MarketsandMarkets Presents Publishing Date: Oct. 2015 Chemical Mechanical Planarization Market worth $4.94 Billion by 2020, at a CAGR of 6.83% from 2015 and 2020 by Geography is estimated to be the largest market.
About our Report • The chemical mechanical planarization is a critical process technology step in the semiconductor wafer fabrication process. In this process step, the top surface of the wafer is polished or planarized to create a flawless flat surface that is essential to make faster and more powerful semiconductor devices with the aid of chemical slurry & mechanical movements. • The CMP tool is comprised a rotating platen, slurry, pad, holding ring, brush, and pad conditioner. The mechanical element of this system applies downward pressure to a wafer surface, while the chemical reaction increases the material removal rate. • The value chain of the CMP market consists of different players, including semiconductor material suppliers, CMP integrated solution providers, semiconductor wafer suppliers, semiconductor device manufacturers, slurry & pad manufacturers, technology solution providers, and CMP equipment manufacturers.
Inside of Report Browse: • 81 market data tables. • 70 figures spread through 148 pages. • In-depth TOC on "Chemical Mechanical Planarization Market - Global Forecast to 2020. • The CMP equipment market is expected to grow at the highest CAGR of 8.32% from 2015 to 2020. The key factors behind the high growth of the CMP equipment market is the strong growth in semiconductor equipment and capital spending. • The CMP consumables market was valued at USD 2.25 Billion in 2014 and is expected to reach to USD 3.21 billion by 2020. The Applied Materials, Inc. (U.S.) & Ebara Corporation (Japan) are the major CMP equipment suppliers for different integrated device manufacturers.
Table of Content 1 Introduction (Page No. - 15) 1.1 Objectives of the Study 1.2 Market Definition 1.3 Study Scope 1.3.1 Markets Covered 1.3.2 Years Considered for the Study 1.4 Currency 1.5 Limitations 1.6 Stakeholders. 2 Research Methodology (Page No. - 19) 2.1 Research Data 2.1.1 Secondary Data 14 Appendix (Page No. - 143) 14.1 Insights of Industry Experts 14.2 Discussion Guide 14.3 Introducing RT: Real-Time Market Intelligence 14.4 Available Customizations 14.5 Related Reports
Structured Cabling Download Free Sample Pages :- http://www.marketsandmarkets.com/pdfdownload.asp?id=205609310 This detailed market research study provides detailed qualitative and quantitative analysis of the global chemical mechanical planarization market. It provides a comprehensive review of major market drivers, restraints, opportunities,, challenges, and key issues in the market.
Company Coverage • Applied Materials, Inc. (U.S.), • Ebara Corporation (Japan), • Cabot Microelectronics Corporation (U.S.), • Dow Electronic Materials (U.S.), • Fujimi Incorporated (Japan).
Summary The geographic segments included in this report are North America, Europe, Asia-Pacific, The Middle East, and the Rest of the World (RoW). The report maps each type, technology, component, and application segment in geographic and regional segments. The Asia-Pacific is projected to account for ~31.1% share of the global aircraft fuel systems market in 2015. The market in Asia-Pacific is estimated grow at a CAGR of 7.7% from 2015 to 2020. The report provides a granular understanding of the aircraft fuel systems market. This report segments the global market on the basis of application, type, technology, component, and geography. The component segment has been further categorized into piping, injection system, valves, pumps, gauges, fuel control & monitoring systems (FCMS), and filters.
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