Particles and Fields Package Quarterly Status Review (QSR) October 18, 2011

1. Particles and Fields Package Quarterly Status Review (QSR) October 18, 2011 Dave Curtis, PFP PM

2. Schedule Status STATIC, SWIA on critical path 12 weeks margin to delivery to LM Improved over last month due to reprioritization of tasks and reassessment of assembly and test durations Critical Path runs through electronics fab & test Progress on getting boards into flight fab this month, but still taking longer than planned Indications that board loading at subcontractors may take longer than planned Some high-priority boards can be done in-house Have brought on a fabrication manager to shepard boards through loading Recent deliver issue with ACC/MCP multiplier from VMI Test Schedule work-arounds being considered (start early testing with EM ACC/MCP) as we cannot run 15KV supply in air we would not notice if it is there or not for early tests Holding PFP package integration date for now April 2012 SWIA/STATIC calibration may not be complete at that time, get completed after package I&T

3. Accomplishments EM progress: All EM testing complete except: STATIC calibrations REG #2 testing Tracking some issues discovered in EM test More information in instrument sections Not holding up flight fab LPW preamp qual model through thermal cycle tests FM Electronic Progress: 12 PFP flight PWB fabricated, 5 loaded and in test MAG MAD boards, SWEA IRAP boards in test 6 boards in PWB fabrication 6 boards out for quote 4 boards through review and in final adjustments before fab 3 boards still in layout REG, STATIC LVPS, STATIC ACC/MCP FM Mechanical LPW, SEP, MAG, SWEA mechanical parts all out to fab Most parts in assembly SWIA, STATIC, PFDPU getting out to fab now FSW Boot code tested Flight harness fabrication started NCAS audit completed More in instrument sections…

4. Ongoing Work Supporting Project planning process Supporting EMC, Payload, SDT working groups Get FM PWBs all out to fab Get FM PWBs loaded Get all SWIA/STATIC FM mechanical into fab Get board level thermal and PSA complete

5. PFP RFA Status

6. Trades, Issues Working on an analysis to decide if the PFDPU mechanical design needs to be augmented to support the PWBs to avoid excessive displacements in vibe Reached agreement on solution (DFB stiffener characteristics) Adds mass to PFDPU to enhance stiffness of chassis. Held final TIM, waiting on comments from Seke SOTA resistor alert Ordering replacements where delivery time allows Have screening plan in place for existing parts CLOSED PFDPU Thermal conduction to deck Current design does not meet ICD Modifying deck mounting to increase conductivity

7. Thermal Status Working on board level thermal analyses Board analysis model in place and providing results and feedback into layouts Some thermal data from a few board leads still outstanding

8. Top Risks Retired SOTA resistor risk – screening plan Mitigated PWB coupon risk – backup board fab

9. Risks List

10. PFP Mass No change this month

11. Mass Tracking Chart

12. PFP Power Measured STATIC EM power converter efficiency below expectations reduces operational power margins to near zero

13. PFP Power Trend

14. PFP Data Rate Latest allocations per TRAS Including pending CCR364

15. Life Testing SEP Attenuator life test complete SWEA door mechanism identical to STEREO LPW relay life test complete LPW deployment life test completed SWIA, STATIC attenuator life test completed SWIA, STATIC door mechanism functional, life test started 10 actuations completed so far between 2 units life test is 16 actuations

16. Requirements Verification Status Boot software Acceptance Test completed, but want to repeat it with the ’final’ version of the DCB FPGA before programming the flight PROM LPW Qual Model thermal vac completed successfully STATIC second round EM VTMT completed successfully

17. MAVEN PFP SWEA Status October 2011 Dave Mitchell, SWEA Lead

18. SWEA Status • IRAP • FM sensor final assembly: done • FM Calibrations (part B): 25% • Spare boards tests/calibrations: done • SSL • FM Digital mods design & review: done • FM LVPC mods re-design & re-review: done • FM Digital PWB fab: in progress (expected 11/7) • FM LVPC magnetic wind & test (in progress) • Digital test procedure: done • LVPC test procedure: 90% FM Sensor and Front-end Electronics

19. SWEA Issues • Short in inner toroidal grid of SSL EM • Short located and repaired • Electrical connections for all sensor surfaces tested and found to be correct: • V0: top cap, inner toroidal grid, outer hemisphere, exit grid • Ground: outer hemisphere, case • Deflector voltages: upper and lower deflectors • Analyzer voltage: inner hemisphere • Further investigation of charging anomaly • Both SSL and IRAP EM’s exhibit the charging anomaly. • For the SSL EM, Nuflon removed from the top cap and then the entire part was plated with gold. Tests were repeated, and the same charging anomaly was observed. • Testing at IRAP shows that MAVEN FM does not exhibit this behavior. • Further testing of SSL EM will planned for week of 10/24 (repeat vacuum chamber tests on EM with the top cap assembly, outer hemisphere, and deflectors removed  isolate location of the issue)

