Silicon sensor modules at intermediate to large radii of a new CMS tracker for SLHC

1. Silicon sensor modules at intermediate to large radii of a new CMS tracker for SLHC W. de Boer, P. Blüm, A. Dierlamm, F. Hartmann, K.-H. Hoffmann, A. Furgeri, B. Ledermann, Th. Müller, H.-J. Simonis Institut für Experimentelle Kernphysik, Universität Karlsruhe, Germany

2. Cooling – How to cool 100kW? • Wim plus student plus NN started to evaluate actual LHC cooling concepts • An altered version of the LHCB CO2 solution seems suitable for SLHC • Also CERN groups (Cryo & TK) are looking the same direction • The goal is to evaluate and prototype a cooling system • The idea is to work in parallel on a compatibel module design or at least make sure, the cooling scheme is applicable • Work on concepts and tube diameter calculations started • Feasability study to use present service.

3. The irradiation facility • KAZ Karlsruhe Kompakt Zyklotron • 450 Euro per hour irradiation/dosimetry • 18 to 38 MeV protons available • Higher stability of beam current • Irradiation time depends on heating up effects • Availability on request (1-2 weeks) • Direct proton dosimetry • Ni-foil • Independent on NIEL hardness factor • Irradiation of CMS structures (in framework of IQC): • 35 CMS Sensors • 60 Teststructures • 15 CMS modules • 10 Hybrids • 10 Opto-Hybrids

4. Testing & Assembly Equipment • 2 probe stations (also cold) • TFT • 1 long term • Specialized „process control“ planned • Hesse&Knipps Bonder • CMM 50x50x50cm³ • Material Science lab nearby  access to ESEM  Plans • Sensor & TS testing • Module prototyping

5. Interest I • Test structure development • Standard for later process control • R&D • Second metal layer • Strixel parameters • This includes • Testing • Layout • Simulation?? Start IET ONSemi? Second step, introduceto HPK andothers

6. Interest II • Sensor development • Go along Marcello MannellisMultigeometry Wafer on different technologies • Radiation hardness and capacity study • Overhang studies • Different thicknesses • Have a try with our Warsaw colleagues on different layouts • Novell connection scheme: double metal • Strips and/or Strixel • Follow Sensor WG studies • Planar sensors for „outer layers“,

7. Interest III • Follow discussions of layouts and controls/safety • Input from us • Forward region, either XY or larger structures than petals with simpler cooling schematics • Cooling schematics • T,RH sensor readout and placements (Controls).

8. 2nd step search for the most effective module scheme .... The consortium intends to build and test a limited number of fully developed module geometries, including the interconnection scheme to the readout chips and the cooling. • Module structure must work independently from strixel/strip length • Can work independently for forward and barrel region • Material budget plus simplicity will lead our design from the very beginning • Avoid connectors wherever possible • Goal: small number of module types Rod, ladder or on cooling pipes Etc.

9. Summary – Main interestof Ka • Sensor plus teststructures • Double metal with new connectivity • Testing including radiation studies • Module Design (later and together with cooling) • CO2 cooling

10. Discussion

11. Goal – Idea – Alongtheway • Goal: Sensor/Module for outer radii • N-on-p or p-on-n • Along the way: We all together develop TS for testing and R&D • Layout • Standard • Double metal • combined with simulations • voltage robustness • Different resitances • Prototype with institutes

12. Whatcontributiondid I forget?

13. Schedule? Pleasecorrectme!

14. Brainstrom • Simulate strixel with different gaps, w/wo guardring • Voltage hardness of TS simulated, high Vbias realized with metal overhang.