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Potting is the process of filling a complete electronic assembly with a solid or gelatinous compound such as acrylic, silicone, or resins and improves vibration and shock resistance, protecting against corrosive substances and dampness. On the other hand, encapsulation uses a reusable mold to build a frame around an item and fill the gap between the frame and the object with chemicals. Encapsulation's primary function is to build a protective shell around the electronic assembly.
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