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EE466: VLSI Design

This project aims to introduce research ideas in low swing signaling through reading and simulating circuits. Topics include crosstalk, performance metrics, and power dissipation metrics, comparing interface circuits like CLC and SSDLC. The goals are to simulate circuits, study crosstalk patterns, evaluate delays, and compute power dissipation. Milestones include reading material, designing interface circuits, and understanding wire parameter extraction. The project focuses on technology and reliability-constrained copper interconnects, analyzing performance implications and presenting a report with relevant metrics by the final submission deadline.

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EE466: VLSI Design

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  1. EE466: VLSI Design 2009 Term Project

  2. Expectation • To introduce you to basic research ideas • Involves reading research paper • Extraction of relevant parameters • Simulation of circuits • Presentation of results

  3. Low Swing Signaling • Ideas • Low Swing Signaling • Reasons? • Crosstalk • Performance metrics • Power dissipation metrics

  4. Low Swing Signaling • Low Swing Interconnect Interface Circuits • Hui Zhang & Jan Rabaey • 2 Circuits to compare

  5. Basic Idea • Interface circuits

  6. Interfaces • Conventional Level Converter (CLC) • Reference • Symmetric Source-Follower Driver with Level Converter (SSDLC) • Level Converting Register (LCR)

  7. CLC • VddL is the low swing reference voltage • Uses static devices

  8. SSDLC • Swing is limited between Vtn and Vdd-Vtn

  9. LCR • REF voltage limits the swing

  10. Goals • Simulate Circuits • Consider a 3 wire bus • Apply similar interface circuits on neighbors • Study all crosstalk patterns • Evaluate average delay on victim • Evaluate worst case delay on victim • Compute power and energy dissipation • Present energy delay product metrics

  11. Milestones • Reading Material • Papers for reading on website • Design of interface circuits • Understand wire parameter extraction • Reading material will be provided • Technology and Reliability Constrained Copper Interconnects Part II: Performance Implications • Study crosstalk effects • Present report with relevant metrics

  12. Deadlines • Final submission • Day of final exam

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