'Solder joints' presentation slideshows

IMPROVING YOUR WAVE SOLDERING

PEM Technologies BRINGING TECHNOLOGY TO THE INDUSTRY. IMPROVING YOUR WAVE SOLDERING. Igmar Grewar Technical Director PEM Technologies. Wave Soldering. Conveyor PCB transported over the wave . The 6 Basic Steps of Wave/Selective Soldering. Component preparation Insert components

5.25k views • 44 slides

Failure Analysis of Solder Joints and Circuit Boards

Failure Analysis of Solder Joints and Circuit Boards. By: Roger Devaney Hi-Rel Laboratories. Typical types of solder joints. PWB ILCs still cause many failures. Laminate stack up. A layer of uncured prepreg is placed on each side.

1.69k views • 43 slides

Fatigue issues

Fatigue issues. 13 kA interconnection one load, resistance SC to SC. SC joint: combined electrical and mechanical tests. Aim Evaluate possible deterioration of the electrical quality of the joint because of the mechanical efforts How Measure the resistance of standard joint

518 views • 39 slides

Fusion of Ultrasound and X-ray Data for Automatic Inspection of Flip Chip and BGA Solder Joints

Fusion of Ultrasound and X-ray Data for Automatic Inspection of Flip Chip and BGA Solder Joints. Ryan Yang 27/02/2009. Presentation Outline. Introduction Acoustic Micro Imaging X-ray Imaging Image Registration Image Fusion Conclusion. Introduction.

501 views • 35 slides

Through-Life Non-Destructive Monitoring of Solder joints using Ultrasound

Through-Life Non-Destructive Monitoring of Solder joints using Ultrasound. Ryan S.H. Yang 04/11/2011 Supervisors: David M. Harvey Guang -Ming Zhang. Presentation Outline. Introduction Reliability Assessment Acoustic Micro-Imaging Experimental Procedure Feature Extraction

471 views • 34 slides

Benefits of Combined 2D and 3D AXI

448 views • 27 slides

TE-MPE-EM Design Office

TE-MPE-EM Design Office. William Billereau. Structure. Design, manufacturing and assembly. Design Office. Planning and subcontracting Technological and commercial choices Ordering, collecting components, tracking Invoicing. 2 staff/ 2 FSU. 1 staff / 10 FSU. Repair. MPGD.

284 views • 19 slides

CricketSat Assembly

343 views • 19 slides

Laboratory of Applied Mechanics and Reliability: Research Activities

273 views • 14 slides

Chelmsford Amateur Radio Society Intermediate Course (10) Soldering

Chelmsford Amateur Radio Society Intermediate Course (10) Soldering. Soldering. The accepted definition of soldering is the joining of metals using a filler material of a lower melting point than that of the parent metals to be joined. Soldering Procedure.

87 views • 7 slides

https://www.advancetech.co.in/products/goot-japan/smd-rework-station/xfc-210 : If you want to Get u201cSmd Rework Stationu201d At An Economical Rate then AdvanceTech.co.in is the right place for you. Because on this website you are able to get assured highest quality with lowest price.

64 views • 6 slides

Press Fit Connector Market is projected to reach 9940 Million US$ by 2025

The Press Fit Connector market was valued at 6800 Million US$ in 2017 and is projected to reach 9940 Million US$ by 2025, at a CAGR of 4.9% during the forecast period. In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for Press Fit Connector.

45 views • 4 slides

Temperature of Solder Contact in Back-Contact Si Solar Cells and Its Effect

Reliability of Si solar modules during thermal cycling and shading conditions strongly depends on the maximum temperature of the solder contact between the solar cells and the cell to cell interconnects http://us.sunpower.com

194 views • 3 slides

Temperature of Solder Contact in Back-Contact Si Solar Cells and Its Effect on

Reliability of Si solar modules during thermal cycling and shading conditions strongly depends on the maximum temperature of the solder contact between the solar cells and the cell to cell interconnects http://us.sunpower.com

198 views • 3 slides

Background:

a. b. (a) CMM solder joints for fracture tests. c. (c) The effects of different parameters on fracture properties of solder joints. (b) Illustration of set-up for high strain-rate mixed-mode fracture test. d. (d) Mode I fracture mechanism map for Sn-3.8Ag-0.7Cu/Cu joints.

238 views • 2 slides

Ni layer on Cu

Ni layer coated with Ag by SLRR. Ni layer on Cu. Ni layer coated with Au by SMG. 50 ML of Ag grown on Au (111) in SLRR Configuration. Bare Au. 60 ML of Ag grown on Au (111) in Local Cell Configuration.

108 views • 2 slides

166 views • 1 slides