MASTER OF TECHNOLOGY

1. M.TECH.VLSIENGINEERINGSYLLABUS SESSION 2013-14 -

2. LISTOFELLECTIVES 1MVL4:Elective-I 1MVL4.1LowPowerVLSIDesign 1MVL4.2Micro-Electro-Mechanical-Systems(MEMS) 1MVL4.3Microelectronics 2MVL4:Elective-I 2MVL4.1HighLevelSystemDesign&Modeling 2MVL4.2FPGABasedSystemDesign 2MVL4.3BiomedicalElectronics 3MVL2:Elective-I 3MVL2.1VLSITesting&Testability 3MVL2.2Nanoelectronics • FIRSTYEARDETAILEDSYLLABUS • SemesterI • 1MVL1: ADVANCEDMATHEMATICS • Optimization problem-Convex sets and functions, The SIMPLEX Algorithm- Forms of linear programmingproblem, geometryoflinearprogramming,OrganizationofTableau, Computationalconsiderationsfor SIMPLEX Algorithm, • Duality: Dual of linear programming, dual simplex problem, Primal-dual algorithm, Algorithms andComplexity-shortestpath,max-flow,Dijkstra’salgorithm,min-costflow,algorithmfor graph, search and matching,spanning trees and matroids, Integer Linear programming, Greedy algorithm,approximationalgorithms,branch-and-bound,dynamicprogramming. • ReferenceBooks: • Numericalmethodsinengineering&sc. byB.S.Grewal • Numericalmethods forengineering&sc.byIyengar &M.K. Jain • AdvancedMathematicsforEngineersbyChandrikaPrasad

3. 1MVL2:VLSIDESIGN • Basicoperationof CMOSinverter,detailedanalysisofitsnoisemarginpropagationdelay, power dissipation concept of layout & area, layout optimization & area estimation for a single as well ascombinationallogiccircuits. • Design of sequential logic circuits: Static & dynamic latches registers, dynamic transmission gate, CMOS gate, pipelining approach for optimize sequential circuits, NDRA-CMOS pipelined structure, non bi-stable sequential circuits, Schmitt trigger, Implementation strategies for digital ICs,introductionofcustomandcircuit design,hierarchycellbaseddesign arraybased implementation, building blocksofadder,multiplier, shifter, barrelshifter, algorithmic shifter and other arithmetic operators, power speed tradeoff in data path structure, Design memory & arraystructure memoryarchitectures&buildingblocks,addressdecoder,senseamplifiers, driver/buffers, timingcontrol,powerdissipationinmemories, ideaoftestabilityandfault detection models. • ReferenceBooks: • CMOSDigitalIntegratedCircuitsAnalysis,Sung-Mo(Steve)Kang,TMH • EssentialsOfVLSI CircuitsAndSystems,KamranEshraghian,Eshraghian,PHI • IntroductionToVLSI CircuitsAndSystems,John P.Uyemura,John Wiley& Sons • Modern VLSIDesign,Wayne Wolf, Pearson • PrinciplesOfCMOSVLSIDesign,NeilH.E.Weste,Pearson • CMOSLogic CircuitDesign,Uyemura, John P., Springer • VLSIDesign,Shanthi,A.Kavitha,A.,New AgeInternational • VLSIDesignAndTechnology,Bose,D.N.,NewAgeInternational • 1MVL3:DIGITALSYSTEMDESIGN • SequentialLogicDesign:Introduction,BasicBi-stable MemoryDevices,reduced characteristicsandexcitationtable for bi-stabledevices. • Synchronous Sequential Logic Circuit Design: Introduction, Moore, Mealy and Mixed type SynchronousState Machines,Synchronoussequentialdesign ofMoore, MealyMachines, SynchronousCounterDesign,Hazards,Dualityofsequentialcircuits,Differentmethodsof minimization. • Asynchronous Sequential logic design:Introduction, Primitive flow table and reduction, type ofdelays,Cyclesandraces,ExcitationMap,Hazards,Essentialhazards,Analysisof asynchronous sequentialcircuits. • Symmetric and Iterative circuits: Symmetric functions, iterative functions, realization in tree form, Algorithmic State Machine: An Algorithm with inputs, digital solution, Implementation of traffic lightcontroller,ASM charts,DesignProcedure forASMs. • Introductiontoprogrammablelogicdevices:PALs,PLDs,CPLDsandFPGAs. • Introduction to VHDL: Data types, Concurrent statements, sequential statements, behavioral modeling.

