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CMS TRACKER SYSTEM TEST

CMS TRACKER SYSTEM TEST. Outer Barrel –TOB. End cap –TEC. Inner Barrel –TIB. TIB TOB TEC. Different Geometries One Readout Architecture One Powering Sch e ma. Power Supplies and Cables. Power supplies Situated in counting room I mplement a u nipolar scheme

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CMS TRACKER SYSTEM TEST

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  1. CMS TRACKER SYSTEM TEST Outer Barrel –TOB End cap –TEC Inner Barrel –TIB • TIB • TOB • TEC Different Geometries One Readout Architecture One Powering Schema

  2. Power Supplies and Cables • Powersupplies • Situated in counting room • Implement a unipolar scheme • PS modules power groups of ~60APV • I@2.5V =10A, I@1.25V=4A I@0V =14A • Each PS module equipped with 2 HV channels for detector bias • FloatingLV, HV power supplies of each power group, their Return • Lines connected inside the detector to the Common Detector Ground • Power Cables 140 m long • Voltage drop = 5V • Use of sens wires to compensate the voltage drop • Multipolar cable with low inductance , high capacitance to minimize voltage overshoots due to current variations

  3. Definition of the System Test • The tracker has to enter its production phase • Need to validate a complete subset of it • Validate designs • Tune design details • Verify/optimize integration of components Focus is not on component characterization, but on overall system performance • The subsets: (for TIB/TOB/TEC) • A number of final modules (sensors +frontend hybrid) • integrated on the final mechanical support structure equipped with: • interconnectboards • optical digital links and electronics for control • optical analogue links for readout • power supplies + 100m MSCable • cooling

  4. What is necessary to prove it works • Modules • Noise • Physics signals (ß-source, Laser), SNR • APV settings • Detector leakage currents • Compare with corresponding measurements taken with individual • modules in the “single module setup” (i.e. electrical readout) • Analogue readout chain • Optical link gain and bias point • timing alignment of moduls • Noise contributions, Crosstalk, Common mode effects • Operation margin • Control chain • Noise immunity ( Grounding, cabling, shielding) • Operation margin • Redundancy • Long Term Stability and Temperature stability of the system

  5. What is necessary to prove it works • Interconnect boards, mother boards • Signal Integrity • the distribution of the fast control signals: clock, reset and back plane pulses, • Power distribution • voltage drops; uniformity of supply voltage distribution • Behaviour of full loaded system due to sudden variation in current consumption in correlation with: • large inductance of the long cables • slow reaction time of PSU • Protection against over-voltage?

  6. What is necessary to prove it works • Mechanics • mechanical compatibility of the various components with the mechanical support structure • mechanical stress of the modules due to their fixation on cooling system and interconnect boards • Deformation upon cooldown due to different CTE´s • Ambient parameters • temperatures of the modules • temp. of various elements • humidity in several spots

  7. Phase 1 (April-July):Readout of 1 to 6 modules with a complete (analog & digital) optical link; test with prototype PSUs with long cables. Phase 2 (July-December): mechanical and electrical integration and tests of a small part of TIB: 6 double sided modules on Layer #1 cylinder 12 single sided modules on Layer #3 cylinder Tracker Inner Barrel System Test

  8. Tracker Inner Barrel System Test

  9. Tracker Inner Barrel System Test LAB set-up in Florencecopper readout : UTRI+FEDoptical readout: Opto Hybrid + Fiber + Opto Receiver + Diff. Buffer +FED PC with FED, FEC and TSC CCU Detector and Opto Hybrid Interface Board (UTRI)

  10. Copper Readout Noise 1.47 ADC NCh/bin 60 ADC AD counts T(ns) AD counts Optical Readout Optical Readout AD counts NCh/bin 57 ADC • Noise • 1.18 ADC AD counts T(ns)

  11. Tracker Inner Barrel System Test Signal to noise • Signal equivalent to roughly 2 MIPs • Copper readout: S/N =42 • Optical readout: S/N =48

  12. Tracker Outer Barrel System Test Patch panel InterConnect Bus Cooling pipe Module frame Module support blocks The rod components InterConnect Cards 110 cm 15 cm

