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Materials and Manufacturing in Electronics Prof. Dr.-Ing. Jürgen Villain University of Applied Sciences Augsburg, Germany Department of Electrical Engineering. COST 531 Meeting 14.1.2003 Berlin. Lectures and Team. Lectures Materials Science for Engineers Manufacturing in Electronics

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slide1

Materials and Manufacturing in Electronics

Prof. Dr.-Ing. Jürgen Villain

University of Applied Sciences Augsburg, Germany

Department of Electrical Engineering

COST 531 Meeting

14.1.2003

Berlin

slide2

Lectures and Team

  • Lectures
  • Materials Science for Engineers
  • Manufacturing in Electronics
  • Packaging
  • Design and Strength of Materials
  • Team in the Lab
  • Dipl.-Ing. T. Qasim (material science)
  • Dipl.-Ing. Ch. Weippert (crystallography)
  • Dipl.-Ing. (FH) A. Svetly (mechanical engineering)
  • J. Pahl (material test)
  • E. Hundt (measuring technique)
  • Students, candidate for a doctor`s degree
slide3

Topics of Research

  • Influence of structure on the mechanical behaviour of metals
  • Determination of mechanical properties of small specimens depending on temperature and strain rate
  • Size effect on mechanical properties of metals in electronics
  • Vapour-phase soldering of lead-free solder materials
  • Creep behaviour of solder materials
  • Formation of intermediate phases in small solder volumes
slide4

Equipment of the Lab

Macro and micro tension test machines (0.5 N – 500 N, -55 °C/250 °C)

Pull- and Shear-Test

Creep Test (RT/200 °C)

Laser extensometer

Special clamping jaws for small specimens

Micro-hardness tester

SEM with EDX (tension and creep tests inside possible)

X-ray fluorescent analysis

Thermal shock

Vapour-Phase soldering

Wetting tester

Ovens

slide5

Tools for small specimens

Special clamping

jaws for

small Cu-Foils

(10 µm - 250 µm)

Tensile module for small specimens

(part of SEM)

slide6

Determination of mechanical properties of small

specimens depending on temperature and strain rate

Elongation at rupture of Sn43Bi57

for different temperatures and

strain rates

Tensile strength of Sn43Bi57

for different temperatures and

strain rates

Material parameters describing exactly the material behaviour of electronic devices under working conditions are necessary for thermo-mechanical simulations.

slide7

Size Effect on Mechanical Properties of Copper Foils

The smaller the tested volume the lower the ductility !

slide8

Manufacturing and Reliability of Lead-Free-Solders

Topics: Manufacturing parameters, shear and tensile strength, creep-

behaviour, migration, intermediate compounds

Solder materials: Sn91Zn9, Sn43Bi57, Sn96.5Ag3.5, Sn93.5Ag3.8Cu0.7Bi2(4)

slide9

Phase Formation in Small Solder Volumes

(intermediate phases)

Sn43Bi57, device Sn,

Pad: Cu/Ni/Au

Sn91Zn9, device Sn,

Pad: Cu/Ni/Au

Small solder volumes are out of thermodynamic equilibrium and consist mainly of intermediate phases (3 – 5 elements) with almost completely unknown material properties.

slide10

Creep behaviour of solder materials

60Sn40Pb, Qm = 0.73 eV

The creep behaviour of

solder materials at high

homologous temperatures

can be described using a

viscoplastic equation.

e(t,T,s)=so J(t) as aT

43Sn57Bi, Qm = 0.76 eV

91Sn9Zn, Qm = 1.01 eV

96.5Sn3.5Ag, Qm = 0.87 eV

Lowest homologoues temperature, highest homologoues stress

slide11

Round phases

Dendritic or scorched phases

Comparison of Activation Energies

and Time-Temperature Shift-Factor

slide12

Size Effect on Creep Behaviour of a Solder Material

Sn60Pb40, stress 5 N/mm2, same structure, same strain rate.

The smaller the tested volume

the lower the creep resistance.

slide13

Further investigations

Analysis of metallic and intermediate phases of small solder volumes

Determination of the mechanical behaviour of eutectic and non eutectic solder materials with regard to structure and tested volume under experimental and numerical view