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RIT Senior Design Project 10662 D3 Engineering Camera Platform . Friday November 6, 2009 9:00am to 11:00am. Team Members . Gregory Hintz (EE) Project Manager Samuel Skalicky (CE) Lead Engineer, FPGA Board Jeremy Greene (EE) Connector Board Jared Burdick (EE) Power

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rit senior design project 10662 d3 engineering camera platform

RIT Senior Design Project 10662D3 Engineering Camera Platform

Friday November 6, 2009

9:00am to 11:00am

team members
Team Members
  • Gregory Hintz (EE)
    • Project Manager
  • Samuel Skalicky (CE)
    • Lead Engineer, FPGA Board
  • Jeremy Greene (EE)
    • Connector Board
  • Jared Burdick (EE)
    • Power
  • Michelle Bard (ME)
    • Environmental
  • Tony Perrone (ME)
    • Physical Design
advisors
Advisors
  • Scott Reardon (D3 Engineering)
  • Kevin Kearney (D3 Engineering)
  • Dr. Robert Kremens (RIT-Imaging Science)
  • Philip Bryan (RIT – Industry Guide)
project status
Project Status
  • Risks
  • BOM
  • Analysis
  • Feasibility
  • Designs
  • Test Plans
schedule for the design review
Schedule for the Design Review
  • Overview
    • Gregory Hintz
  • Electrical Discussion
      • Processor Board and FPGA
        • Samuel Skalicky
      • Connector Board, INS System
        • Jeremy Greene
  • Mechanical Discussion
      • System Design
        • Tony Perrone
      • Environmental Concerns
        • Michelle Bard
what is the customer looking for
What is the Customer Looking for?

Integrate supplied components

Ruggedized Unit

Flight-capable package

Can record and transmit

Capable of processing

supplied components
Supplied Components

Customer Needs Met

External INS units

Data processing (overlay)

Real time viewing

Store full-res. Data during flight

Support NovAtel GNSS board

  • Integrate supplied components
    • 10MP Visual Band Camera
    • 1.3MP IR Camera
    • Spatial Sensors
      • NovAtel OEM Board OEMV3
      • NovAtel OEM Board OEMV2
    • Camera Processing Board
  • Capture data from two cameras
  • Capture 10MP @ 1fps
  • Capture 1.3MP @ 30fps
  • Capture INS data @ 30/sec

(simultaneously)

camera components
Camera Components

Customer Needs Met

External INS units

Data processing (overlay)

Real time viewing

Store full-res. Data during flight

Support NovAtel GNSS board

  • Integrate supplied components
    • 10MP Visual Band Camera
    • 1.3MP IR Camera
    • Spatial Sensors
      • NovAtel OEM Board OEMV3
      • NovAtel OEM Board OEMV2
    • Camera Processing Board
  • Capture data from two cameras
  • Capture 10MP @ 1fps
  • Capture 1.3MP @ 30fps
  • Capture INS data @ 30/sec

(simultaneously)

camera components1
Camera Components

Customer Needs Met

External INS units

Data processing (overlay)

Real time viewing

Store full-res. Data during flight

Support NovAtel GNSS board

  • Integrate supplied components
    • 10MP Visual Band Camera
    • 1.3MP IR Camera
    • Spatial Sensors
      • NovAtel OEM Board OEMV3
      • NovAtel OEM Board OEMV2
    • Camera Processing Board
  • Capture data from two cameras
  • Capture 10MP @ 1fps
  • Capture 1.3MP @ 30fps
  • Capture INS data @ 30/sec

(simultaneously)

spatial sensing
Spatial Sensing

Customer Needs Met

External INS units

Data processing (overlay)

Real time viewing

Store full-res. Data during flight

Support NovAtel GNSS board

  • Integrate supplied components
    • 10MP Visual Band Camera
    • 1.3MP IR Camera
    • Spatial Sensors
      • NovAtel OEM Board OEMV3
      • NovAtel OEM Board OEMV2
    • Camera Processing Board
  • Capture data from two cameras
  • Capture 10MP @ 1fps
  • Capture 1.3MP @ 30fps
  • Capture INS data @ 30/sec

(simultaneously)

output ins data format
Output INS data format

# of shot, (FLIGHT INFORMATION, Pitch, ect….)

675,495060.000000,39.377116,-82.774721,1442.237213,177.966706,-6.573488,87.156026

676,495063.000000,39.375698,-82.773364,1437.212509,178.655193,-2.978762,89.591399

677,495066.000000,39.374288,-82.771967,1432.054779,177.896426,-3.434334,92.544970

678,495069.000000,39.372892,-82.770509,1428.557648,177.391126,-12.302477,92.517868

679,495072.000000,39.371514,-82.768882,1425.166306,178.138512,-9.035039,88.154010

680,495075.000000,39.370128,-82.767133,1425.035141,176.875920,-1.502685,89.783104

681,495078.000000,39.368761,-82.765407,1424.326828,176.056416,-6.737449,90.066296

682,495081.000000,39.367471,-82.763622,1421.768311,175.569431,-7.973052,88.809422

683,495084.000000,39.366537,-82.761748,1427.402252,176.045872,-7.985133,86.404080

processing elements
Processing elements

Customer Needs Met

External INS units

Data processing (overlay)

Real time viewing

Store full-res. Data during flight

Support NovAtel GNSS board

  • Integrate supplied components
    • 10MP Visual Band Camera
    • 1.3MP IR Camera
    • Spatial Sensors
      • NovAtel OEM Board OEMV3
      • NovAtel OEM Board OEMV2
    • Camera Processing Board
  • Capture data from two cameras
  • Capture 10MP @ 1fps
  • Capture 1.3MP @ 30fps
  • Capture INS data @ 30/sec

(simultaneously)

oem digital signal processing board
OEM Digital Signal Processing Board

Signal Processing already done on Customer Supplied Interface.

