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On Effective and Efficient In-Field TSV Repair for Stacked 3D ICs. Presenter : Li Jiang Li Jiang † , Fangming Ye * , Qiang Xu † Krishnendu Chakrabarty * , and Bill Eklow § † CU hk RE liable C omputing Laboratory The Chinese University of Hong Kong * Duke University § Cisco. Outline.

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On effective and efficient in field tsv repair for stacked 3d ics

On Effective and Efficient In-Field TSV Repair for Stacked 3D ICs

Presenter: Li Jiang

Li Jiang†, Fangming Ye*, QiangXu†

KrishnenduChakrabarty*, and Bill Eklow§

†CUhkREliableComputing Laboratory

The Chinese University of Hong Kong

*Duke University

§ Cisco


  • Introduction

  • Related Works and Motivation

  • In-field TSV Repair Framework

  • Repair Algorithm

  • Experimental Results

  • Summary

Tsv latent defects
TSV Latent Defects

CTE-induced Crack

EM-induced Void





Signal Latency

Open Defect

[Jung et al., ICCAD’11]

[Frank et al., IRPS’11]

Tsv repair schemes neighboring repair
TSV Repair Schemes: Neighboring Repair



[Jiang et al., DATE’12]

[Kanget al., JSSC’10]

To avoid Aging “hotspot”, we use signal-rerouting as our hardware infrastructure


  • Existing repair methods are deterministic

    • Unaware of timing

      violating timing requirement after repair

    • Hard to determine “faulty” TSV:A faulty TSV linking to a particular signal might be a good one if it links to another signal instead

    • “Faulty” TSV propagation may render the entire TSV grid irreparable

  • Repair solutions directly affect circuit lifetime reliability

Hardware architecture
Hardware Architecture

Periodically On-line test

In-field TSV Repair



Repair Solution Validation

Circuit aging can also be detected

Repair algorithm
Repair Algorithm

Signal-TSV pair graph: no confirmed timing violation

Flow graph: routability checking



Matched ST Pairs

Repair Channels

Potential ST Pairs

Residual Channels

Maximal Matching = #Signal

Test cost is too high in the runtime

Finding the maximal matching

Repair algorithm1
Repair Algorithm

To reduce test time

Tested ST-Pairs

Avoid redundant test

Previous Matching

Current Matching

Simultaneously Testing

Test ST pairs from next matching in advance

Next Matching


Not Tested ST-Pairs

Spare tsv sharing
Spare TSV Sharing

How to solve the conflict of using shared spares?

Merge STpair-graphs into connected STpair-graph

Experimental setup
Experimental Setup

  • Modified Router based Repair Scheme

  • MF: Continue repair if “new fault” occurs

  • MF’: Restore repair if “new fault” occurs

  • Proposed Repair Algorithm

  • MV: Match with Verified routability

  • MR: With test time reduction

  • MS: With spare TSV sharing


Benchmark: IWLS 2005 OpenCore benchmarks

data encryption standard (DES) circuit

fast-Fourier transform (FFT) circuit

  • Aging Effect:

  • Characterized by additional latent delayin TSVs, reflected as resistance increase in terms of time t.

  • [Frank et.al, IRPS’11], [Ye et al. DAC’12]

  • Parameters: TSV aging coefficient a, TSV initial resistance R

  • Following Normal Distribution


Varied aging coefficients with fixed initial resistance


  • First work targeting on in-field TSV repair

  • An efficient TSV repair algorithm that is able to significantly improve MTTF of TSV through the judicious use of spares

  • Redundancy sharing technique can tolerate aging “hotspots”


8x8 TSV grid size repair architecture with varied aging coefficients

varied rerouting delay between two adjacent routers (ps)