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Command & Data Handling PCB Build Procedure

Command & Data Handling PCB Build Procedure. RockOn! 2008. What Are We Building?. RockOn! 2008. The C&DH PCB 1:. The C&DH PCB 2:. AVR Board. Z-Accel. Board. Data Board. Organization:.

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Command & Data Handling PCB Build Procedure

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  1. Command & Data Handling PCB Build Procedure RockOn! 2008

  2. What Are We Building? RockOn! 2008

  3. The C&DH PCB 1:

  4. The C&DH PCB 2: AVR Board Z-Accel. Board Data Board

  5. Organization: The boards may seem like an array of confusing electronics, but one can easily break the board into smaller subsystems of related components. This build is organized by different sub systems integral to the board.

  6. Integral Systems: • ATMega 32L Microprocessor • 2 MB Flash Memory • 0-15 Psi Pressure Sensor • 3-Axis Acceleration • Temperature Sensor • In-System-Programming • Power Regulation

  7. Safety/Background RockOn! 2008

  8. Board Safety: Caution: Many of the components used in this workshop are sensitive to electrostatic discharge (ESD). Please ensure that you are wearing your protective wrist strap at all times. There will be a warning slide when components are ESD and heat sensitive. Clipping leads can sometimes cause them to separate in a rapid manner that could cause injury. Please take caution when clipping leads. Wear your safety glasses at ALL TIMES!

  9. Reading a Resistor: The resistors in this workshop have already been organized by value. In the event that your resistors get mixed, please refer to the chart at the left to classify your resistors, or use your multimeter If you are unsure, don’t hesitate to raise your hand and ask for assistance.

  10. Verifying Kit Contents RockOn! 2008

  11. Kit Contents—PCBs: • PCBs: • One (1) Main Board • One (1) Data Board • One (1) Z Accel. Board • One (1) XY Accel. Board • Note: All boards were tested in-house and are currently in working order.

  12. Kit Contents—PCBs: • PCBs: • One (1) Main Board • One (1) Data Board • One (1) Z Accel. Board • One (1) XY Accel. Board • Note: All boards were tested in-house and are currently in working order.

  13. Kit Contents—Resistors: • Resistors: • Two (2) 1 K Ω Resistors • R8, R9 • Eight (8) 10 K Ω Resistors • R1, R2 R3, R4, R5, R6, R10, R11 • One (1) 3.3 K Ω Resistors • Indicator • One (1) 100 K Ω Resistor • R7

  14. Kit Contents—Capacitors: • Capacitors: • Eleven (11) .1 μF Capacitors • C2, C3, C4, C5, C6, C7, C8, C9, CX, CY, CZ • One (1) 1 μF Capacitor • C10 • One (1) 10 μF Capacitors • C1

  15. Kit Contents—Data: • Data: • One (1) ISP Cable • Ten (10) 2X1 Headers • One (1) 3X1 Header • One (1) 4X1 Header • Three (3) 3X2 Right Angle Headers

  16. Kit Contents—LEDs: • LEDs: • Two (2) red LEDs

  17. Kit Contents—DIPS/ICs/Pres. Sens. 1:

  18. AVR DIP DB9 Conn. AVR Press. Sens LS DIP LS Kit Contents—DIPS/ICs/Pres. Sens. 2: • DIPS/ICs/Press. Sens.: • One (1) AVR DIP • One (1) AVR • One (1) Level Shifter (LS) • One (1) LS DIP • One (1) Pressure Sensor • One (1) DB9 Connector

  19. Kit Contents—Miscellaneous 1:

  20. Red LED G-Switch Green LED Z-Acc. Conn. Jumper Kit Contents—Miscellaneous 2: • Miscellaneous: • One (1) Red LED • One (1) Green LED • One (1) G-Switch • One (1) Jumper • One (1) Z-Accelerometer Connector

  21. Kit Contents—Miscellaneous 3: • Miscellaneous: • Wires: • Three (3) Blue • Three (3) Red • Two (2) Black Blue Red Black

  22. Kit Contents—Transistors: • Transistors: • One (1) NPN Transistor • T1 • One (1) PNP Transistor • T2

  23. Kit Contents—VREGS: • VREGS: • One (1) 5V VREG • One (1) 3.3 VREG

  24. Kit Contents—Diodes: • Diodes: • Three (3) Diodes • D1, D2, D3

  25. Board Check: 2 1 3 • Check to ensure that your boards have: flash memory (1), a level shifter (2), and four accelerometers (3). • Please raise your hand if any components are missing.

