RIT Senior Design Project 10662 D3 Engineering Camera Platform

1. RIT Senior Design Project 10662D3 Engineering Camera Platform Friday October9, 2009 11:30 to 1:00pm

2. Team Members • Gregory Hintz (EE) • Samuel Skalicky (CE) • Jeremy Greene (EE) • Jared Burdick (EE) • Michelle Bard (ME) • Anthony Perrone (ME)

4. Power Distribution

5. Power Distribution(cont.) -Schematic Using LT1933 taken from Linear Technology

6. Camera: MT9J003 CMOS Digital Image Sensor Why This Camera? Imaging Array 3664(H) x2748(V) Speed/Output • Frame Rate: 15 fps (HiSPi serial I/F) 7.5 fps (parallel I/F) • Data Rate: 2.8 Gb/s (HiSPi serial I/F) 80 Mp/s (parallel I/F) • Data Format: 12-bit RAW Temperature Range • –30°C to +70°C Power • Supply: 1.8V – 2.8V 638mW @ full resolution

7. Interfaces D3 Camera Interface -16-bit parallel output -6 Miscellaneous positions -Two wire I²C bus interface -Several clock and control positions CameraLink -LVDS to achieve theoretical transmission rate of 1.923Gbps -Not dependent on a particular supply voltage because of low signal voltage swing GigE -High bandwidth for high-speed, and high resolution cameras -Downward compatible with 10/100 Mhz Ethernet -Operates at a fast frame rate

8. The Connector Board • Speculation of finished product: • Ports for dataI/O.

9. Where We Started

10. Initial Concept • Specifications call for external ports: • (2) CameraLink (LVDS) • (2) Gigabit Ethernet • Power in (9V to 36V) • Sync • Serial (RS-232) Courtesy D3 Engineering

11. Things to Consider • Q: What does this do beyond wire connectors? • Will include some IC's that might otherwise be on the main, FPGA board. • Q: Do all of these connectors need to be on a circuit board? • Probably not • Q: Is there anything else that needs an I/O port? • The Inertial Navigation System (INS) will be housed separately • An external Serial ATA (SATA) will be included • Q: How will data be transferred from the connector board to the FPGA board and vice-versa? • A ribbon cable to carry data signals • CameraLink & GigE interfaces adapted to D3

12. After Initial Brainstorming

13. The Inertial Navigation System • Provides location and directional data. • Location determined by a Global Positioning System (GPS) device. • Direction determined by an Inertial Measurement Unit (IMU). • Important information to have for this kind of camera system.

14. Considering the Options • MicroStrain3DM • Both can be used with RS232 port. NovAtel SPAN

15. Enclosure Consideration • Some models contain the GPS and IMU in a single unit, others separate them. • May have noteworthy impact on size and design of the system enclosure.

16. Digital Operations

17. FPGA Board

18. Camera/INS Speeds • 10 MP Visual Band Image Sensor • 1 image/sec • 1 image approx 32MB • VGA IR Band Image Sensor • 30 images/sec • 1 image approx 1MB • INS Sensor • 1 capture/image (30/sec) • 1 capture approx 2MB

19. FPGA Hardware Requirements • Flash Based (SPI) Configuration Memory • 64MB covers all Spartan 6 LXT packages • DDR2 Ram • Image Data: RGB 24 bits, upto 30 bits per pixel • Dual Modules -> 32bits wide • Density 2Gb total • Approx 62MB image data/sec • Approx 60MB INS data/sec

20. FPGA I/O Pin Requirements

21. Spartan 6 FPGA Family

22. End of Electrical Discussion

23. Needs Considerations Approach Heat Mitigation • Maintain optimal temperature range required by components • Prevent the heat produced by the electronics from interfering with the operation of cameras • Maintain an air/water tight environment

24. NeedsConsiderationsApproach Heat Mitigation • External environment • Temperature on ground : assume 40-70 °F • Temperature at 30,000 ft (5.7 miles): -66.8°F to -36.8°F • Internal environment • External temperature plus temperature of heat generated by electronic components Image ID: wea00041, NOAA's National Weather Service (NWS) Collection Photographer: Ralph F. Kresge #1059

25. NeedsConsiderations Approach Heat Mitigation Conductive heat transfer methods inside the chassis Passive convective heat transfer methods outside • 2 Thermally isolated enclosures

26. Airframe Mounting Needs Considerations Approach • Ensure imaging system is securely attached to airframe • Reduce vibration of system Image from: www.airamericafc.com/imaging/

27. Airframe Mounting NeedsConsiderationsApproach • Pre-existing bolt patterns in aircraft • Pre-existing opening in aircraft for imaging systems • Does not interfere with other components of imaging system

28. Airframe Mounting NeedsConsiderations Approach • Utilize airplane’s pre-existing bolt pattern in vibration damping mount to attach vibration damping mount directly to airframe Initial sketch for vibration damping airframe-mount

29. Needs • Stabilize Image • Prevent Hardware Damage/Malfunctioning Considerations • Frequencies of Aircraft • Allowable Vibration in Image • Component Resonant Frequencies

30. Approach Mechanical isolation of chassis

31. Stock Hardware • Interchangeable as needs change • Large body of established data

32. Chassis DesignPhase 1: Individual Compartments Separate Enclosures Thermally IsolatedModular Minimal Leak Paths

33. Chassis DesignPhase 2: Scale

34. Chassis DesignPhase 3: Detail

35. RIT Senior Design Project 10662D3 Engineering Camera Platform Friday October9, 2009