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Product Development Engineer at Micrel Inc. - Product Design Cycle and Testing Methods

Explore the product design cycle and testing methods used by a Product Development Engineer at Micrel Inc. Learn about correlation, characterization, wafer sort, final test, and test matrix implementation. Discover the equipment setup and bench correlation techniques for accurate measurements.

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Product Development Engineer at Micrel Inc. - Product Design Cycle and Testing Methods

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  1. Andy Cheung New Product Development Engineer Micrel Inc. November 26, 2003

  2. Product Design Cycle Product

  3. Datasheet Specification Example

  4. Absolute Maximum Ratings

  5. Operating Ratings

  6. Testing IC’s • Correlation • Characterization • Wafer Sort • Final Test

  7. Correlation • Test Matrix by design • All tests listed • Typically follows datasheet • Tests implemented on automatic tester • Responsibility of test engineer • TMT, Eagle Test Systems

  8. Test Matrix-LDO

  9. Handler

  10. Handler

  11. Test Floor

  12. Correlation • Bench • Confirm all TMT data • Learn Device • Find problems • Accurate measurements • Equipment • Method

  13. Typical Equipment Setup • Oscilloscope with Probes • Pair of DC Power Supplies • 0-25V • 0-4A • Pair of Digital Multi Meters • Test Board • Solder Station • Parametric Analyzer • Source Meter • Current Probe • Freeze Spray and Heat gun

  14. Bench Setup

  15. Correlation -Test Board

  16. Dropout Voltage & Ground Current Measurement • DC Errors • Ground wire length • 100mOhm*500mA = 50 μV • Introduces losses in current measurements • Need voltage accuracy to 1 or 2 μV • 4 wire sense • Kelvin contacts

  17. Dropout Voltage & Ground Current Measurement + - V I Sense Node (Kelvin Contact) Normal Wire LDO Vin Ammeter Ground

  18. Correlation Worksheet

  19. Characterization • Characterization is Done to: • Find the Device’s Capabilities and Limitations • Performance over Temperature • Find Randomness • Results: • Single Insertion Test Limits • Specification Change • Determine Problems

  20. Characterization • Parts typically follow a normal (gaussian) distribution. • Test parts at all possible operating conditions per specification parameters. • Typically done on handlers to simulate production environment. • Most stringent testing.

  21. Datasheet Review • Device Realized? • Changes? • Deletions? • Yield Improvements? • Problems?

  22. SIT Limits • Use characterization data to ensure device operation over temperature. • Guardbands • Temperature • Tester

  23. Wafer Sort • Tightest Limits • Wafer Trim • Bandgap • Frequency • Wafer Probe Station for Bench Testing • Gate Stress Pads • Ensure Test is Correct

  24. Wafer Probe Station

  25. Final Test • Guarantee parts operated as written on datasheet. • Uses SIT limits generated from characterization.

  26. HAPPY THANKSGIVING!!! • Major Test Checkpoints • Correlation • Characterization • Wafer Sort • Final Test • Questions?

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