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Micron Seppuku

Micron Seppuku. SVD meeting. Last week’s status. Large clipping found on small side of sensor Received confirmation from Micron that damage was done in company They have three further wafers ready Currently under test at Micron. Progress since last week.

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Micron Seppuku

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  1. Micron Seppuku Thomas Bergauer (HEPHY Vienna) SVD meeting

  2. Last week’s status • Large clipping found on small side of sensor • Received confirmation from Micron that damage was done in company • They have three further wafers ready • Currently under test at Micron Markus Friedl (HEPHY Vienna)

  3. Progress since last week • We measured sensor bow => NO bow, sensor fully flat • During handling, I dropped the sensor from 5cm to marble plate of CMM • Huge damage on one corner • Sumimasen! Markus Friedl (HEPHY Vienna)

  4. Another long-term test to verify function • Although large crack, IV looks almost like before • However, long-term behavior unstable Markus Friedl (HEPHY Vienna)

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