  26. Let’s Begin! RockOn! 2008

  27. Current Sub System: Power Sub System: Activation Power Regulation Construction Sensor Sub System: Temperature Sensor Pressure Sensor X & Y Axis Accelerometers Z Axis Accelerometers Geiger Counter Interface Command and Data Handling: In-System Serial Programming (ISP) Data Retrieval

  28. RBF/G-Switch Headers: RBF Pin G-Switch • Solder two (2) of the 2X1 headers into the footprints labeled RBF Pin and G-Switch. • As always, ensure they are flush with the board.

  29. On and RDY Headers: RDY On • Solder two more (2) of the 2X1 headers into the footprints labeled On and RDY. • These headers will be used for indicator LEDs.

  30. Power Header 1: On • Solder one (1) of the 2X1 headers into the footprint labeled Power. • This is the primary power header.

  31. Power Header 2: Power • There is a secondary power header on the opposite side of the board. DO NOT install this header.

  32. Pre-Bending: • Pre-Bending 101: • Pre-bending is a technique that allows components to be easily inserted into a PCB. • Pre-bending also allows components to lay more flush with the board. • Bending components to the correct bend radius takes practice, but mastering the technique will reap rewarding benefits!

  33. Pre-Bending: • Pre-Bending 101: • Start with the bending and prodding tool in the position shown in the top picture. • Choose a location along the length of the tool that will yield the appropriate bend radius. • Use your thumb to bend the lead such that the component and lead are orthogonal. 90°

  34. Diodes: Left: Diode as it comes in the kit. Right: Bent diode ready for installation. • Take three (3) diodes from your supplies and use the supplied bending and prodding tool to bend the leads at 90 degrees as shown above.

  35. D2 D3 D1 Black and white overlay Diodes (D1-D3): • Solder one (1) of the bent diodes into the footprint labeled D1 on the board. • Note: Diodes are polarized and the black line on the diode must overlay the while line on the footprint.

  36. D2 D3 D1 Diodes (D1-D3): • Solder one (1) of the bent diodes into the footprint labeled D2. • Check polarity.

  37. D2 D3 D1 Diodes (D1-D3): • Solder one (1) of the bent diodes into the footprint labeled D3. • Check polarity.

  38. ESD ESD/Heat Concern: WARNING: The following components are extremely ESD and heat sensitive! ESD is electrostatic discharge caused by built up charge on your person from not wearing your protective ESD wrist strap. When soldering heat sensitive components, use the guideline 2-3 on, 8-10 seconds off.

  39. Transistors: Above: Bent NPN transistor, T2. Above: Bent power transistor, T1. • Take the power transistor, T1, and the NPN transistor, T2, from the kit and use the bending and prodding tool to bend the leads as shown above. • Note: Advance to the next slide/page to place these transistors in their footprints to determine the bend location and radius.

  40. Transistors (T1): T1 • Solder the power transistor, T1, into its footprint and ensure that the bend allows it to lay flush with its heat sink. • Ensure that T1 is flush with the heat sink BEFORE soldering it into its footprint. • DO NOT solder T1 to the heat sink.

  41. Transistors (T2): T2 • Place and solder the bent NPN transistor, T2, into its footprint and ensure that the bend allows it to lay flush with the board.

  42. Transistors (T2): T2 • Place and solder the bent NPN transistor, T2, into its footprint and ensure that the bend allows it to lay flush with the board.

  43. Resistors: • The next several steps install the resistors for the power sub system. There are four (4) different types of resistors for this sub system: 10K, 100K, 1K, and 3.3K. • The resistors will lay more flush with the board if the bending and prodding tool is used first to bend the resistors are shown above.

  44. Resistors (10K): R2 R3 R4 R10 • Bend four (4) of the 10K resistors in the kit as indicated previously and solder them into footprints R2, R3, R4, and R10.

  45. Resistors (1K): R8 • Bend one (1) of the 1K resistors in the kit as indicated previously and solder it into footprint R8.

  46. Resistors (1K): R9 • Bend one (1) of the 1K resistors in the kit as indicated previously and solder it into footprint R9.

  47. Resistors (100K): R7 • Bend one (1) of the 100K resistors in the kit as indicated previously and solder it into footprint R7.

  48. Power System Test 1: 9V Supply, Flight Pin, RDY LED RockOn! 2008

  49. Power System Test 1: • Take out the multimeter that was provided. • Insert the red plug into the port labeled VΩHz. • Insert the black plug into the port labeled COM. • DO NOT turn it on at this point in time. COM VΩHz

  50. Power System Test 1: - Turn on the multimeter. - Turn the dial to the 20V setting. - Place the red lead on the positive battery terminal. - Place the black lead on the negative battery terminal. - If you do not get a reading of above 9V, raise your hand.

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