20. MAVEN PFP SWIA Status October 2011 Jasper Halekas, SWIA Lead

21. SWIA Progress • Electrical Progress • All EM boards built, tested, and integrated • FM layouts in progress • All FM layouts fully reviewed • Anode and Digital in fabrication, other three out for quote • Mechanical Progress • EM fully assembled and tested functionally with ion source in calibration chamber to verify optics design and data acquisition • Successfully passed re-vibration after staking fasteners • Attenuator testing complete • Most FM drawings complete, some FM parts out for fabrication, others in review • Calibration • All optics and detector performance nominal, with good agreement with expectations from simulation • All EM testing complete • New manipulator now installed in new cal chamber for FM testing

22. SWIA Issues • EM electronics noise • Higher than desired levels of electronics noise in EM system, apparent only when full sensor assembled • Almost certainly a grounding issue • Provisions in place to tie grounds together better for FM • Still finishing some testing to determine root cause, but we believe a solution has been found, and no delay in FM fabrication is expected • Board fabrication process • Confusion over details of IPCC requirements delayed process • Delays in settling on readme file and fab document formats delayed process still further • Delays in PCB material procurement delayed process a little bit more • All these issues seem to be resolved now, but the whole process took far too long

23. EM Calibrations Complete SWIA energy/angle response within expected range of simulations, and meets all requirements with room to spare

24. MAVEN PFP STATIC Status October 2011 Jim McFadden, STATIC Lead

25. STATIC Accomplishments EM foils mounted for full up STATIC EM testing Filters added to EM MCP/Grid HVPS were modified/tested in vacuum Prototype MCPs in EM anode were tested with 16.5 kV on TOF for field emission and arcing – background acceptable after MCP scrubbing and vacuum pumping for a few days VTMT test completed for EM2 Preamp Digital board EM2 tested, layout errors corrected, flight PCBs ready for fabrication after PCB material selection TDC ADC latchup protect subsystem in FPGA specified, designed and simulated Mechanical attenuator relaxation time testing and drawings complete Mechanical parts database for flight fabrication created New cal chamber ready to sensor testing w/o ion gun

26. STATIC Digital EM2

27. STATIC Ongoing Work Carbon foil mounting equipment moved to 320 clean room for flight foil mounting – waiting on minor test equipment (cables) TDC EM2 PCB fabricated, loading in process, (for parallel testing) Anode/Preamp/TDC flight fab is waiting on Hatch/Dalen to finalize mounting hole changes to accommodate thermal dissipation, and PCB material selection. Sweep HVPS layout complete and RFQ submitted, awaiting thermal approval and PCB material selection. High level data products generated by FPGA being tested/validated by Abiad and with independent software developed by Kortmann TDC ADC latchup protection needs testing in next version of FPGA Ion Gun integration with new cal chamber in process. Completed A/E testing on a sample of black nickel – awaiting report

28. STATIC Open Issues LVPS efficiency problems – modifications in process Awaiting LVPS modifications so the entire analyzer and EM electronics can be tested as a unit in vacuum – subsystem testing complete. EM LVPS ~200 kHz noise needs testing with SWP HVPS

29. MAVEN PFP SEP Status October, 2011 Davin Larson, SEP Lead David Glaser, SEP ME Miles Robinson, SEP EE

30. SEP Accomplishments DFE Board in production (delivery expected next week). Board will be stuffed in house. Kitting in progress. Assembly directions in progress DAP Layout completed. BOM being checked over Detectors 0 and 300 VDA applied to 2 wafers. Diced. testing has begun at LBL Delivery promised for next week. Mechanical All parts except outer shells delivered Painting tests started.

31. SEP Open issues Observed cross talk issue. Reasonably certain it is only due to test pulse – cross talk should not be encounter with real signals. Notice 3 occurrences in which DAP Actel does not wakeup properly after turn on. Always successful after power cycle. This issue has not been observed again. – not reproducible. Will keep open.

32. MAVEN PFP DCB, Power Converter & GSE Status October 2011 Dorothy Gordon Timothy Quinn Peter Berg Chris Tiu

33. DCB Status DCB and FLIGHT FPGA Daughter Boards Flight PCB Layout Fabrication Quotes received for both DCB and FPGA Flight Daughter Board, boards to go out shortly. Parts Stress Analysis has been approved. DCB FPGA Rev 11 is in test Generates “Instrument Active” Indicator for the REG board. DCB Diagnostics Development continues on the DCB Diagnostic Test Suite Cause of Telemetry Message subsystem SYNCH/LENGTH errors has been identified (just an artifact of power-cycling the instrument when using the MISG). A change is being made to the MISG to increase system robustness.

