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WP9 ITS Mechanics and Cooling

WP9 ITS Mechanics and Cooling. 20 January 2014. Corrado Gargiulo . OUTLINE. ITS objectives for 2014 – WP9 Finalization of IB geometry (inputs from WP1 and WP2) and layout (with WP6 and WP10). Finalization of OB geometry (with inputs from WP1 and WP2) and layout (with WP7-WP8 and WP10).

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WP9 ITS Mechanics and Cooling

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  1. WP9 ITS Mechanics and Cooling 20 January 2014 Corrado Gargiulo

  2. OUTLINE ITS objectives for 2014 – WP9 Finalization of IB geometry (inputs from WP1 and WP2) and layout (with WP6 and WP10). Finalization of OB geometry (with inputs from WP1 and WP2) and layout (with WP7-WP8 and WP10). Development of all mechanical components for IB: Space Frame + Cold Plate (QM), end-wheel (QM), Cylindrical Structural Shell (QM) Development of first prototype of IB based on “pad chips” (joint project with WP6), dimensional survey and characterization (mechanical and thermal) Finalize design of all components for OB: Space-Frame + Cold Plate (QM), End Wheel (EM/mock-up), Conical Structural Shell (EM/mock-up), Cylindrical Structural Shell (EM/mock-up) Development of first prototype of OB stave based on “pad chips” (joint project with WP7 and WP8), dimensional survey and characterization (mechanical and thermal) Engineering design of Service Barrel Document on dimensional and position survey procedure (joint with WP6, WP7, WP8) Cooling system specifications document EM=EngineeringModule; QM=QualificationModule; FM= FinalModule

  3. Finalization of IB geometry (inputs from WP1 and WP2) and layout (with WP6 and WP10). Finalization of OB geometry (with inputs from WP1 and WP2) and layout (with WP7-WP8 and WP10). • To be defined soon • BP radius* OR=18mm Vs 19.8mm (WP1,WP2 and MFT) • Layer 0 radius Distance from BP wall • Middle Layer radius Material budget • Stave width Chip size i.e. Layer 0 radius, FPC layout • Stave length Layer radius, Power regulator • Stave overlap Chip dead zone *Wednesday 22°: meeting with MFT – Gines Martinez, Stephane Bouvier (convener WG5), Jean Michel (convener of WG7),… to verify layout and installationconstraintthatdefine MFT disk innerradius i.e. beam pipe outerradius; discussion on the outcome in the WP9 meeting in the afternoon

  4. 1. Finalization of IB and OB geometry

  5. Development of all mechanical components for IB: Space Frame&ColdPlate (QM), End-wheel (QM), Cylindrical Structural Shell (QM) • Planned activities • Space Frame&Cold Plate • -SF&CP construction: evaluate replacement of Carbon fleece with K13D2U (45µm), test • -SF&CP Polyimide pipes: continue erosion test • - SF&CP Connectors: define production process & material; peek (standard machining) Vs Accura Bluestone (3D print), test • - SF&CP alternative options micro-channels: proposal to be finalized and decision to be taken soon • - SF&CP + HIC: perform assembly to finalize design, test • End-Wheels: • -EW geometry: needs definition of layer radius, stave width, stave length • -EW openings for services: needs definition of FPC/cable and Cooling pipes routing/modularity • -EW I/F: perform assembly with SF&CP to finalize design • Cylindrical Support Shell: • - CYSS geometry: develop I/F with EW and with the Cage and Service Barrel • - CYSS design: needs structural verification, FEA

  6. 2. Development of all mechanical components for IB SP&CP EW CYSS

  7. Development of first prototype of IB based on “pad chips” (joint project with WP6), dimensional survey and characterization (mechanical and thermal) • Planned activities • Production of 24 staves (Half Barrel), 48 connectors, 6 end-wheels, 48 inserts, 1 CYSS, + spares: needs design definition (QM) and new moulds production • Definition of assembly procedure for stave (SF&CP+HIC(FPC+Chip)), layers, half-barrel: needs procedure validation on EM, • Production of new jigs for assembly • Production of first prototype of IB stave with HIC (dummy), test

  8. Finalize design of all components for OB: Space-Frame + Cold Plate (QM), End Wheel (EM/mock-up), Conical Structural Shell (EM/mock-up), Cylindrical Structural Shell (EM/mock-up) • Planned activities • Space Frame design • - SF construction: evaluate baseline (n.3 Layer of M55J) Vs (n.2 layers M55j+n.2 layers K13D2U), test • - SF connector: finalize design; define production process & material: peek (standard machining) Vs Accura Bluestone (3D print); test • Cold plate: • -CP construction: evaluate baseline (pipe ID 2.67mm) Vs (pipe ID 2.0mm). • evaluate baseline (Carbon fleece) Vs (K13D2U), test • -CP connector: finalize design; define production process & material: peek (standard machining) Vs Accura Bluestone (3D print); test • - CP alternative options: proposal to be finalized and decision to be taken soon • Module Plate • -Decide on its removal from the design: needs consideration on rework and assembly • Stave: • - CP + FPC (dummy) + PB (dummy), perform assembly to finalize design; test • End-wheel: • -EW geometry, needs definition of layer radius, stave width, stave length • -EW openings for services, needs definition of FPC-cable and Cooling pipes routing • -EW+SF&CP, perform assembly to finalize design • COSS: Layer radius, Structural analysis, target for metrology • CYSS: Structural Analysis, Cage I/F, metrology

  9. 4. Finalize design of all components for OB M55j (embed K13D2U stiffer) SF CP EW EW CYSS EW CYSS C0SS

  10. 4. Finalize design of all components for OB Air Cooling Study (USA) Cold Plate alternative options • Reduced power load may allow air cooling • Aim is to fit within current envelope of Cold Plate • Use Graphitic Foam to improve effective HTC of air flow; minimizes mass flow required • Unsure of DP • Measure Darcy constants for various porosity foam (pressure drop scaling) • Samples on order or on-hand of various pore-sizes • Commercial contract issued, expect results in Feb • Prepare Thermal Samples to determine effective HTC • Pressure drop test used to select porosity of foam for test • Build geometrically similar samples for heat load testing • Goal to make decision whether to proceed to full scale by April Joseph Rasson • CO2 Study (NL) • https://indico.cern.ch/conferenceDisplay.py?confId=259712 Paul Kuijer

  11. Development of first prototype of OB stave based on “pad chips” (joint project with WP7 and WP8), dimensional survey and characterization (mechanical and thermal) • Planned activities • Production of 1 SF, 2 CP, 76 U-legs, 2 SF-connectors, 4 CP-connectors: needs design definition and new moulds, need assembly jigs for connectors and U-legs gluing. • Production of jigs for characterization (bending test,…) • Definition of assembly procedure for OB stave (SF+2CP(Pbus+FPC+Chip)), needs procedure validation on EM, alignment strategy • Production of new jigs for assembly

  12. Engineering design of Service Barrel • Planned activities • Finalize Design of I/F with Detector Barrel • Finalize Design of I/F with Cage • Design of Services routing, needs definition of cables and pipes layout • Design Verification by structural analysis Service Barrel

  13. Document on dimensional and position survey procedure (joint with WP6, WP7, WP8) • Planned activities • Define requirements for dimensional accuracy and stability • Develop dimensional control strategy during assembly • Develop position survey strategy during installation Cooling system specifications document Planned activities • Definespecification for the on-detector cooling, up to Service Barrel • Definespecification for Plant and manifold TBD

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