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Investigating temperature and power consumption on 2-D and 3-D multi-core platforms, this research focuses on a methodology for Dynamic Thermal Management, including Power Models and Non-even Heat Distribution. The study also explores real-time scheduling and power-aware, thermal-aware, and temperature-aware design approaches using application tools like Hotspot Simulator. Research conducted at ARCS Lab, Department of Electrical and Computer Engineering, Florida International University, provides insights into Throughput Maximization, Feasibility Analysis for Temperature Constrained Real-Time Scheduling, and energy efficiency on Intel Single-chip Cloud Computer System.
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Research Name: temperature and power or energy consumptionproblem on 2-D and 3-D multi-core platform Researcher: Shi Sha Advisor: Gang Quan ARCS Lab Department of Electrical and Computer Engineering Florida International University
Problem Formulation and Justification Power Model Thermal Model Non-even Heat Distribution
Methodology Dynamic Thermal Management (DTM) Real-time Scheduling Power-aware design Thermal-aware design Temperature-aware design
Application Tools Hotspot Simulator Wattchsimulator and Simple-scalar : cycle-level analysis
Research Result Power and Energy Analysis on Intel Single-chip Cloud Computer System Throughput Maximization Under Peak Temperature Constraints Feasibility Analysis for Temperature Constrained Real-Time Scheduling on Multi-core Platform
