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sFGD electronics meeting

sFGD electronics meeting. 23 July 2019. Tour de table Status of main institutes CITIROC costing Main features of electronics (legacy of Baby MIND): Connectivity to photosensors : Sampling of CITIROC trigger outputs: Demonstration with the 10000-cube proto Main constraints: Cost

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sFGD electronics meeting

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  1. sFGD electronics meeting 23 July 2019

  2. Tour de table • Status of main institutes • CITIROC costing • Main features of electronics (legacy of Baby MIND): • Connectivity to photosensors: • Sampling of CITIROC trigger outputs: • Demonstration with the 10000-cube proto • Main constraints: • Cost • B-field • Space • Connectivity • DAQ throughput • Designing the new system: • Baseline layout (pros-cons) • Alternative layout (pros-cons) • Backplane/Patch-panel design • Number of CITIROCs per FPGA • Power consumption studies • Optical module • Power module • Back-end • DAQ • Tools: • Documentation (tool, database, communication) • Electronics-specific Main aim for this meeting: Review basic constraints/requirements Agree on a design process Iterative design process

  3. Number of CITIROCs per FPGA

  4. FEB design tasks

  5. Comparing different ARIA 10 options: COST

  6. Comparing different ARIA 10 options: PIN requirements Quotes

  7. Baseline FEB crate options

  8. sFGD electronics envelope Electronics (FEB) envelope is: ~1900mm x ~200mm x ~600 mm 219 FEB (4 CITIROC/FEB) 222 FEB (4 CITIROC/FEB) 2 kW 2 kW 430 mm 3U (133 mm) 175 mm Standard kit “flexible” SchroffEuropacPRO

  9. FEB layout sFGD FEB Baby MIND FEB 4U 3U 170 100 144 What connectors on sFGD demo board What connectors on sFGD production board Connector dimensions??

  10. Comparing 3U, 4U, 6U Per side (left or right) 4-CITI 6-CITI 8-CITI • *Assuming: • 1 slot for optical module • 1 slot for power module Lots of unused space Crate layout may not be optimal

  11. Backplane design

  12. Mechanics for MPPC to FEB connectivity: Patch panel A few working assumptions (for now): • Patch panel is both: • Mechanical interface • Electrical interface • No direct/easy geometrical alignment between: • cable connector from MPPC_PCB cable on one side of patch panel • FEB connector on other side of patch panel • So…patch panel becomes a more complex object with special routing between MPPC_PCB connector and FEB connector. • But advantage is we decouple functionalities: two standalone sub-systems: • Cubes + MPPC_PCB + cables + patch panel • Electronics rack + cooling • Patch panel made of sub-units and swivels by 90o: • SAMTEC connectors: • Horizontal connectors seem better (from very first impressions) • Avoid multiple mating/dematingcycles Patch panel Patch panel Vertical FEB insertion Horizontal FEB insertion FEBs Cables Mismatch between FEB pitch and cable connector pitch to check Cables FEB

  13. Mechanics for MPPC to FEB connectivity: MPPC side 2 positions for Samtec connectors on PCB Flavour2 Flavour1

  14. Mechanics for FEB 84 HP = 426.72 mm FEB pitch = 20.32 mm 21 slots per crate FEB dimensions 100 mm 165 mm • Conversion factors: • 1 U = 1.75 in = 44.45 mm • 1 HP = 1/5 in = 5.08 mm

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