1 / 13

Process Technology

Process Technology. Sang-Uk Ahn Process Technology Development. Major Process Modules. Isolation (Shallow Trench). Twin Well (Retrograde). Transistor Formation. Multi-level Metallization. Process Feature. Process Feature (cont.). Design Rule. Device Performance. PO NIT. PO OX. MET 5.

lortiz
Download Presentation

Process Technology

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Process Technology Sang-Uk Ahn Process Technology Development

  2. Major Process Modules Isolation (Shallow Trench) Twin Well (Retrograde) Transistor Formation Multi-level Metallization

  3. Process Feature

  4. Process Feature (cont.)

  5. Design Rule

  6. Device Performance

  7. PO NIT PO OX MET 5 GATE IMD 4 VIA 4 MET 4 Poly DRAIN SOURCE IMD 3 P+ P+ VIA 3 MET 3 N-well IMD 2 VIA 2 MET 2 IMD 1 VIA 1 MET 1 PMD OX CONT ISO OX Pwell Contact NWELL P-ch transistor N-ch transistor Nwell Contact PWELL SUBSTRATE Cross Sectional View - Stacked Via aa XXXXC07 Process

  8. Transistor Structure PETEOS HSQ Metal 1

  9. 0.64 um IMD Profile PETEOS HSQ Metal 1 Metal 1 CD : 0.32 um @ Structure : Ti/TiN/Al-Cu/TiN

  10. Construction Analysis ( SRAM Cell : Stacked Via ) IMD3 Metal 3 stack SOG Via2 IMD2 Metal 2 stack SOG Via1 IMD1 SOG Metal 1 stack W-C/T PMD Tr.

  11. SEM Cross Sectional View- Stacked Via

  12. Rule Based OPC • Correct the specific features • according to the rules OPC Implementation • Purpose • To compensate proximity effect of wafer processing • Model Based OPC • Impose an inverse distortion • to cancel the proximity effect

  13. Model Based OPC Rule Based OPC Layout w/ Model Based OPC Layout w/ Rule Based OPC OPC Example

More Related