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ATLAS Tracker Upgrade: Silicon Strip Detectors for the sLHC. Sergey Burdin (University of Liverpool) for ATLAS Collaboration 13th ISTC SAC Seminar "New Perspectives of High Energy Physics" 1-5 September, 2010, Novosibirsk, Russia. Upgrade Schedule.

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atlas tracker upgrade silicon strip detectors for the slhc

ATLAS Tracker Upgrade: Silicon Strip Detectors for the sLHC

Sergey Burdin (University of Liverpool) for ATLAS Collaboration

13th ISTC SAC Seminar

"New Perspectives of High Energy Physics"

1-5 September, 2010, Novosibirsk, Russia

upgrade schedule
Upgrade Schedule

S.Burdin / Atlas Tracker Upgrade

atlas inner detector
ATLAS Inner Detector

Pixel (n+-on-n sensor): 3 layers+2x3 discs

1.8m2, 80M channels, 1x1015 1MeV neq/cm2

Radiation hard technology: n+-in-n Silicon technology, operated at -6°C

SCT (p+-on-n sensor): 4 layers+2x9 discs

61m2, 6.2M channels, 2x1014 1MeV neq/cm2

p-strips in n-type silicon, operated at -7°C

TRT (straw drift tubes): Barrel+2Endcaps

420K channels, 3x1013 1MeV neq/cm2

Current trackers designed to survive up to 10Mrad in strip detectors ( ≤700 fb-1)

atlas inner detector upgrade
ATLAS Inner Detector Upgrade

All silicon concept (no TRT)

~200m2of silicon sensors

Should fit into the current ATLAS ID size

Need to cope with higher radiation levels

Pixels: 2.2x1016 1MeV neq/cm2

Short Strips: 1.2x1015 1MeV neq/cm2

Long Strips: 5.6x1014 1MeV neq/cm2

and occupancies

3600

3000

2400

1800

1200

600

0

Much higher integrated doses

(need to plan for  3000fb-1)

2030

2029

2028

2027

2026

2025

2024

2023

2022

2021

2020

2019

2018

2017

2016

2015

2014

2013

2012

2011

2010

  • Should use affordable concepts in terms of technology and cost

S.Burdin / Atlas Tracker Upgrade

inner tracker occupancy
Inner Tracker Occupancy

5 collisions (0.2 x 1034 cm-2 s-1)

400 collisions (10 x 1034 cm-2 s-1)

2.6%

1.8%

1.0%

The strip occupancy should be < ~2%

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Short (2.4cm) and Long (9.6cm) Strip Occupancy (400/BCO)

slide6

Radiation Background Simulation

Short strip

Long strip

Pixels

n

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upgrade inner tracker layout
Upgrade Inner Tracker Layout
  • Pixels:
    • 4 layers + 2x6 discs
    • 3.7cm≤R≤20.9cm
  • Strips:
    • Short (24mm): 3 layers
      • 38.0cm≤R≤62.2cm
    • Long (96mm): 2 layers
      • 74.3cm≤R≤100.0cm
    • 2x5 discs

S.Burdin / Atlas Tracker Upgrade

p strip vs n strip readout
P-strip vs. N-strip Readout

Holes collected

Deposited charge cannot reach electrode

Charge spread over many strips

Lower signal

Electron collected

Higher mobility and ~33% smaller trapping constant

Deposited charge can reach electrode

Qtc Q0exp(-tc/ttr), 1/ttr = bF.

tC is collection “time”, ttr is effective trapping time

Effect of trapping on the Charge Collection Efficiency (CCE)

“New” n-in-p geometry

“New” n-in-n geometry

( after type inversion)

“Standard” p-in-n geometry (after type inversion)

n+

p+

e-

Un-depleted

p-

p-

h+

Un-depleted

p+

n+

Type inversion turns lightly doped material to “p” type

8

A. Affolder - PSD08, 1st-5th September 2008, Glasgow, Scotland

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selection of silicon sensors
Selection of Silicon Sensors

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motivations for p type silicon wafers
Motivations for P-type Silicon Wafers

Starting with a p--type substrate offers the advantages of single-sided processing while keeping n+-side read-out:

  • Processing Costs (~50% cheaper).
  • Greater potential choice of suppliers.
  • High fields always on the same side.
  • Easy of handling during testing.
  • No delicate back-side implanted structures to be considered in module design or mechanical assembly.
  • So far, capacitively coupled, polysilicon
  • biased p-type devices fabricated to
  • ATLAS provided mask designs by:
  • Micron Semiconductor (UK) Ltd
  • CiS Erfurt (Germany)
  • CNM Barcelona (Spain)
  • ITC Trento (Italy)
  • Hamamatsu Photonics HPK (Japan)
  • (Including full-size 10cm ×10cm prototype)

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Phil Allport (University of Liverpool)

n in p planar fz irradiations
n-in-p Planar FZ Irradiations

900V

Strip

Doses

500V

Signal size thought to require soft/quenched charge multiplication

Pixel

Doses

Radiation Fluence (1014neq/cm2)

