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Pixel nSQP Update on the e-board, cable board, data transmission line, e-board thermal test

Pixel nSQP Update on the e-board, cable board, data transmission line, e-board thermal test. Presented by David Nelson djn@slac.stanford.edu. E-Board status. E -board layout is finished Gerber files sent to Danilo

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Pixel nSQP Update on the e-board, cable board, data transmission line, e-board thermal test

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  1. Pixel nSQPUpdate on the e-board, cable board, data transmission line, e-board thermal test Presented by David Nelson djn@slac.stanford.edu

  2. E-Board status • E-board layout is finished • Gerber files sent to Danilo • Jens Dopke & company is suggesting to change the JAE 80 pin connector to a Samtecwhich should have better delivery and not obsolete.

  3. Cable Board status • Cable board layout is finished • Gerber files sent to Danilo

  4. Status • Thermal test • Marco brought 3 PP0 C side boards which is longer than the A side PP0 board we did the first test with. • We purchased and received steal boxes large enough for the longer PP0 boards. • We need to assemble the thermal tests into the new box. • We received the e-board thermal PCBs • Marco will give status further status. • Data transmission • See additional presentation by Martin Kocian

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