Image overlay

Compression

Resolution of Images

Outputs

10/100 Ethernet

S-Video

Software interface available

processing elements1
Processing elements

Customer Needs Met

External INS units

Data processing (overlay)

Real time viewing

Store full-res. Data during flight

Support NovAtel GNSS board

  • Integrate supplied components
    • 10MP Visual Band Camera
    • 1.3MP IR Camera
    • Spatial Sensors
    • Camera Processing Board
  • Capture data from two cameras
  • Capture 10MP @ 1fps
  • Capture 1.3MP @ 30fps
  • Capture INS data @ 30/sec

(simultaneously)

processing elements2
Processing Elements

DSP

  • Energy Efficient
  • Single Pipeline
  • Easy Implementation
  • Math based ISA

FPGA

  • Inputs/Outputs
  • Flexible Architecture
  • Faster Speed
  • Parallel Processing
slide28
DSP
  • Customer programmable
    • Encoding/Decoding media
    • Peripherals
  • Role in this design
    • Image compression
    • Real time streaming of data
    • INS interface
  • Required skills
    • Implementable Knowledge of C
    • DSP/BIOS
slide29
FPGA
  • FPGA Selection
    • Quicker time to fabrication
    • Supreme configurability/Field reprogrammable
    • Has the I/O needed
    • Parallel processing
slide30
FPGA
  • Xilinx Selection
    • Resources available to the team
    • Larger range of choices than other companies
    • Customer preference
  • Model XC6SLX75T Selection
    • Package size (23mm x 23mm)
    • High speed transceiver count
    • I/O pin count
    • Cost effectiveness
data flow initial design
Data Flow – Initial Design
  • Pictures
  • Camera  FPGA OEM
  • INS Data
  • INS  OEM
data flow final design
Data Flow – Final Design
  • Pictures
  • Camera  FPGA  OEM
  • Camera  FPGA  HD
  • INS Data
  • INS  OEM  FPGA  HD
data speeds
Data Speeds
  • Image
    • IR: 30 images / second
      • VGA=640x480
      • 9.2 MHz
    • Visible :1 image / second
      • 10.7MP=3664x2748
      • 10.07 MHz
  • INS
    • 30 captures / second
      • 1kB=8kb
      • 8000 baud

**Note: baud = bits per second (RS-232)

fpga pin speeds
FPGA Pin Speeds
  • Minimum values
    • 13ns -> 76 MHz
    • 5ns -> 200 MHz
external interfaces and the connector board
External Interfaces andthe Connector Board

2x GigE

2x Camera Link

10/100 Ethernet

Power

Supply

External INS

Connector Board

D3 OEM Board

external interfaces and the connector board1
External Interfaces andthe Connector Board

Power

Supply

External INS

2x Camera Link

2x GigE

RCA output

10/100 Ethernet

USB port

Connector Panel

external interfaces and the connector board2
External Interfaces andthe Connector Board
  • Goal:
    • All interfaces routed through and mounted on the Connector Board
  • Reality:
    • Various different mountings and routings necessary
interface routing and connector mounting
Interface Routing andConnector Mounting

2x Camera Link

External INS

Power Supply

  • 2x Camera Link = nearly full width of Connector Board

Connector Panel

interface routing and connector mounting1
Interface Routing andConnector Mounting
  • GigE mounted on FPGA Board

2x GigE

FPGA Board (bottom view)

Connector Panel

interface routing and connector mounting2
Interface Routing andConnector Mounting

RCA

10/100 Ethernet

  • RCA and 10/100 Ethernet routed directly to D3 OEM Board

10/100

Ethernet

RCA output

D3 OEM Board (top view)

Connector Panel

interface routing and connector mounting3
Interface Routing andConnector Mounting

USB port

  • USB routed directly to internal GNSS receiver

Connector Panel

the connector board
The Connector Board
  • Having determined what it needs to do, design could commence

Customer Provided Block Diagram

inertial navigation system ins
Inertial Navigation System (INS)
  • Determines:
    • Direction
      • Roll, pitch & yaw
    • Velocity
      • Inertial Measurement Unit (IMU)
    • Location
      • Global Navigation Satellite System (GNSS)
        • Global Positioning System (GPS)
        • GLONASS
global navigation satellite system
Global Navigation Satellite System
  • Customer Specified
    • NovAtel OEMV-2 or OEMV-3
      • RS-232 interface
      • Different power requirements

