Advancing Ubiquitous Intelligence in Paper and Packaging through the iPack Center

1. VINNOVA Excellence Center- VINN Excellence iPack Center -Ubiquitous Intelligence in Paper and Packaging

2. Outline • Background • The vision • Innovation and renewal • Innovation strategy and impact • Budget • Industrial partner program • Contact • Annex: Our Competence

3. Background The Vinnex iPack Center is Proposed by • KTH - the leader • Research Institutes – STFI & YKI • Relevant Industry - System and bio-medical - Electronics - Forest products • Future attract more industry: ……

4. General Background: Ubiquitous Intelligence 2005 2015 • Ubiquitous Intelligence – The General Vision • embedded smart systems in almost everything, virtually talk to each other • interact with people adaptively, cleverly hidden, user (human) -centric • ad hoc spontaneous networks, much larger than today’s internet • Make our everyday life easier and simpler, e.g. an easy office, an intelligent home.. • The next driving force after internet revolution • convergence of wireless, IT, nano, bio-, … • new applications, new business opportunities

5. iPack Center’s Focus i-Package for food & pharmacy: safety, quality etc Paper board Smart Bandage: easy, quick, smart i-Patch: wireless patient monitoring and therapy devices

6.                                                         The same technologies could also be used for others, e.g. i-Diaper i-Fashion i-Arts: tangible media interfaces Next generation i-Logistics: self-aware, networked

7. The Vision of iPack center

8. iPack Vision A national hub of multidisciplinary collaboration that • Brings Swedish existing and successful industry sectors together(Forest, biomedical, and ICT/electronics industries) • Creates unique innovations via integration of these resident competence, (e.g. combine paper with IT) • Focus on ubiquitous intelligence for paper and packaging, making our everyday life easier and simpler (e.g. an easy office or an intelligent home) • Conducts world-class research and creates new business opportunities in these unique areas

9. iPack from a System and End-User’s Perspective • Cross-disciplinary integration of IT, paper, and sensor technologies • New business opportunities via joint innovation • Interact with technology suppliers in multidisciplinary competence areas • Access to state-of-the-art technologies • State-of-the-art “know-how” • Meet different researchers, inspiration, creation and innovation Source: Stina Ehrensvärd, Cypak

10. iPack from a forest industry perspective Sweden’s paper industry facing major challenges • Escalating competition from BRICS countries • Energy costs • Changes in distribution of goods and information Necessary actions • Further develop established business areas to remain competitive • We know how to do that! • Development new complementary business areas • by crosslinking our resources, knowledge and infrastructure with other technically advanced industrial sectors, eg. microelectronics • Not obvious how we do this - need for more success stories as leading examples Source: Magnus Wikström

11. Why iPack is of interest for forest industry • Potential for innovation related to new functionalities for packages • Learn more about specific demands on packaging materials for these applications • Complementary project partners from different positions in the value chain • Learn how to utilize other industrial sectors for common product development – iPack is a pilot • Access to international talents Source: Magnus Wikström

12. Innovation and Renewal of the iPack center

13. Innovation and Renewal(from Paper and Package Perspective) • Interactive paper functionality through modified wood fiber and functional materials coating(e.g. electrical & magnetic paper, pressure and temperature aware paper, electrically controlled self-rolling paper, solar power paper, bend-aware paper etc) • Controlled micro-fluidics realized by printing and paper surface modification(e.g. lotus paper with micro-fluidics channels, electrical valve and pump printed on a paper for fluidics control) • Smart package that knows the quality of foods and interact with consumers with dynamic images, tracking more information via mobile phones(with paper-based sensors or embedded microchips) • Intelligent file folders, tags and tickets with sensors, wireless communication and encrypted security features(with integrated smart chip and paper-based sensors) • Information papers with electronic transaction capabilities, envelops with electronic addressing & security • Smart catalogues that coupled to the internet for automated purchasing • Corrugated boxes with electronic manifests and supply chain custody

14. Control & Signal Communication Paper & Processing & Services Bio - Sensor & Packaging Micro - Fluidics Expertise Manufacture Radio & Bio - Medical & Production Monitoring RFID System Integration Networking Vinnex iPack Center Innovation and Renewal(from Electronics and System Perspective) • KTH/STFI/YKI: good history of working together • Industrial partners: centered around Stockholm • Geographic proximity of the players • Unique interdisciplinary model for the center

15. Printed Solder Printed Adhesive Innovative Manufacture and Assembly Process • Low Cost and high Speed

16. paper Decomposable Electronics and Environmentally Friendly • Laminated Paper PCB • Embedded Chips in Paper • Lead-Free Solders and Interconnections ”Smart dust” not ”smart garbage” ! Decomposable & Recyclable, Environmentally Friendly Paper was actually used for electronics in 1950s!

17. Innovation Strategy and Potential Impact

18. A Focused Common Goal - Prototyping • Maintain a common goal via joint prototyping • Recursive innovation for every new generation of prototyping

19. 3G 2G 2G 4G 4G 1G 1G 3G Center Continuity: A Recursive Process New Partners System & Users EU Year 2016 RFIG EU Vinnex iPack Center NIC Year 2006 New Partners Tech Suppliers

20. Potential Impact • Renewal for traditional Swedish industry sectors • Strengthen SMEs’ competitiveness • Active spin-offs in this cross-disciplinary and innovative area • Industry: Know-how

21. Annex: Our Established Competence

22. 2.9mm 2mm Wireless communication/RFID, sensors and signal processing on a Flexible Paper Board Competence in wireless design, heterogeneous integration, and printing etc Flexible Foils- LCP & Kapton, inkjet printing UWB RFID in LCP 5GHz Receiver Front-end in LCP Multi-band LNA in LCP Headed by Prof. Li-Rong Zheng, Media Electronics-KTH

23. Microsystem Technology Transdermal patch Microneedle chip Transdermal Drug Delivery Transdermal patch Group Competences: • Integration of silicon microtechnology and low cost materials and fabrication • Microsensors (e.g. pressure, flow, etc) • Microactuators (e.g. valves, pumps, etc) • “Mixed technologies”: microsystems with IC, sensors, fluidics, etc. Group Application fields: • Medical technology • Biotechnology • Microfluidics • Microoptics • RF technology Some visions for iPack: • Small sized systems at low cost • “Lab-on-Paper/Foil” for low cost disposable diagnostics • Transdermal patches for drug delivery and health monitoring • Smart packages • “Paper-Actuators” for electrically controlled liquid pumping or paper bending (Expancel) • Wireless sensor tags An example… Headed by Prof. Göran Stemme, Mirosystem Technology -KTH

24. ASIC ASIC Mem RF uP Mem Mem Mem Medical Sensor Platform • Access Point: • Data collection • Data pre-processing • Comunication to sensors • Comunication to hospital computer • Sensors: • elctrodes • Pressure • Humidity • Oxygen • Acceleration • chemical, .. • Communication medium and protocol • between sensors • to access point • wireless • wired • Optical, ... Headed by Prof. Axel Jantsch, Electronic System Design -KTH