4. ReferenceBooks: • M.MorrisMano,“DigitalDesign”,3rdedition,PearsonEducation. • CharlesH.Roth,Jr.“FundamentalsofLogicDesign”,4thEdition,JaicoPublishing House • DonaldD.Givone,“DigitalPrinciplesandDesign”,TataMcGraw-Hill. • CMOSLogic CircuitDesign,Uyemura, John P., Springer • VLSIDesign,Shanthi,A.Kavitha,A.,New AgeInternational • VLSIDesignAndTechnology,Bose,D.N.,NewAgeInternational • 1MVL4.1: LOW POWERVLSIDESIGN • Introduction:NeedforlowpowerVLSIchips,SourcesofpowerdissipationonDigital Integratedcircuits,EmergingLowpowerapproaches,PhysicsofpowerdissipationinCMOS devices,Device&technologyimpactonlowpowerDynamicdissipationinCMOS,Transistor sizing&gate oxidethickness,ImpactoftechnologyScaling,Technology&Deviceinnovation. SimulationPoweranalysis:SPICEcircuitsimulators,gatelevellogicsimulation,capacitive powerestimation,staticstatepower,gatelevelcapacitanceestimation,architecturelevel analysis, data correlationanalysisinDSPsystems,Monte Carlosimulation. • Probabilistic poweranalysis:Randomlogicsignals, probability&frequency,probabilistic power analysistechniques,signalentropy. • LowPowerDesignCircuitlevel:Powerconsumptionincircuits.FlipFlops&Latchesdesign, highcapacitance nodes, low power digitalcellslibrary. • Logiclevel:Gatereorganization,signalgating,logicencoding,statemachineencoding,pre computation logic. • Low power Architecture & Systems: Power & performance management, switching activity reduction, parallel architecture with voltage reduction, flow graph transformation, low power arithmetic components,low power memorydesign. • LowpowerClockDistribution:Powerdissipationinclockdistribution,singledriverVs distributedbuffers,ZeroskewVstolerableskew,chipandpackageco-designofclocknetwork. Algorithmandarchitecturallevelmethodologies:Introduction,designflow,algorithmiclevel analysisandoptimization,Architecturallevelestimationandsynthesis. • ReferenceBooks: • SemiconductorDevices:ModellingandTechnology,NanditaDasgupta,AmitavaDasgupta, PHI • FundamentalsofSemiconductorFabrication,GaryS.May,S.M.Sze,JohnWiley& Sons • SemiconductorDevices:PhysicsAndTechnology,SimonM.Sze,JohnWiley& Sons • IntroductionToSystemDesignUsingIntegratedCircuits,Sonde,B.S.,NewAgeInternational • Micro-Nano-fabricationtechnologiesAndApplications,Cui,Zheng,Springer.

