser industry Assessment greater efficiency Best Practice Trials RTD Technology Transfer Commercial Phase “T a k e - u p” time leading-edge and established methods and technologies

15. “Take-up” types User-SupplierCooperation • Trials: • evaluation of promising, yet not fullyestablished technologies & solutions • Best practice actions: • promote take-up of well established technologies & methods • Assessments: • evaluation of innovative products User-led User-SupplierCooperation

16. AL IV.8.6 Microelectronics design and test - take-up measures • Focus: a) For tools:All areas of microelectronics design and test b) For methods:1. collaborative design 2. reuse of Intellectual Property (IP blocks). • Action types: Trials

17. “Take-up” types • Trials: • evaluation of promising, yet not fullyestablished technologies & solutions • Best practice actions: • promote take-up of well established technologies & methods • Assessments: • evaluation of innovative products

18. General Explanation of Trials (1) • Objective: To timely pass the barriers to successful exploitation of new technologies • Adaptation and introduction of leading edge technology in industrial/service applications • The technology must be promising, but not yet be established or commercially available (typically: prototype method or tool). • Commitment for dissemination of the experience to other organisations across Europe

19. General Explanation of Trials (2) • Participants: At least one (industrial) technology user and one (industrial) supplier • The technology is used in a real case within the user organisation • The technology is adapted (by the supplier) to users’ needs, leading to progress beyond the state of the art. • User-supplier cooperation for joint evaluation of technological and economic benefits is essential

20. Funding Rules for Trials and Best Practice • Up to 100 %: • Personnel, Co-ordination Costs and other Specific Costs • Up to 50%: • Subcontracting, Travel and Subsistence, Consumables, Computing and Durable equipment costs. • No contribution: • IPR costs and Overheads.

21. Evaluation in IST for Trial proposals CriteriaWeight(1)Threshold(2) Scientific/Technological Qualityand innovation 3 - Community Added Valueand contribution to EU policy 1>= 2 Contribution to Comm. Social objectives 1- Economic Dev; S&T prospects(range of applications, exploitation, strategic impact, dissemination)3>= 3 Resources, Partnership, Management 2>= 3 1) Weight on a scale of 10 (sum 10) 2) Threshold with respect to score 0-5

22. AL IV.8.7 Application-Specific Microelectronics and Optoelectronics • Objectives: • Promote adoption of EXISTING Microelectronics and Optoelectronics Technologies • Improve EXISTING Products or Services • Focus: • New Communication Capabilities • Improved User Interfaces ASICs, FPGAs, reconfigurable devices and micro-controllers Enhance Capabilities, Enhance Economy

23. “Take-up” types • Trials: • evaluation of promising, yet not fullyestablished technologies & solutions • Best practice actions: • promote take-up of well established technologies & methods • Assessments: • evaluation of innovative products

24. Example: FUSE, FUSE ABC Training 220 Demonstrators 130 Replications 471 AEs 1973 Proposals 2,299 workplans 3,215 Company visits 8,489 Attendees at Events 14,629 Contacts and Mailings

25. FUSE Demonstrator Example

26. Example: FUSE, FUSE ABC

27. AL IV.8.7 Application-Specific Microelectronics and Optoelectronics • Targeted Actions: Focus • Functionality • Technology • Industry Sector • Projects with 5-20 Users • Quality of Proposals • European Dimension

28. AL IV.8.7 Application-Specific Microelectronics and Optoelectronics Take-Up Proposal Replication Dissemination ExpertiseCentres Users

29. Evaluation in IST for Best-Practice proposals CriteriaWeight(1)Threshold(2) Scientific/Technological Qualityand innovation 2>= 3 Community Added Valueand contribution to EU policy 1>= 2 Contribution to Comm. Social objectives 2- Economic Dev; S&T prospects(range of applications, exploitation, strategic impact, dissemination)3>= 3 Resources, Partnership, Management 2>= 3 1) Weight on a scale of 10 (sum 10) 2) Threshold with respect to score 0-5

30. IV.8.8 Ind. microelectronics technologies:Assessment Actions • Semiconductor Equipment Assessment (SEA):Stimulate rapid take-up of advanced prototype equipment by the semiconductor industry. • User driven assessment of advanced prototype equipment, related OEM components and materialsfor semiconductor manufacture. • Facility level equipment is not included. Bridges the gap: R&D to manufacturing requirements (reliability, repeatability, cleanliness, productivity, process parameters). Market analysis, initial and final specsAt least 2 industrial assessors.

31. “Take-up” types • Trials: • evaluation of promising, yet not fullyestablished technologies & solutions • Best practice actions: • promote take-up of well established technologies & methods • Assessments: • evaluation of innovative products

32. IV.8.8 Ind. microelectronics technologies:Assessment Actions (i,ii) • (i) Assess beta type equipment • close to production conditions • create reference centres at user sites. Prototype equipment, materials for novel processes, architectures plus support (e.g cleaning, metrology). No design or assemblywork under SEA! • (ii) Early proof of innovative process concepts (PoC) • adapting state-of-the-art equipment New processes tested on state-of-the-art equipmentAt least 1 industrial user must be involved ; E&M suppliers access to capabilities of Res. and Indus. Equipment costs are not supported.

33. IV.8.8 Ind. microelectronics technologies:Assessment Actions (iii) • (iii) Early proof of concept (PoC) for alpha type 300 mm equipment. Early tests of 300mm alpha types At least 1 industrial user involved; Equipment cost not supported. For PoC (ii,iii) wafer, analytical, metrology services available SEA for Display Manufacturing called in IV.6.3 SEA for Subsystems, Micro-Systems called in IV.7.5 and IV.7.6

34. Evaluation in IST for Assessment proposals CriteriaWeight(1)Threshold(2) Scientific/Technological Qualityand innovation 4 - Community Added Valueand contribution to EU policy 1>= 2 Contribution to Comm. Social objectives 1- Economic Dev; S&T prospects(range of applications, exploitation, strategic impact, dissemination)2>= 3 Resources, Partnership, Management 2>= 4 1) Weight on a scale of 10 (sum 10) 2) Threshold with respect to score 0-5