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Instrument Integration and Test Rick Sterling / Sharon Jelinsky

Instrument Integration and Test Rick Sterling / Sharon Jelinsky University of California – Berkeley Thm_CDR_IT_Revc. Overview. Overview / Topics I&T Sequence Facilities Integration Platform Instrument Requirements Integration/Test Flow Schedule Milestones Transportation.

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Instrument Integration and Test Rick Sterling / Sharon Jelinsky

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  1. Instrument Integration and Test • Rick Sterling / Sharon Jelinsky • University of California – Berkeley • Thm_CDR_IT_Revc

  2. Overview • Overview / Topics • I&T Sequence • Facilities • Integration Platform • Instrument Requirements • Integration/Test Flow • Schedule Milestones • Transportation

  3. Sequence

  4. Facilities - Environmental • Thermal Chambers • Space Sciences Lab • New Chamber for EFI Booms • Cal Chamber Upgrade for SST • Test Chamber Requirements • Pre-Test Clean • Pre-Test Bakeout • TQCM Monitoring • Cryo-Pump • Final Bakeout • GN2 Backfill • Calibration Chambers • Vacuum only • Ion Gun • Manipulator Available Chambers Type Comment HiBay L1 TV AXB Booms HiBay L2 TV STEREO 320 T10 TV STEREO 320 Cal Vac ESA Cal 320 “Mini” TV SCM, Bake-outs B20-TV “Bayside” TV EFI B20-Large TV TV Payload TV B20-Cal VAC2 Vac SST Cal SST, IDPU, EFI B20-TV “Snout” TV ESA MCPs 339-TV Cal • Vibration Facilities • Wyle • AMES • EMI/EMC • EMCE Engineering – Fremont

  5. B20 T/V CHAMBERS • Room B20 • 3 T/V Test Chambers: Bayside, Snout, Bertha • High Vacuum Base Pressures of 1x10e-6 torr or better • Thermal Systems with LN2 cooling and IR heating • Thermal Controllers: Watlow hardware & Anawin Software • Test Chambers Certified prior to instrument testing • Verify Outgassing levels less than 1% TML and 0.1% CVCM • RGA measures of residual gasses to less than 1x10e-7 PP • TQCM to measure condensable materials deposition rates

  6. Chamber ‘Bertha’ • Bertha - Large Thermal Vacuum Test Chamber • Dimensions: 9 ft. Diameter x 16 ft. Long • Accommodates 2 THEMIS Instrument Suites at once • Temperature cycles of -80C to +80C • Base Pressure of less than 1 x 10e-6 torr • Tests full ETU and 5 Flight Instruments

  7. Chamber ‘Themis Snout’ • THEMIS Snout • Dimensions: 3 ft. Diameter x 3 ft. Long • Accommodate EFI Axial Boom • Temperature cycles of -100C to +110C • Base Pressure of less than 1 x 10e-6 torr • Tests IDPU, AXB T/V, and Boom Deployment

  8. Chamber ‘Bayside’ • Bayside • 3 ft. Diam x 3 ft. Length • Fits 2 Instruments • Temp Range: –100 to +110C • Base Pressure: <1 x 10e-6 torr

  9. Thermal Testing • TV Plan • 2 Component-Level TV Cycles Prior to Instrument-Level I&T • 6 Instrument Level TV Cycles at Instrument-Level • Survival, Cold Start, Cycles (Functional at extremes), Bake-out • Deployments in Vacuum • SPB: Full Deploy w Takeup reel • AXB: Deploy Hot & Cold • MAG: First Motion Hot & Cold • Typical TV Profile:

  10. Status of Chamber Upgrades • Bertha • Vacuum Chamber in full working order • Thermal System designed; Baseplate and Shroud in production • Thermal Controller off the shelf & on order • Snout • Vacuum Chamber manufacture complete and under test • Thermal System designed; Baseplate and Shroud in production • Thermal Controller off the shelf & on order • Bayside • Vacuum Chamber in full working order • Thermal System designed and built • Thermal Baseplate and Shroud under installation and test

  11. Clean Rooms SSL Clean Room Features • Requirement: 100K Class • Nitrogen Gas purge available • Continuous Oxygen Monitoring • Temperature and Humidity Monitoring • Weekly Air Quality sampling • Controlled Access • Crane Certification • Staff Training

  12. Clean Room B20

  13. Clean Room 125

  14. Integration Platform Instrument Suite on Platform • Platform is same size as s/c deck • Framing supports platform to set comfortable work height • Metal rack alongside holds GSE and support equipment • GSE communicates with BAU Simulator via hardwire or ethernet INSTRUMENT PAYLOAD ASSEMBLY PLATE