5. 1MVL4.2:MICRO-ELECTRO-MECHANICAL-SYSTEMS(MEMS) • Micro electro mechanical system (MEMS) origins, MEMS impetus/ motivation, Material for MEMS,Thetoolbox:processesformicromachining.MEMSfabricationtechnologies, Fundamentals MEMS device physics, Actuation, Fundamental MEMS devices, The cantilever beam. • MicrowaveMEMS applications: MEMswitchdesignconsiderations,Themicro-machined transmissionline,MEMS-basedmicrowave circuitandsystem. • ReferenceBooks: • MaxJ.Madou:“FundamentalsOfMicroFabrication”-Thescienceof miniaturization-, Nanogen corporation, USA, CRCpress. • SergeyEdwardLyshevski:“Nano-AndMicroElectroMechanicalSystems”–Secondedition, CRC press,Boca RatronLondon. • Sherif sedky:“IntegratedMEMS”-ArtechHouse,BostonLondon. • N.Maluf:IntroductionToMicroMechanicalSystemsEngineering,ArtechHouse. • Tai–RanHsu:“MemsAndMicroSystems:DesignAndManufacture”–TataMcGrawHill. • 1MVL4.3:MICROELECTRONICS • Introduction to semiconductor physics: Review of quantum mechanics, electrons in periodic lattices,E-kdiagrams,Quasi-particlesinsemiconductors,electrons,holesandphonons, Boltzmann transport equation and solution in the presence of low electric and magnetic fields - mobilityanddiffusivity;carrierstatistics; continuityequation, poisson'sequationandtheir solution, high field effects: velocity saturation, hot carriers, avalanche breakdown, punch through and kirkeffects. • Semiconductor junctions:Schottky,homo- andhetero-junction banddiagramsandI-V characteristics, small signal switching models; two terminal and surface states devices based on semiconductorjunctions,Bipolartransistorworking,itschargecontrol,andgummelpoon model,structureofgradedbase,gradedemittertransistor,hetrojunctiontransistor,MOS structures: Semiconductor surfaces; the ideal and non ideal MOS capacitor band diagrams and CVs, Effects of oxide charges, defects and interface states, characterization of MOS capacitors, HF and LF CVs, avalanche injection, high field effects and breakdown, Long & short channel effects. • ReferenceBooks: • AllenandHolberg,“CMOSAnalog CircuitDesign”,OxfordPublication. • PucknellandKamran,“CMOSVLSIDesign”, PHIPublication. • Perry, “VHDL”, TMHPublication. • WayneWolf,“ModernVLSI Design”,PearsonPublication

6. 1MVL5:VLSI PHYSICAL DESIGNLAB PARTA DrawtheLayout,docircuitpartitioning,placementandrouting,circuitcompaction,checkDRC , Circuit extraction and finally post layout simulation for different combinational and sequential circuits. PARTB Use the feature of automation test program generation, multilevel logic synthesis for design smaller application chips like multi bit parallel adder priority encoder, general purpose register, ALU,microcontroller/DSPprocessor/trafficlightcontroller/sequentialadder etc.

7. FIRSTYEARDETAILEDSYLLABUS • SemesterII • 2MVL1: DIGITALSIGNAL PROCESSING • DFT & its properties, Decimation in time and decimation in frequency FFT algorithms, discrete cosine transform, IIR Filter design: Butterworth design, bilinear transformation, Low Pass, High Pass, Band Pass and Band Stop digital filters. Spectral transformation of IIR filters, FIR filter design: Symmetric and anti symmetric linear phase, FIR filter by rectangular, triangular and Blackmanwindow functions. • Finite word length effects in FIR and IIR digital filters: Quantization, round off errors and overflowerrors. • Multi rate digital signal processing: Concepts, design of practical sampling rate converters, Decimators,interpolators, Polyphase decompositions. • ReferenceBooks: • DigitalSignalProcessing,SanjitK Mitra,TMH • DigitalSignalProcessing,S.SalivahananAVallavaraj,C.Gnanapriya,TMH • DigitalSignalProcessing:Principals,AlgorithmsAndApplications,JohnG.Proakis,Dimitris • G.Manolakis,PHI • DigitalSignalProcessing,A.V.Oppenheim AndR.W. Schaffer, PHI • DigitalSignalProcessing,Thomas J.Cavicchi,JohnWiley& Sons • DigitalSignalProcessing,EmmanuelIfeachor,BarryJervis,Pearson • Digital SignalProcessing, Chi-TsongChen,Oxford • DigitalSignalProcessing,Engelberg,Shlomo,Springer • DigitalSignalProcessingForMeasurement,DAntona,Gabriele,NewAgeInternational • 2MVL2:ANALOG&MIXEDSIGNALICs • ReviewofBJTandMOStransistoroperation,modelsandequivalentcircuits,single-stage amplifiers, differential amplifiers. Passive and active current mirrors: Cascade current mirror, Wilsoncurrentmirror,Mismatch&nonlinearity, Theory&designofMOSoperational amplifiers, complete CMOS operational amplifier including frequency compensation, stability, frequencyresponseandtransientresponse.Comparator& voltagereferencesources. • Switches capacitor circuits: Principles of operation of switches, capacitor circuits, switched capacitorfilters,D/A andA/D converter. • Nonlinearanalogcircuits:Timer,functiongenerators,multipliersandPLL. • Bi CMOS:Devices& technology,basic analog&digitalsubcircuits,inverters.

