Download
slide1 n.
Skip this Video
Loading SlideShow in 5 Seconds..
Background: PowerPoint Presentation
Download Presentation
Background:

Background:

200 Views Download Presentation
Download Presentation

Background:

- - - - - - - - - - - - - - - - - - - - - - - - - - - E N D - - - - - - - - - - - - - - - - - - - - - - - - - - -
Presentation Transcript

  1. a b (a) CMM solder joints for fracture tests c (c) The effects of different parameters on fracture properties of solder joints (b) Illustration of set-up for high strain-rate mixed-mode fracture test d (d) Mode I fracture mechanism map for Sn-3.8Ag-0.7Cu/Cu joints Fracture Properties of Lead Free Solder Joints under Dynamic Loading ConditionsIndranath Dutta, Washington State University, DMR 0939392 • Background: • Solder joints are a critical part of microelectronic packages (e.g., Intel Core DuoTM) • Cracks form in solder joints during service • When a mobile device (such as a laptop, phone or PDA) is dropped, existing cracks propagate → the drop thus acts as a dynamic fracture test → serious reliability issue • Key Findings: • Methodology was developed for mixed mode fracture testing of solder joints under drop condition • Parameters affecting fracture properties of solder joints were studied systematically • Fracture Mechanism Maps were constructed - maps enable prediction of solder joint reliability under drop conditions without doing any testing- maps and methodology have been transferred to Intel Corp. and Semiconductor Research Corporation (SRC) • [1] Z. Huang, P. Kumar, I. Dutta, J. H. L. Pang, R. Sidhu, M. Renavikar and R. Mahajan “Fracture of Sn-Ag-Cu solder joints on Cu substrates: I. Effects of loading and processing conditions”, J. Electron. Mater., 41, pp. 375-389, 2012. • [2] P. Kumar, Z. Huang, I. Dutta, R. Sidhu, M. Renavikar and R. Mahajan, “Fracture of Sn-Ag-Cu solder joints on Cu substrates: II. Fracture Mechanism Map”, J. Electron. Mater., 41, pp. 412-424, 2012.

  2. Fracture Properties of Lead Free Solder Joints under Dynamic Loading ConditionsIndranath Dutta, Washington State University, DMR 0939392University), • TRAINING • 2 graduate students (Babak Talebanpour and Zhe Huang) are participating • 1 post-doctoral associate (Dr.Uttara Sahaym) is participating • OUTREACH • Undergraduate student Sean Seekins from the University of Maine participated Research Experience for Undergraduate students (REU) project in May-July 2012. Mr. Seekins was trained on metallographic sample preparation, SEM, EBSD and statistical analysis of solder microstructures. • Pullman High School student Dongyang Chen interned at Professor Dutta’s lab from Jun 2011 to Aug 2011. He was trained on metallographic sample preparation, SEM, operating vacuum system and statistical analysis of solder microstructures. Undergraduate student Sean Seekins is doing EBSD to characterize the solder microstructure. High School student Dongyang Chen is polishing metallographic samples of lead-free solder