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Pixel Pilot system

Pixel Pilot system. Simon Kwan November 8, 2011 Pixel Upgrade Parallel Session. FPIX Pilot Blades with PSI46dig ROC (Roland Horisberger , February CMS Tracker Week). FPIX mechanics, cooling & cabling was originally designed for 3 disks each side.

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Pixel Pilot system

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  1. Pixel Pilot system Simon Kwan November 8, 2011 Pixel Upgrade Parallel Session CMS Upgrade Week, Nov 7-10, 2011

  2. FPIX Pilot Blades with PSI46dig ROC (Roland Horisberger, February CMS Tracker Week) FPIX mechanics, cooling & cabling was originally designed for 3 disks each side. Present installed FPIX system has only 2 disks equipped. All cables, fibres and cooling pipes for 3rd disk exist ! Proposal: After repair of present FPIX during LS1 insert the 3rd disk mechanic and mount a few pilot blades of old design with new digital ROC (PSI46dig) and provide for these blades a few (already existing) readout fibres with old AOH. Can operate and commission new digital ROC under realistic conditions (use CMS tracking as beam telescope) and write all the necessary software changes in DAQ, DB and DQM for a smooth and swift transition for the new upgraded pixel system in 2016/17

  3. Goals for the Pilot System • First and foremost, no or little impact on the operation of the current pixel detector • operation experience in the new ROCs and TBM and digital transmission and readout with the new POH and FED at P5 • Get a head start on DAQ (new FED firmware and software, perhaps new FEC firmware), calibration procedure, DQM • Study how the TBM and FED would handle PKAM events • Study the performance (inefficiency) of new ROC in the high rate environment of the LHC CMS Upgrade Week, Nov 7-10, 2011

  4. General Considerations • No or little impact on the current detector operation • Will use the new PSI46dig ROC and new TBM • Use the same electronic circuits that we plan for the FPIX upgrade detector • New FED; modified DAQ software • What do we gain from doing this than couldn’t be accomplished by doing a full system test of the real components/circuits that we will use for the Phase 1 upgrade • PROS: P5 running in collider environment; head-start on DAQ, DCS, DQM etc; • CONS: resources, diversion from Operation and main Upgrade effort; results may be affected by the existing system constraints

  5. Plan • Build a few blades using the new FPIX 2x8 module design • Mount the new modules on to the Al brazed channel and existing Al ring support (same mechanical support/cooling arrangement as the current FPIX detector) as third disk on one of the existing FPIX half cylinders • The geometrical configuration is similar to the outer assembly for the FPIX upgrade • New HDI, Al cable, (probably) new port card, POHs • CCU board and token ring already exists • Since we are not short of fibers, we have the flexibility of using either TBM_bpix or TBM_fpix with or without the new Datakeeper • Will try to use as close to the new FPIX readout chain as possible CMS Upgrade Week, Nov 7-10, 2011

  6. Pilot System Model CMS Upgrade Week, Nov 7-10, 2011

  7. From Joe Howell

  8. DC-DC Conversion • Upgrade pixel detector will use DC-DC conversion for power distribution • While DC-DC conversion is not needed for the pilot system, we would like to test this as well to learn the operation and control, understand whether there could beany issues (e.g. interference and pick-up by other electronic circuits) • Tentative plan: some modules will be powered by conventional method while some others will be powered by DC-DC converters; build two half disks and install them on different half cylinders CMS Upgrade Week, Nov 7-10, 2011

  9. Parts and hardware Needed • New 2x8 modules using PSI46dig ROC (PSI), new TBM (Rutgers) • New sensor (FNAL contract with SINTEF – expected delivery next Spring; Pixel upgrade working on a new contract with CiS) • Bump bonding ?? (RTI? VTT?) • New Al cable prototype (results see doc #4970); need another submission • HDI (will start design this FY) • POH (prototype tested; re-design under review); but tests done at various places showed that the old AOH should work (see next slides) • New port card (discussion with Sergey and others); but we have done tests to show that the current port card would also work • Other chips (CCU, gatekeeper, TPLL, ALT…); datakeeper?? • Module production & assembly (Purdue, Nebraska, …) • Module test-stand, Full chain readout system test-stand, and DAQ test stand (how many?) • Mechanical support and cooling channel (exist) • New FED (Vienna, Vanderbilt) ; other proposals?? • Power supply , cables, and fibers (exist) • DC-DC converter CMS Upgrade Week, Nov 7-10, 2011

  10. CERN and FNAL AOH Optical Eye Measurements @ 400 Mbps CERN Measurements Amplitude = 107 mW Rise Time = 1.3 ns FNAL Measurements Amplitude = 119 mW Rise Time = 1.45 ns Input Amplitude = 600 mV differential Input signal = 223 -1 PRBS

  11. 1 2 3 4 5 KU Downstream readout tests • Linktester board with FPGA to spit out pattern and program I2C • LCDS driver chip • 1m long Microtwisted pair • AOH/POH mounted on adapter board • Fiber from OH goes to fast O-scope input

  12. KU AOH Eye Diagram Top: LCDS driver  1m micro-twisted pair cable, AOH Bottom: FPGA board to scope directly 400 Mbps Pseudo-random bit result from KU setup 20ns OH out

  13. List of Tasks • ROC testing (performance test, beam test, high rate test, irradiation, SEU etc) • TBM design and test (functionality, irradiation, SEU test) • Sensor (qualification, irradiation, beam test?) • Bump bonding (qualification) • DC-DC converter board • Module test (qualification, characterization, temp cycle, calibration) • System test (full electronics readout chain) • Assembly and testing at TIF • Commissioning at TIF (with the existing pilot detector?) • Installation and test at new repair facility into one of the half cylinders • New FED hardware/firmware/software • FEC firmware • DAQ (stand-alone, integration with rest of FPIX, integration with CMS) • DCS (stand-alone, integration with Tracker DCS) • DQM • Simulation • Tracking • Database

  14. Schedule • LS1 will end late 2014? • PSI46digv1 : which version? Submission in Nov 2011; expect wafers back in Feb/March 2012; tests …..; TBM (FPIX version) design not quite ready • Sensor: available say May/June 2012? • Bump bonding: starts summer 2012 • Al cable: waiting to hear back from vendors on quote; in principle, could go ahead and ask CERN to produce more another batch • Electronics: expect to have them (HDI, POH, Al cable) by the end of CY2012 • Port card: needs to have some idea on Datakeeper (dimension, pinout). But old port card also work with mods (maybe a small adapter to connect the Al cable to the old port card) • DC-DC converter (AMIS5 submission early next year) • proposed milestones to USCMS Management: POH, Port card, and HDI should be completed during FY12 CMS Upgrade Week, Nov 7-10, 2011

  15. M&S Cost CMS Upgrade Week, Nov 7-10, 2011

  16. Interested Parties • CERN (activities to be defined; would like to see the list of tasks first before deciding) • Finland – Helsinki (VTT bump—bonding) • France – Lyon (DAQ) • UK – RAL (DAQ, FED firmware) • US – FNAL, Purdue, Vanderbilt, MRI institutes (KU,KSU, Rice, Rutgers, UIC, UNL, UPR) CMS Upgrade Week, Nov 7-10, 2011

  17. Summary • No show-stopper • Many groups have expressed interest • Good exercise to gain operation experience in CMS for the new readout chain and any mods to the DAQ and power distribution • Modest M&S cost • Instead of a diversion from pixel operation, we could have a larger pool of experts if new people could get involved in the pixel DAQ CMS Upgrade Week, Nov 7-10, 2011

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