  15. Parallel Integration/Test Parallel Integration and Test of S/C Platforms

  16. Instrument Requirements • Instrument Cleanliness/Contamination Requirements • ESA and SST require continual nitrogen gas purge • Oxygen meter following instruments and gas purge equipment • Normal ESD concerns • Magnetometer sensors to be boxed except when under test and before flight • Instrument-Provided GSE Accommodation • Mu-Metal Enclosures for FGM & SCM • N2 Purge Systems for ESA, SST • Sphere Sensor Boxes for EFI • Instrument Red/Green Tag Items Tracking • IDPU - Arming plug enables actuators causing boom deployment • EFI  - Electrical: 4 SPB Test/enable plugs plus one AXB test/enable plug • EFI  - Mechanical: 4 SPB Snout Covers plus 2 AXB Tube Covers • SST -  Covers to be removed before flight • ESA -  Cover; Arming plug; purge fitting;cocking pin nut

  17. Instrument Payload I&T Flow Harness Bake-out IDPU-Harness Safe-to-Mate FGM Functional (Level 2) SCM Functional (Level 2) Mag Boom Deploy Mag Alignment MAG INTEGRATION EFI Functional (Level 1) EFI AXB Deploy EFI SPB Deploy EFI Functional (Level 2) EFI/SCM/FGM Phasing EFI INTEGRATION ESA/SST INTEGRATION SST Functional (Level 2) ESA Functional (Level 2) ESA/SST Timing Payload CPT Instrument PER Payload EMC/EMI/MAGl Payload T-V Payload Vibration Payload Acceptance PAYLOAD ENVIRONMENTAL • ONLY if req’d • (workmanship) • Test Review

  18. FGM I&T Flow FGB Vibration FGB/SCB Thermal FGB Acceptance FGM BOOM (FGB) • 1 cycle T-V • Hot/Cold Deploy • Inspection • Mass Properties • DC Magnetics FGS Vibration FGS Thermal FGS Acceptance FGM SENSOR (FGS) • Boom Levels • 2 cycles T-V • Bake-out +60C • Inspection • Mass Properties • DC Magnetics FGE Acceptance IDPU Safe-to-Mate FGM Functional (Level 0) IDPU/ESA/ SCM Pre-Amp Vibration IDPU Thermal IDPU Acceptance FGM ELECTRONICS (FGE) • Inspection • Backplane • Without FGS • 2 cycles T-V • Bake-out +60C • FGS Functional • (Level 1) • Inspection • Mass Properties • DC Magnetics Payload Safe-to-Mate FGM Functional (Level 2) Mag Boom Deploy Alignment EFI/SCM/FGM Phasing FGM / PAYLOAD INTEGRATION • Harness • Sensor in TCU PAYLOAD ENVIRONMENTAL Instrument PER Payload EMI/EMC/MAGl Payload T-V Payload Vibration Payload Acceptance • ONLY if req’d • (workmanship) • Test Review • 6 cycles T-V • FGM Functional Lev1)

  19. FGM Test Configurations • FGM Level 0 – Without Sensor (Aliveness) • B-field about zero if FGM in Cal Mode (preferred mode) • B-field saturated if feedback is closed • Interface full functional • Power consumption reduced by about 200mW • FGM Level 1 – Sensor in Mu-metal cap (Limited Performance Test) • B-field about 10,000nT, Noise about 1nT • Full functionality, but B-field not representative • FGM Level 2 – Sensor in TCU (Comprehensive Performance Test) • B-field < 10nT, Noise <10pT/sqrt (Hz) • B-field has to be available in full quality • Delta in calibration coefficients known

  20. SCM I&T Flow SCB Vibration FGB/SCB Thermal SCB Acceptance SCM BOOM (SCB) • 14.1g RMS • 1 cycle T-V • Hot/Cold Deploy • Inspection • Mass Properties • DC Magnetics SCM Sensor Vibration SCM Sensor Thermal SCM Sensor Bake-out SCM Sensor Acceptance SCM SENSOR (SCM) • Boom Levels • 3 cycles (air) • Bake-out +60C • Inspection • Mass Properties • DC Magnetics SCM Pre-Amp Thermal SCM Pre-Amp Bake-out SCM Pre-Amp Acceptance IDPU/ESA/ SCM Pre-Amp Vibration IDPU Thermal IDPU Acceptance SCM PRE-AMP • 3 cycles (air) • Bake-out +60C • Inspection • Mass Properties • DC Magnetics • 2 cycles T-V • Bake-out +60C • SCM Functional • (Level 1) • Inspection • Mass Properties • DC Magnetics Payload Safe-to-Mate Functional (Level 3) Mag Boom Deploy Alignment EFI/SCM/FGM Phasing SCM / PAYLOAD INTEGRATION • Harness • SCM Sensor in Mu Metal PAYLOAD ENVIRONMENTAL Instrument PER Payload EMI/EMC/MAGl Payload TV Payload Vibration Payload Acceptance • 6 cycles T-V • SCM Functional (Lev 2) • ONLY if req’d • (workmanship) • Test Review

