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ALCT and TMB Status

ALCT and TMB Status. Martin von der Mey University of California Los Angeles ALCT production status TMB status TMB radiation test RAT status. ALCT384 Boards. Power, computer connectors. 80 MHz SCSI outputs (to Trigger Motherboard ). Xilinx Mezz. board. 24 Input signal connectors.

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ALCT and TMB Status

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  1. ALCT and TMB Status • Martin von der Mey • University of California Los Angeles • ALCT production status • TMB status • TMB radiation test • RAT status

  2. ALCT384 Boards Power, computer connectors 80 MHz SCSI outputs (to Trigger Motherboard) Xilinx Mezz. board 24 Input signal connectors Delay/ buffer ASICs, 2:1 bus multiplexors (other side) Analog section: test pulse generator, AFEB power, ADCs, DACs (other side) Spartan XL

  3. Yangheng

  4. ALCT Production

  5. ALCT Production

  6. ALCT Production

  7. ALCT Production Testing • Done. • All ALCT base boards repaired. Also spares. • Prepare mezz. Cards spares

  8. Problems Encountered in testing at UCLA • Most frequent problem • On base boards: • Intermittent problem due to buffer (Clock fanout). Buffers replaced • Still solder bridges (50%) • Shorts inside the PCB board. • On mezz. Cards: • Bad Eproms (replaced) • Bad ball grid connections between FPGA and PCB board.

  9. Production of spare Mezz. Boards • Want >10 % spares. • Need 25 XCV600E type and 15 XCV1000E type. • Have 3 good XCV600E and 1 good XVC1000E • Have 24 bad XCV600E and 10 bad XCV1000E • Already reballed about 100 mezz. Cards and remounted on same boards (success rate 70%). • Plan : • Remove FPGAs from non working boards and put on new mezz. card. • Buy 5-10 XCV1000Es

  10. Problems Encountered • Broken AFEB connectors. • Connectors are very fragile • Shipping companies handle packages roughly • We recently started packing very carefully • We found a company that successfully replaces the broken connectors ($30/connector) • Everybody should handle boards with care

  11. Problems found (FAST) • In shipping, connector shells got damaged (boxes handled roughly by FedEx) • Very difficult to repair, found a company to do it • Bottom line: • First 100 chambers tested at ISR: 5 broken connector shells, 1 blown fuse, 1 bad channel… • 1/38400 channels

  12. RAT: Rpc Alct Transition module • Inputs from ALCT and RPC sources • Outputs through backplane to TMB. • The RPC crate locations is now fixed and cabling can be discussed in detail • The layout is done and submitted for board production. • We expect to do a data interchange test with RPC in Spring.

  13. RAT2003 Layout VME Backplane Spartan FPGA To TMB RPC connectors ALCT Input connector

  14. Main FPGA (on back) XILINX XCV1000E Input connectors From 5 CFEB’s Mezzanine board Input connectors From ALCT Trigger Motherboard (TMB) • Generates Cathode LCT trigger with input from CFEB (comparator) • Matches ALCT and CLCT; sends trigger primitive info via MPC to Lev-1 muon trigger, sends anode and cathode hits to DMB.

  15. New TMB2003A New TMB2003A under test

  16. TMB 2003A Status • 4 TMB2003A boards assembled • 2 Virtex-II Mezzanine boards assembled (Xilinx XC2V4000) • 2 Board (mostly) debugged • Board-test firmware ported from TMB2001 version. • Beam-test firmware was modified for radiation test. • Radiation test done.

  17. Changes TMB2001/TMB2003A • Changes from TMB2001 to TMB2003A • 2 PHOS4 delay ASICs replaced with 3 DataDelay Devices 3D3444(10 channels with 1-ns steps replaced with 12 channels of 2ns steps) • Power supply regulators replaced with OSU-approved rad tolerant devices • New signals for XC2V4000 FPGA • Virtex E mezz. Card replaced by Virtex II for faster speed • New RPC signals to the RAT2003 transition module • New voltage regulator for RAT2003 FPGA core (+1.8V) • New signals to/from DMB. Accommodate backplane changes. • New power plane layout • Front-panel LEDs are now socketed, for faster assembly

  18. Beam Test of TMB 2001 • See Jay’s talk

  19. TMB 2003A Hardware What works: JTAG chain sees Mezzanine FPGA + 4 PROMs, + 2 user PROMs Boot register passes walking 1 Address register passes walking 1 JTAG load command works (didn’t on TMB2001) Front panel cylon display runs VME registers read back ID, slot address, etc ADC reads back voltages and currents What doesn’t work: Some tri-state buffer outputs clamp to ~1V instead of pulling to 3.3V Test code can drive out +3.3V....it just won’t tri-state Tried Foundation and ISE compilers

  20. TMB2003A Board Test Firmware Assembled 2nd TMB2003 FPGA failed to load from EPROMs....fixed....bad solder on mez IC Delay ICs 3D3444 now working...firmware fix Trying to run full-auto tests Passes: ID register (includes VME slot address readback) VME data walking 1 VME address walking 1 Hard reset from VME User PROM JTAG ID codes User PROM data bus ADC voltage & current Fails: Digital serial numbers (both TMB and mez) SMB temperature IC All Loop-backs

  21. TMB Firmware • Firmware tested in 3 beam tests • No big problems found • Found and fixed problems with “Winner bits” • New I/Os added (RPC,DMB) • Added global clocks • Replaced PHOS4 logic with 3D3444 (State machine clocks data at 20MHz instead of 625 kHz) • Radiation test and beam test firmware ported to Virtex II.

  22. New radiation Test

  23. TMB2003A Test Radiation Test New state machine fires internal CLCT pattern injector Injects 1 muon: 6 hits, non-bending Trigger rate: 100KHz or ~10Hz Increments CFEB number each trigger Checks for correct CLCT data Checks for any CLCT data between triggers (spurious muon) Check power-monitor IC for +5V,+3.3V,+1.5V, +1.8V errors Flashes “running” LED at constant rate Test board: Connects to DMB TTL backplane drivers BiColor LEDs display test results Reset button forces FPGA reload (uses power-up IC on TMB)

  24. Old ALCT radiation results Xilinx vs Altera • Radiation results shows small improvements to before… • Mean lies at 65.24 Rad compared to 59.2 Rad before… • The main improvement (factor 5) comes due to combination of 5 chips • (1 concentrator and 4 LCT chips into 1).

  25. Radiation Test results • Irradiated XC2V4000 Xilinx FPGA • New radiation test gives 141 Rad for proton beam. Compared to 65 Rad before. (~2.5 better) • SEU proton fluence 79.8*10 7 cm-2 (M.Huhtinen (1-4)*10 10 cm-2 for 10 LHC years) • Also tested 6 GTLP chips up to 5 kRads  no problems.

  26. Conclusions • ALCT production in excellent shape and mainly done. Doing spares now. • TMB firmware in good shape. Tested several times. Improvements on the way. • Received and testing TMB 2003A. • Done TMB radiation test. Excellent. • RAT2003 layout finished.

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