11

S.Burdin / Atlas Tracker Upgrade

full size detector testing
Full-size Detector Testing

LivWiik (Uni Freiburg)

  • ATLAS07
    • Full-size prototype sensors
      • 9.75cm x 9.75cm
      • 4 rows of 1280 strips each (2.4cm)
  • All tested sensors satisfied technical specs of non-irradiated sensors
  • Strip scans performed on 6 sensors showed no defects on 23040 strips: no pinholes, punch-through defects, shorts or openings of metal strips

S.Burdin / Atlas Tracker Upgrade

slide13

Current SCT ATLAS Module Designs

ATLAS Tracker Based on

Barrel and Disc Supports

Effectively two styles of double-sided modules (2×6cm long)

each sensor ~6cm wide (768 strips of 80μm pitch per side)

Hybrid cards carrying read- out chips and multilayer interconnect

circuit

Sensor

Sensor

Sensor

Sensor

Barrel Modules Forward Modules

(Hybrid bridge above sensors) (Hybrid at module end)

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upgrade stave petal programme
Upgrade: Stave+PetalProgramme
  • Designed to minimise material
  • Requirements of automated assembly built in from the start
  • Compatible with current services being reused or similar services cross-section
  • Designs emphasises conservative assembly requirements assuming distributed production
  • All component independentlytestable prior to construction
  • Design aims to be low cost

~ 1.2 meter

Carbon fiber

facing

Bus cable

Carbon honeycomb

or foam

Hybrids

Readout IC’s

Coolant tube structure

Spain: Valencia, Barcelona

UK: Liverpool, RAL, Cambridge, Oxford, UCL, Sheffield, QMUL, Glasgow, ATC-Edinburgh, Lancaster

Germany: Freiburg, DESY, Berlin

Netherlands: NIKHEF

Czech Republic: Prague

USA: Brookhaven, Santa Cruz, SLAC, LBNL, Stonybrook, Yale, NYU, Duke

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slide15

Stave: Hybrids glued to Sensors glued to Bus Tape glued to Cooling Substrate

Glue

Glue

1.2m

1.2m

1.2m

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slide17

ATLAS Stave Electrical Concepts

Need to bring in power at low current and high voltage but deep sub-micron ASICs operate at lower and lower voltages

... either serial powering

... or various proposals to achieve DC-DC conversion (Step down voltage at each module)

S.Burdin / Atlas Tracker Upgrade

cooling
Cooling
  • Evaporative
  • Main requirements:
    • Evaporation temperature max. -35°C on detector.
    • Temperature gradient on detectors: 3°C
    • Total power from 80kW (startup, nominal) to 180kW (after irradiation, with safety)
    • About 1000 circuits
    • All complex items accessible at the scale of 1d
  • Two options:
    • Fluorocarbons
      • Long experience accumulated on the present system
    • CO2
      • Many appealing properties: large latent heat, good heat transfer to cooling pipe wall
      • Experience with the LHCb VELO cooling system

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stave metrology
Stave Metrology

Cold Inlet Temperature: -33oC

Warm/Cold

Laser scanner

BNL-Yale

Warm – Cold (ΔT=54oC)

No significant distortion

Warm: Inlet Temperature: 21oC

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slide20

Features of the Strip Super-Module Concept

  • Key points:
  • Modular concept. All the parts are decoupled from the module design and are modular. Assembled and functional modules are built and tested in early stage and will remain as built.
  • Full module coverage in Z (shorter barrel structure)
  • Rework is a strong point of the module concept –Possible up to the commissioning after integration
  • Design includes hybrid bridge (which could be also glued as for stave modules)
  • Thermal performance show a large safety regarding the thermal runaway
  • End insertion give flexibility for assembly & rework- Allows less commissioning steps
  • 1m20 or even longer stiff LS allows for simpler support structure (compared with SCT)

Super-Module – 12 modules mounted on a local support

End-insertion illustration on pre-assembled barrel structure

KEK & University of Geneva

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slide21

Hybrid Design and Fabrication from Japan

Design from KEK

Hybrid with a carbon bridge

  • FE chip performances as expected:
    • Gain ~ 100 mV/fc
    • Noise ~ 380 e-

Module

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endcaps
Endcaps

C. LacastaValencia

  • The petal concept follows closely the barrel stave concept
  • 5 discs on each endcap
    • 32 petals per disc
    • 116 chips per petal
  • 6 Sensor rings
  • 9 different hybrid types
  • 6 different sensor types
    • 3 short strip sensors
    • 2 medium strip sensors
    • 1 long strip sensors

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summary
Summary
  • Need to replace the ATLAS Inner Detector for SLHC upgrade
  • New Inner Detector will be all silicon
    • 4 pixel layers and 5x2 endcaps
    • 3 short strip layers
    • 2 long strip layers
    • 6x2 endcaps
  • Radiation issues at 3000fb-1 becoming close to manageable at all radii
    • Good performance large area sensors being manufactured by Hamamatsu
    • Good experience with super-module irradiation and complementary programme of hybrid, support and module development
    • R&D programme is progressing well and is reasonably compatible with the latest machine schedules (but time is still really tight)

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