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Development of a DHCAL with Resistive Plate Chambers

Development of a DHCAL with Resistive Plate Chambers. Jos é Repond Argonne National Laboratory. ECFA/DESY Workshop at NIKHEF, Amsterdam, Netherlands April 1 - 4, 2003. I. Introduction. Collaboration. Argonne National Laboratory

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Development of a DHCAL with Resistive Plate Chambers

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  1. Development of a DHCAL with Resistive Plate Chambers José Repond Argonne National Laboratory ECFA/DESY Workshop at NIKHEF, Amsterdam, Netherlands April 1 - 4, 2003

  2. I. Introduction Collaboration Argonne National Laboratory I Ambats, G Drake, V Guarino, J Repond, D Underwood, B Wicklund, L Xia Fermilab (M Albrow), C Nelson, R Yarema, (A Para, V Makeeva) Boston University J Butler, M Narain University of Chicago K Anderson, E Blucher, J Pilcher, M Oreglia, H Sanders, F Tang

  3. Design considerations Multi-gap smaller signals less streamers improved longevity reduced cross-talk better rate capability Avalanche mode smaller signals improved longevity reduced cross-talk no multiple-streamers better rate capability High-resistive graphite layer reduced cross-talk

  4. Test chamber design and construction Gas mixture Freon/Argon/IsoButane = 62:30:8

  5. Cosmic Ray test set-up Trigger Cosmic ray telescope with 4 layers of scintillator Rate ~1Hz Data acquisition Charge integration Gate between 700 ns and 20μs Readout up to ~40 channels Alternative tests Amplifier, shaper, discriminator

  6. II. Tests with single pads Avalanche mode Total charge of signal increases with HV At 7.4 kV Signal ~ 0.2 pC

  7. …and streamer mode Total charge of signal increases with HV At 8.0 kV Signal ~ 10 pC Significant amount of multi-streamers and of avalanches

  8. Measurements of efficiencies Counting charges above Q0 Counting events above V0 Efficiency greater than 90% in avalanche mode (plateau ~300V) Small fraction of streamers Noise rate ~50Hz for avalanche mode Efficiency greater than 90% in avalanche mode (plateau ~200V) Small fraction of streamers

  9. III. Analysis of Multi-pad Data Readout system and analysis RABBIT system Records charges Calibration: 1.1fC/ADC count Pedestal subtracted Negative values set to zero Pad structure Central pad 1 x 1 cm2 Data sets AIR2 38 kEvents 2 gaps of 0.64 mm glass of 1.1 mm R□ ~ 1.2 MΩ AIR1 24 kEvents same as above R□ ~ 200kΩ All 1 x 5 cm2 Pads added together Default Big pad 19 x 19 cm2

  10. Summing up all charges Clear avalanches and streamers Significant charge outside pad with highest charge

  11. Neighbors… Pad hit sees more charge than any neighbor Only central 9 pads Much worse for AIR1 with low R□ Charge in neighbor correlated with charge of pad hit

  12. Central pad with maximum charge Zeros: cut out Avalanches Streamers

  13. Central pad with maximum charge: select avalanches All pads at a given distance added up Suppression of negative charges disabled Similar results for streamers Error bars are RMS of distributions Charges go negative

  14. Central pad with maximum charge: select avalanches Looking at individual pads Suppression of negative charges disabled Charge on neighboring pads small!

  15. Central pad with maximum charge: select avalanches Mostly direct neighbors No counts in second ring <Multiplicity high> Probably ok for 2x2 cm2 pads Will look better with discriminators Important to suppress streamers

  16. IV. Design work on the electronic readout System overview I RPC ASIC located on the chambers II Data concentrators funnels data from several FE chips III VME data collector funnels data from several data concentrators IV External timing and trigger system

  17. Conceptual design of readout pad Minimize cross-talk Overall thickness 2 - 3 mm One ASIC for 64 or 128 channels Will need 3125 – 6250 ASICs for 1 m3 prototype First version of boards being laid out

  18. Design of ASIC: Front End Amplifier Each ASIC serves 64 or 128 detector channels Each channel has a preamplifier Needed for avalanche mode Can be bypassed (if operating in streamer mode) Provides pulse shaping Provides polarity inversion

  19. Design of ASIC: Digital Processing Functions Considering 3 options I Trigger-less operation Timestamp counter running inside chip Store timestamp and channel number when hit II Triggered operation Provide pipeline for temporary data storage Provide trigger input to capture data of interest Provide trigger output Timestamp to identify event III Self-triggered operation Like triggered operation, but allow internal hits to capture data Like trigger-less operation, but only one timestamp per event

  20. Data concentrator Receive serial data streams and provide buffering Send single data stream to back ends Can be realized in an FPGA

  21. Data collection Essential functions Receive serial data streams from Front Ends Form ‘Time Frames’ blocks of data corresponding to ~1 sec Send data to storage Provide clock and controls Realization Use VME crates for infrastructure need 2 crates to house 35 cards

  22. V. Plans for the next few months I. Resistive paint Investigated over 50 paints and mixtures many mixtures not stable over time Found 2-3 (acrylic) with over 1 MΩ/□ Developing methods to control thickness II. Effect of distance to ground plane and capacitance Multipad boards with two different thicknesses on hand III. Reading off on ground versus HV side So far reading off HV side (risk of breakdown) Signals reading off ground side inverted in charge Study effect on cross-talk

  23. IV. Single gap versus multigap Will build chamber with single gap with same gas volume study effect on cross-talk V. Discriminators versus charge integration Readout of multi-channel with discriminators in preparation VI. Geometrical acceptance Digital readout Construction of scintillator hodoscope at ANL Re-commissioning of Cosmic ray test stand with tracking at Chicago

  24. VI. Plans for the next 15 months Finalize chamber design by 6/03 Develop application procedure for paint by 6/03 Complete tests with prototype readout systems by 6/03 Specify characteristics of FE ASIC by 7/03 Initiate production of chambers by 10/03 Evaluate pre-production of readout boards and ASIC by 3/04 Initiate production of readout boards by 4/04 Initiate production of data collections systems by4/04 Ready for test beams in Summer 2004?

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