8. ReferenceBooks: • SemiconductorDevices:ModellingAndTechnology,NanditaDasgupta,AmitavaDasgupta, PHI • Fundamentals Of SemiconductorFabrication, GaryS.May, S.M.Sze,JohnWiley& Sons • SemiconductorDevices:PhysicsAndTechnology,SimonM.Sze,JohnWiley& Sons • IntroductionToSystemDesignUsingIntegratedCircuits,Sonde,B.S.,NewAgeInternational • Micro-NanofabricationtechnologiesAndApplications,Cui,Zheng,Springer. • 2MVL3:CADOFICs • Introductiontoconceptofdesign,designmethodologies,semi-customandcustomdesign Approaches, Datapath&controldesign,Elementsofdeviceandcircuitsimulation,logic simulation, Stick diagram and representation, layout of ICs, lambda based design rules, Deep submicron interconnects modeling and synthesis, Topics in design-yield and redundancy, low powerdesigntechniques. • ReferenceBooks: • GiovanniDeMicheli,SynthesisandOptimizationofDigitalCircuits,Tata McGrawHill. • S.H.Gerez,Algorithmsfor VLSIDesignAutomation,Wiley-India. • D.D Gajskietal.,HighLevelSynthesis:IntroductiontoChipandSystemDesign,Kluwer AcademicPublishers. • N.A.Sherwani,AlgorithmsforVLSIPhysicalDesignAutomation,KluwerAcademic Publisher. • M.SarrafzadehandC.K.Wong,anIntroductiontoVLSIPhysicalDesign,McGrawHill. • 2MVL4.1: HIGH LEVELSYSTEMDESIGN&MODELING • Systemleveldesign,descriptionlanguages-SDL,SpecChartetc,Architecturalsynthesisfor DSP applications, Formal Verification of digital systems- BDD based approaches, functional equivalence,finitestateautomata,ω-automata,FSMverification,Hardware-software partitioning,interface synthesis,case studies. • ReferenceBooks: • AbstractStateMachines:AMethodforHigh-LevelSystemDesignandAnalysis,Egon Boerger, RobertStaerk,Springer. • 2MVL4.2:FPGABASEDSYSTEMDESIGN • Evolution of programmable devices: Introduction to AND-OR structured Programmable Logic DevicesPROM,PLA,PAL andMPGAs,Combinationalandsequentialcircuitrealizationusing

