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Design and Layout Considerations for 8-Channel LVDS E-Board by David Nelson

This document outlines the current status and considerations for the design and layout of the 8-channel LVDS E-Board. Key points include the arrangement of wires on the board, decision on wire gauges, and the possibility of increasing the E-Board length to 67 mm. Both B-layer and Layer 1&2 schematics are identical, and a review of deliverables is necessary. Cooling requirements and the need for custom-made wires are also addressed, along with the preference to utilize specific connectors for optimal performance.

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Design and Layout Considerations for 8-Channel LVDS E-Board by David Nelson

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  1. Pixel nSQPE-board Presented by David Nelson djn@slac.stanford.edu

  2. Status(1) • Arrangement of wires on board • Determined during board layout. Need new 8 channel LVDS foot-print. • Bundle organization/wire gauges • Bundle organization will be determined with E-Board layout • Base line is 28 CCAL for data & 36 Cu for Cmd & Clk • Increase of the E-board length • OK to increase to 67 mm • Both B-layer and Layer 1&2 schematics are identical. • OK to make all E-Boards identical?

  3. Status(2) • Cooling issue • ~0.25 watt-0.30 watt per E-board shouldn’t need any additional cooling. • Connectors • There is a strong desire to use connectors on E-board such as the JAE 60 pin • Wire issues • Wire will be custom made which takes 8 weeks to manufacture. Should we order? • Deliverables review.

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