  13. Tracker Outer Barrel System Test • Detailed electrical test of IC bus + IC cards, with 12FE- Hybrids and • 8 OptoHybrids (almost full load) • Check of the signal integrity • Optimization of the impedance matching • Measurement of the voltage drop along the bus • Test of I2C communication • Results • The design of IC Bus and IC Cards is correct – signals are very clean • A few details have been fixed/optimized • Optical link commissioned on a single channel setup • Nominal gain of the link verified • Optimization of the bias point

  14. Tracker Outer Barrel System Test Next step: Integrate a rod with electrical components and real modules Build an Alu box, gas tight, with patch panel for pipes (cooling and dry air) and other services (It can house 2 rods) Add external temperature and humidity probes Commission a cooling system with C6F14

  15. Tracker Outer Barrel System Test Current status: • All modules working properly and read out under bias • External temperatures probes also read out • Cooling running smoothly • Grounding scheme similar to the “final” one implemented • Now ready to start quantitative measurements Further steps • Study sensitivity to noise on the power lines / grounding • Go to the tracker operating temperature • Install 12 detectors in the second rod (DS rod) • Add a second rod

  16. Tracker Endcap System Test Front petal • 28 Si-detectors • 28 FE hybrids • 28 Optohybrids • 2 CCUM • 4 IC Boards B-side A-side front petalback petal 3 power groups : 1. Ring #1, #2 48 APVs 24 APVs 2. Ring #3, #4, #6 44 APVs 32 APVs 3. Ring #5, #7 44 APVs 56 APVs

  17. Tracker Endcap System Test • Design verification of petals • mechanics, done • electrical performance of the interconnect board, done • deformation after cooldown tested • System test in 4 steps: • Test of the 2nd detector group (rings #3, #4, #6) • Test of the 3rd detector group (rings #5, #7) • Fully equipped but without Si-Sensors, • Test of the 1st detector group (rings #1, #2) • Fully equipped but without Si-Sensors, • Results expected by the end of this year • Full System Test for Front and Back petal • fully equipped with Sensors and front end electronics • with final cables and power supplies • Final results expected in spring 2003

  18. Tracker Endcap System Test Test of the mechanical compatibility Digital Optical Hybrid R#7 Interconnect Board R#6 Analogue Optical Hybrid R#5 R#4 Frontend Hybrid R#3 R#2 R#1

  19. First optical readout of TEC Module: Lyon

  20. Tracker Endcap System Test Signal Integrity Differential Bunch Clock Pulse Reset Pulse • Over-voltage measurements • Behaviour of full loaded system due to sudden variation in current consumption (switching off the frontend hybrids) • over-voltage swing due to inductance of the long cables • over-voltage gradient due to slow reaction time of the PSU

  21. Tracker Endcap System Test Setup for the Measurements of the Over-voltage

  22. Overvoltage measurements C250 = 60 µF, C125 = 40 µF • Over-voltage swing due to • cable inductance • Commercial power supplies • Sense wires not connected • Cable Length = 100m • Different dumping capacitances V2.50 V1.25 I250 = 1.2 A I125 = 0.52A C250 = 330 µF, C125 = 330 µF C250 = 740 µF, C125 = 740 µF V2.50 V2.50 V1.25 V1.25 I250 = 1.0 A I125 = 0.52 A I250 = 2.75 A I125 = 0.84 A

  23. Over-voltage measurements • Overvoltage gradient • due to slow regulation time of PSU • senses wires connected • commercial power supply • dumping capacitance 700µF • cable 100m, U = 0.8V • 4 frontend hybrids toggled; I = 2A • Overvoltage .4 V above the limit • Over voltage is a potential problem. • Overvoltage gradient requires : • special power supply design or • radhard voltage limiter located close to detector • could be reduced by proper system architecture • Overvoltage swing could be fixed by: • reasonable damping capacitance on the interconnect boards

  24. Conclusions and Remarks • System test is underway for TIB/TOB/TEC • The goal is to test an overall performance of a complete subsystem: • Si-Modules + FE-electronics • / analogue optical links / digital control links /long cables / • power supplies /monitoring • It´s intended to be a step by step process • All sub-components will be integrated as soon as they are • made available • First TOB Rod is integrated, ready to start quantitative • measurements • Final results for all detectors are expected by the • beginning of 2003

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