34. GSE Status (1) MISG Hardware/Firmware Six new MISG Boards have been built and delivered Awaiting board level checkout GSEOS Additional GSE instruments were integrated into GSEOS to allow for monitor and control. These include:    - Agilent Digital Multimeter    - Keithley Picoammeter    - Bertan Series 225 High Voltage Supply    - Stanford Research Systems DS345 Signal Generator    - DAQPad    - Relay Control DAQ Device

35. GSE Status (2) High Fidelity Simulator (PFP-HFS) Parts have been ordered in readiness for build/test Delivery planned for February 2012

36. Power Converter Status (1) REG board Efficiency optimization continues Subsystems checked out on the second REG board Actuator switching Housekeeping Output preload circuit (pending instrument enables) built and installed Magnetics development is near completion Improved instrument current monitor circuitry designed and built Housed on daughter board Ready for testing/characterization

37. Power Converter Status (2) IIB Board Magnetic component optimization is ongoing 35 of 38 magnetic components have been optimized Their drawings are ready to for release Parts Stress Analysis has been approved by GSFC FM layout is process, undergoing final review

38. MAVEN PFP Flight Software Status October 4 2011 Peter Harvey

39. Boot Status • Interface Documents, Meetings • Updated Software Test Plan, MAVEN_PF_FSW_006_STP.doc • Wrote Software Users Manual,MAVEN_PF_FSW_007_SUM_BOOT.doc • Wrote Software Maintenance Plan, MAVEN_PF_FSW_008_SMP.doc • Prepared SwATR Presentation • IV&V • None • FSW Development • Comments/other minor changes to Boot FSW during period • Completed Action Items from Boot SwATRR • Test Status (FPGA revision 10) • Incorporated CDI Readback electronics • Incorporated CDI Readback into scripts • Long Duration Stress Test, MAVEN_PF_FSW_025_LDS_110917.doc • Comprehensive Performance Test, MAVEN_PF_FSW_023_CPT_110921.doc • Boot Inspection Report, MAVEN_PF_FSW_024_Inspection.doc • Wrote Version Descriptor, MAVEN_PF_FSW_027_VDD_V102.doc • Dates coming up • TBD – Boot FSW ATR • TBD – Boot Test with Actuators • TBD - PROM Burn

40. Operational Status • Interface Documents, Meetings • Reviewed new DFB ICD • DCB HSK going from 32 to 24 qty -> Mod needed to Ap, CTM, Code • Arranged Larger PROM (32 KB) in flight case, 16KB in Diag Case = better margins • New Requirements • Monitor Actuator status (2-bit version) being added to Level 5 • IV&V None • FSW Development • Inspected Differences between Boot & Op  Updated Op as needed • Developing Solid State Recording Module (SSR) to verify DCB Flash Hardware • Test Status/Tools • Using DVF ETU#002 • Wrote MVNSLOC to help make SLOC metrics for all sources • Issues • FLASH memory is not the same as in RBSP! • Does not implement the same status flags!

41. Test Environment • GSEOS Status: • Parity Configuration (Cancelled) • CDI recording Completed • Error in Checksum Calculation Found and Corrected (SPR002) • Instrument simulation (in progress) • Limit checking error messages (uses raw values, not converted) • GSEOS Python Test Scripts, Displays • Complete for now • FSW Development Platform: • Configured for Boot Testing • Instrument CDI Recording Added • Testing Personnel: • No changes

42. SPRs and SCRs

43. Metrics Chart

44. Defect Chart

45. Fever Chart • Boot testing is falling behind based upon all sorts of sideline interrupts.

46. Safety and Mission Assurance Quarterly Status Report (QSR) OCTOBER 2011 Jorg Fischer, PFP SMA

47. OCTOBER SMA SUMMARY QA organized and prepared for the NASA A3 (formerly known as NCAS) audit during the month of September. We gave a presentation for this follow-up assessment, presenting the progress made and items closed. The audit was performed Sept 14th through Sept 16th by four assessors and three observers. No critical findings were reported. We received FM parts from GSFC and started on FM parts kits, prepared and supported SOW and PWA fabrication and assembly preparation efforts. Supported ESD and calibration checks. Alert checks were postponed until beginning of next month.

48. OCTOBER SUMMARY QA hosted and attended a SSL Safety Committee meeting with UCB EH&S inspectors. Support of FSW reviews and inspections was provided (see FSW detail slide). A schedule for FSW software reviews and inspections was set. Operators attended NASA workmanship training classes. The QA team produced pre-tabbed MAVEN Travel Book Documentation Binders and distributed them to the EEE and Mechanical teams. Part of the package are Power and Mate-Demate forms, Boiler Plate Assembly Control Instructions, and Rework-Repair Forms.

49. SMA Backup

50. NASA A3 audit QA organized and prepared for the NASA A3 (formerly known as NCAS) audit during the month of September. We gave a presentation for this follow-up assessment, presenting the progress made and items closed. The audit was performed Sept 14th through Sept 16th by four assessors and three observers. No critical findings were reported.