9. PROMbasedProgrammableLogicElement(PLE),ArchitectureofFPAD,FPLA,FPLSand FPIDdevices. • FPGATechnology:FPGAresources-LogicBlocksandInterconnectionResources,Economics andapplicationsof FPGAs,ImplementationProcessfor FPGAsProgramming Technologies- Static RAMProgramming,AntiFuse Programming,EPROM andEEPROM Programming Technology, Commercially availableFPGAs-XilinxFPGAs,AlteraFPGAs,FPGADesign FlowExample-InitialDesignEntry,TranslationtoXNFFormat,Partitioning,PlaceandRoute, Performance CalculationandDesignVerification. • Technology MappingforFPGAs:Logic Synthesis-Logic Optimizationand Technology Mapping, Lookup Table Technology Mapping - Chortle-CRF Technology Mapper, Chortle-d Technology,Mapper,Lookup TableTechnologyMappinginMIS-PGA,Lookup Table Technology Mappingin ASYLandHydra TechnologyMapper,MultiplexerTechnology Mapping- Multiplexer Technology,MappinginMIS-PGA. • Routing for FPGAs: Routing Terminology, Strategy for routing in FPGAs, Routing for Row Logic • Block Architecture: Logic Block Functionality versus Area-Efficiency - Logic Block Selection, Experimental Procedure, Logic Block Area and Routing Model and Results, Based FPGAs - Segmented channel routing, 1-channel routing algorithm, K – channel routing algorithm and results. • ReferenceBooks: • FPGA-BasedSystemDesignWayneWolf,Verlag:PrenticeHall • ModernVLSIDesign:System-on-ChipDesign(3rdEdition)WayneWolf,Verlag. • 2MVL 4.3:BIOMEDICALELECTRONICS • Brief introduction to human physiology, Biomedical transducers: displacement, velocity, force, acceleration,flow,temperature,potential,dissolvedionsandgases, Bio-electrodesandbio- potential amplifiers for ECG, EMG, EEG, etc, Measurement of blood temperature, pressure and flow,Impedance plethysmography,Ultrasonic and nuclear imaging. • Prosthesesandaids:pacemakers,defibrillators,heart-lungmachine,artificialkidney,aidsfor thehandicapped, Safetyaspects,Telemetry–Transmissionoftheoriginal throughwire& wireless, Imaging techniques – Ultrasound, CAT, X-Rays, PET, NMR, Nuclear, Physiological effect of electric current,safety. • Cardiological Signal Processing: Basic Electrocardiography, ECG data acquisition, ECG lead system, ECGparameters& their estimation, the use of multi scale analysis for parameters estimation of ECG waveforms, Arrhythmia analysis, monitoring, long form continuous ECG recording, ECG data reduction technique, Direct data compression techniques, Direct ECG data compressiontechniques,Transformationcompressiontechniques,Otherdatacompression techniques,Datacompressiontechniques,comparison.

10. ReferenceBooks: • MedicalInstrumentation:ApplicationAndDesign,3ed-,Webster ,Wiley • Biomedical SignalProcessing,D Reddy,TMH • ElectronicsInMedicineAndBiomedicalInstrumentation,,Phi • Biomedical Signal Processing, D.Reddy,TMH • MedicalInstrumentationApplicationAnd Design,JohnG.Webster,Oxford • Advanced MethodsOfBiomedicalSignalProcessing,SergioCerutti,Oxford • 2MVL5 DIGITALSYSTEMDESIGNLAB • Design, implement and experiment with digital system, this will include ASIC design, FPGA based design, design of relevant hardware and software for microcontroller, processor and DSP based embeddedsystem. • Custom design and simulation of different higher level analog and digital circuits using advance EDA toolslike Tanner Spice S-editandL-edit.

11. SECONDYEARDETAILEDSYLLABUS • SemesterIII • 3MVL1:EMBEDDEDSYSTEMDESIGN • The concept of embedded systems design: definitions and constraints, hardware and processor requirements, embeddedmicrocontroller cores, embedded memories. Examples of embedded systems. • Technological aspects of embedded systems: special purpose processors; input-output design and I/O communicationprotocols,designspaceexplorationforconstraintsatisfaction,co-design approach,examplesystemdesign,interfacingbetweenanaloganddigitalblocks,signal conditioning, digital signal processing, sub-system interfacing, interfacing with external systems, userinterfacing.Designtrade offsduetoprocesscompatibility,thermalconsiderationsetc. • Softwareaspectsofembeddedsystems:realtimeprogramminglanguagesandoperating systemsforembeddedsystems,specificationrefinementanddesign,designvalidation,Real Time operating system issues with respect to embedded system applications, time constraints and performanceanalysis. • ReferenceBooks: • ReadingsinHardware/SoftwareCo-Design byG.DeMicheli,Rolf Ernst,andWayneWolf, eds.MorganKaufmann,Systems-on-SiliconSeries • EmbeddedSystemDesign:AUnifiedHardware/SoftwareIntroductionby FrankVahidand TonyD.Givargis,AddisonWesley. • ProgrammingEmbedded SystemsinCandC++byMichaelBarr,O'Reilly. • AnEmbeddedSoftwarePrimerbyDavidE.Simon,AddisonWesley. • The ArtofDesigningEmbeddedSystemsbyJackGanssle,Newnes. • 3MVL2.1VLSITESTING&TESTABILITY • PhysicalFaultsandtheirmodeling:StuckatFaults,BridgingFaults,Faultcollapsing. • FaultSimulation:Deductive,Parallel,andConcurrentFaultSimulation, CriticalPathTracing. ATPGforCombinationalCircuits:D-Algorithm,BooleanDifferences,PODEMRandom, DeterministicandWeightedRandomTestPatternGeneration,AliasinganditseffectonFault Coverage,PLATesting,CrossPointFaultModelandTestGeneration,MemoryTesting PermanentIntermittentandPatternSensitiveFaults,MarchingTests,DelayFaults. • ATPG for Sequential Circuits: Time Frame Expansion, Controllability and Observability, Scan Design, BILBO , Boundary Scan for Board Level Testing ; BIST and Totally self checking circuits. System Level Diagnosis: Introduction; Concept of Redundancy, Spatial Redundancy, TimeRedundancy,ErrorCorrectionCodes,ReconfigurationTechniques,YieldModeling, Reliabilityandeffectivearea utilization.

