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ESD SYSTEM OVERVIEW

This document provides a detailed overview of the ESD system specifically designed for the analysis of copper samples. It outlines the transport and handling procedures, including the operation of essential components like the butterfly valve, electrometer, and pumping group. The text covers the key processes involved in heat treatment, machining, and cleaning of the samples, along with crucial steps for bake-out, degassing, and calibration. The influence of filament power supply and gas injection on desorption yield is also discussed, offering insight into optimizing the experimental setup.

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ESD SYSTEM OVERVIEW

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  1. ESD SYSTEM OVERVIEW Transport rod 1 Cu Sample Butterfly valve 2 Bias Sample Sample Holder plate Electrometer RGA B-A gauge Pumping group Filament Conductance Gas Injection Line Filament Power Supply Full Range Gauge Bias Filament

  2. ESD SYSTEM OVERVIEW

  3. Cu SAMPLES

  4. Cu Samples Heat treatment Machining Cleaning ESD main steps:   

  5. Bake – out: lower part 9 8 6/11 7 1 2 3 5 10 4

  6. Bake – out: upper part 3B 2B 4B 1B

  7. RGA scans

  8. RGA scans (valve closed)

  9. Circuit 35 KV V 2-3 A A +15 V V A

  10. Degassing: 9 Cycles @ 0.35KV

  11. Degassing: 9 Cycles @ 0.70KV

  12. Degassing: 9 Cycles @ 1.5KV

  13. Calibration: H2 Calibration Factor

  14. Calibration: N2 Calibration Factor

  15. Calibration: N2 2nd set of data Calibration Factor

  16. Degassing: 30 Cycles @ 0.35 KV

  17. CURRENT!!!!!

  18. Desorption Yield

  19. Desorption Yield • 15 RGA Cycles for background Signal + biassing of the sample • 15 RGA Cycles with the filament switched on • filament + sample degassing

  20. Desorption Yield • switch on the filament • 15 RGA Cycles for background pressure • 15 RGA Cycles with the sample biased

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