OEMV-2: 3.3 +5%/-3% VDC

OEMV-3: 4.5 to 18 VDC

chassis interfaces
Chassis Interfaces

Interface to Plane

chassis interfaces1
Chassis Interfaces

Interface to Plane

  • 10.25” Long
  • 6” Wide
  • 6.5” Tall
  • 10.9lbs
chassis interfaces2
Chassis Interfaces

Interface to Plane

chassis interfaces3
Chassis Interfaces

D3 OEM Board

NovAtel OEMV-3

FPGA Board

Connector Board

Solid State Hard Drive (Not Pictured)

chassis interfaces5
Chassis Interfaces

LinosMevis-C Lenses (16 mm)

MicroStrain IMU

Camera Boards

vibration damping
Vibration Damping

Two sources of need:

  • Insure structural integrity under vibration
  • Minimize image distortion

Item 1 must be tested for, but item 2 can be calculated and designed for.

vibration damping1
Vibration Damping
  • Characterized per RTCA DO-160
  • Frequency Range: 5 – 500 Hz
  • Amplitude Range: 0.00001 – 0.1 inches
  • 3 Primary Axes
vibration damping2
Vibration Damping
  • Image distortion depends on:
    • Aircraft Speed
    • Aircraft Altitude
    • Lens Image Angle
    • Shutter Speed
vibration damping3
Vibration Damping
  • Speed induced byvibration taken as derivative of vibration motion profile
  • Profile:X = A·sin(F·t)
  • Speed: X’ = A·F·cos(F·t)
vibration damping4
Vibration Damping
  • Maximum Aircraft Speed: 36 m/s
  • Maximum Vibration Speed: 1.27 m/s
environmental needs
Environmental Needs

Maintain internal temp within operating temp of components

Optics:

10 Mp cameras

-40 < 0 < 70

  • Electronics (all temps in C)
      • FPGA
          • 0 < T < 85
      • Connector Board
          • 0 < T < 70
      • D3 supplied OEM Board
          • -40 < T < 85
    • Electronics Range
      • 0C < T < 70C
environmental needs1
Environmental Needs
  • Allow for standard Environmental conditions as defined by MIL-STD-810G and DO-160

Temperature Range:

-32C to 45 C (on ground)

Humidity:

90%

environmental management heat
Environmental Management: Heat
  • Major sources of heat generation inside chassis
    • Hard drive
      • about the half the heat produced comes from this
    • Voltage Regulator
    • FPGA
    • DSP
  • Net Heat generated by system can be estimated using the net power input to the system
environmental management heat transfer analysis
Environmental Management:Heat Transfer analysis

Heat Transfer model: assuming a steady state

  • Radiation
    • Least efficient mode
    • Model as black body
      • From electronics to chassis
      • From chassis to external environment
    • Model dependant primarily on surface area of components

q rad

  • T Chassis
  • TAmbient
environmental management heat transfer radiation model

Chassis wall

T chassis

T ambient

q chassis

T chassis

q board

Board stack

T boards

Environmental ManagementHeat Transfer: radiation model
  • Treat enclosure as a black box radiating heat to the outside air
    • Neglect Convection
      • Protected from moving air
    • Neglect Conduction
  • Temperature at surface of chassis = temperature inside of chassis
  • Heat radiating from chassis is 50% of heat radiating from boards (qc = .5qb)
environmental management heat transfer radiation model1
Environmental ManagementHeat Transfer: radiation model

Used a ‘double’ radiation model

    • Radiation from electronics to chassis wall
    • Radiation from chassis wall to outside environment
  • Combined the two models into one by assuming an efficiency between the heat transfer rate of the electronics and the chassis wall
environmental management heat transfer radiation model2
Environmental ManagementHeat Transfer: radiation model

‘Safe zone’ between ~ 10 and ~ 30 W

environmental management humidity dew point should we be concerned with condensation
Environmental Management : Humiditydew point: should we be concerned with condensation?
  • Temperature at which water will condense on a surface
    • Function of ambient temperature and relative humidity
    • Used to determine whether additional steps should be taken to control temperature/ humidity inside the chassis.
  • Conclusion: Condensation will not be a big problem
    • May run into trouble at very high humidities (above 80%)
      • Dew point is very close to air temperatures
environmental management dew point should we be concerned with condensation
Environmental Managementdew point: should we be concerned with condensation?
  • Some environmental management techniques may be valuable to prevent condensation at high humidities
    • Main options:
      • include a heating system to keep temperature inside the chassis above dew point
      • reduce humidity inside the chassis to lower the dew point inside the chassis
          • a common method : silica gel packs
rit senior design project 10662 d3 engineering camera platform1

RIT Senior Design Project 10662D3 Engineering Camera Platform

Friday November 6, 2009

9:00am to 11:00am

rit senior design project 10662 d3 engineering camera platform2

RIT Senior Design Project 10662D3 Engineering Camera Platform

Friday November 6, 2009

9:00am to 11:00am

rit senior design project 10662 d3 engineering camera platform3

RIT Senior Design Project 10662D3 Engineering Camera Platform

Friday November 6, 2009

9:00am to 11:00am