12. ReferenceBooks: • M.L.BushnellandV.D.Agrawal,EssentialsofElectronicTestingforDigital,Memory,and mixed- • SignalVLSICircuits,KluwerAcademicPublishers • M.Abramovici,M.A.Breuer,andA.D.Friedman,DigitalSystemsTestingandTestable Design, • ComputerSciencePress, • L.T.Wang,C.W.Wu,andX.Wen,VLSITestPrinciplesandArchitectures,Morgan Kaufmann • 3MVL2.2: NANOELECTRONICS • Shrink-downapproaches:Introduction,CMOSscaling, thenanoscaleMOSFET,finfets, vertical MOSFETs, limits to scaling, system integration limits (interconnect issues etc.), resonant tunnelingtransistors,singleelectrontransistors,newstorage,optoelectronic,andspintronics devices. • Atoms-up approaches: Molecular electronics involving single molecules as electronic devices, transport in molecular structures, molecular systems as alternatives to conventional electronics, molecularinterconnects,Carbonnanotubeelectronics,bandstructure&transport,devices, MEMSapplications. • ReferenceBooks: • S.M.Sze,Ed,HighSpeedSemiconductorDevices,Wiley,NewYork. • S.M. Sze,Ed,ModernSemiconductor DevicePhysics,Wiley,New York • K.Seeger,SemiconductorPhysics,7thEd,Springer-Verlag,Berlin, • C.Y.Changand S.M.Sze, Eds,ULSIDevices,WileyNewYork • S.M. Sze,SemiconductorDevices:PhysicsandTechnology,2ndEd.Wiley,NewYork. • S.M. Sze andK.K.Ng,PhysicsofSemiconductorDevices,3rdEd,Wiley,Hoboken. • H.Iwai,Y.Nishi,M.S.Shur,H.Wong,FrontierinElectronics,WorldScientific. • R.D.DoeringandY.Nishi,HandbookofSemiconductorManufacturingTechnology,CRC Press, • BocaRaton. • 3MVL2.3:ADVANCE ICTECHNOLOGY AND CHRACTERIZATION TECHNIQUES • Introduction:Toolsfortechnologicalprocessinginmicroelectronics.surveyofmethodsfor • analysisofmicroelectronicmaterialsanddevices.Classificationofdifferenttoolsforbulk, surface andthinfilmcharacterization. • Fabricationofnanoscaleandsubmicronstructures:Physicalandchemicaltechniquesfor nanomaterialsynthesis,Assemblingandselforganizationofnanostructures,Nanoscale

13. manipulation,nanotubeandwireformation,Importanceof sizedistributioncontrol, size measurementandsizeselection,Fabricationofhetrostructureinsubmicronandquantumlevel for microelectronic and opticalapplications. • Variouscharacterisationtechniques:TheoryandworkingprincipleofXRD, SEM,IR, RHEED ,LEED, XPS, AFM ,STM.working of thermal, opticalandelectricalmeasurement techniques. • ReferenceBooks: • “SiliconVLSITechnology”,JamesPlummer,M.Deal&P.Griffin,PrenticeHallElectronics & • VLSISeries. • “TheScienceandEngineering ofMicroelectronics”,StephenCanbel,OxfordUniversityPress.