  21. SCM Test Configurations • SCM Safety – Feedback Plug • Required when SCM Pre-Amp is powered and sensor is not connected • SCM Level 0 – With SCM EGSE I/F Box (Aliveness) • Same Power, Command, Analog output interfaces • Power and Cal Mode identification by LED • Cal Signal re-injected to the input • Signal generator connected to input • Validation by analysis of data • SCM Level 1, 2 – Sensor in Mu Metal Box (Comprehensive Performance Test) • Sensor kept in mu metal box during integration • Axis identification • Re-verification of end-to-end calibration • Phase relation • Check of conducted noise • SCM/EField timing reference

  22. ESA I&T Flow ESA Thermal ESA Acceptance ESA SENSOR • 2 cycles T-V • Bake-out +60C • Inspection • Mass Properties • DC Magnetics ETC Acceptance IDPU Safe-to-Mate ESA Functional (Level 0) IDPU/ESA/ SCM Pre-Amp Vibration IDPU Thermal IDPU Acceptance ESA ELECTRONICS (ETC) • Inspection • Backplane • 2 cycles T-V • Bake-out +60C • Inspection • Mass Properties • DC Magnetics Payload Safe-to-Mate ESA Functional (Level 2) ESA/SST Timing ESA / PAYLOAD INTEGRATION • Harness • Instrument Functional • Cover Simulator Test Instrument PER Payload EMI/EMC/MAG Payload T-V Payload Vibration Payload Acceptance PAYLOAD ENVIRONMENTAL • ONLY if req’d • (workmanship) • Test Review • 6 cycles T-V • ESA Functional (Lev 1)

  23. SST I&T Flow SST Vibration SST Thermal SST Acceptance SST SENSOR • 2 cycles T-V • Bake-out +60C • Inspection • Mass Properties • DC Magnetics DAP Acceptance IDPU Safe-to-Mate SST Functional (Level 0) IDPU/ESA/ SCM Pre-Amp Vibration IDPU Thermal IDPU Acceptance SST ELECTRONICS (DAP and ETC) • Inspection ETC Acceptance • Backplane • Without SST • 2 cycles T-V • Bake-out +60C • Inspection • Mass Properties • DC Magnetics • Inspection Payload Safe-to-Mate SST Functional (Level 2) ESA/SST Timing SST / PAYLOAD INTEGRATION • Harness • SST w/ Radiation Source • Attenuator Test Instrument PER Payload EMI/EMC/MAGl Payload T-V Payload Vibration Payload Acceptance PAYLOAD ENVIRONMENTAL • ONLY if req’d • (workmanship) • Test Review • 6 cycles T-V • SST Functional (Level 1)

  24. EFI I&T Flow AXB Vibration AXB Thermal AXB Acceptance EFI AXIAL BOOM (AXB) • 1 cycle T-V • Hot/Cold Deploy • Inspection • Mass Properties • DC Magnetics SPB Vibration SPB Thermal SPB Acceptance EFI RADIAL BOOM (SPB) • 1 cycle T-V • Hot/Cold Deploy • Inspection • Mass Properties • DC Magnetics EFI Pre-Amp Vibration EFI Pre-Amp Thermal EFI Pre-Amp Bake-out EFI Pre-Amp Acceptance EFI PRE-AMP • 3 cycles (air) • Bake-out +60C • Inspection • Mass Properties • DC Magnetics BEB Acceptance IDPU Safe-to-Mate EFI Functional (Level 0) IDPU/ESA/ SCM Pre-Amp Vibration IDPU Thermal IDPU Acceptance EFI ELECTRONICS (BEB and DFB) • Inspection • Backplane • Without sensors • 2 cycles T-V • Bake-out +60C • Inspection • Mass Properties • DC Magnetics DFB Acceptance • Inspection Payload Safe-to-Mate EFI AXB Deploy EFI SPB Deploy EFI Functional (Level 2) EFI/SCM/FGM Phasing EFI / PAYLOAD INTEGRATION • Harness • Sensor in Mu Metal Instrument PER Payload EMI/EMC/MAGl Payload T-V Payload Vibration Payload Acceptance PAYLOAD ENVIRONMENTAL • ONLY if req’d • (workmanship) • Test Review • 6 cycles T-V • EFI Functional (Lev 1)

  25. Upcoming Milestones

  26. Transportation • Transportation and Logistics • Air Transport of Instrument Suites from Berkeley to Swales • Fed Ex Critical/Specialty Freight Overnight • Point to Point, Highest Security • Transport Berkeley’s spacecraft platform to Swales also • Post-Transport Acceptance Test at Swales

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