Design of Integrated-Circuit Interconnects with Accurate Modeling of Chemical-Mechanical Planarization

Dec 13, 2012

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Fill Pattern. Fill pattern inserted between active" interconnectsBlue: active interconnectGray: dummy fillSubset of potential fill patterns:Rectangular shapesIsothetic (aligned with axes)Characterized by:Number of rows (M=5)Number of columns (N=3)Series of widths (W)Series of lengths (L)

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Design of Integrated-Circuit Interconnects with Accurate Modeling of Chemical-Mechanical Planarization

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