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Section I: Motivation and introduction. The technological foundations of most high-tech industries are based primarily on the development/creation and utilization of different kinds of thin films: deposition and patterning. Basic thermostat and vacuum tech. sources. deposition.

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slide1

Section I: Motivation and introduction

The technological foundations of most high-tech industries

are based primarily on the development/creation and utilization

of different kinds of thin films: deposition and patterning.

slide2

Basic thermostat

and vacuum tech

sources

deposition

morphology

Outline of the course

slide3

Example:

Cross section of a computer chip

slide5

Magnetic storage

  • ---towards terabits/in2
  • C. Ross, Annu. Rev. Mater.
  • Res. 2001. 31:203-235.
  • Three strategies:
  • exchange-decoupled grains
  • (conventional)
  • In-plane patterned media
  • Perpendicular patterned media
slide7

1

“Photonic bandgap: woodpile structure”

(Professor S. Lin, RPI)

slide9

Optical switches:

  • MEMS---mirror switches: D. Bishop et al, Physics Today Oct 2001 (Lucent)

MEMS

slide11

Mini-machnines (Micromechanical systems):

actuator, resonator, valve, damper, motor….

Wu (2002)

Cleland (2003)

Industrial Physics (2002)

microns

Micro-mirror arrays--Lucent (2001)

slide12

substrate

thickness

monitor

vapor

source

pump

Physical vapor deposition: thermal evaporation, e-beam

evaporation, sputter deposition, laser ablation, ion beam deposition

Base pressure

--vacuum seal, outgasing,

contamination, pumps

Deposition rate (nm/s)

--source T, vapor pressure,

impinging rate

Film structure

--morphology, crystal

orientation, substrate T,

uniformity

slide13

Ar

H2

Ar

precursor

CF

CF

3

3

O

C

C

O

-

-

O

O

CH

2+

Pd

HC

Substrate Heater

C

O

C

O

Pump

CF

CF

3

3

Chemical vapor deposition: thermal CVD, atomic layer deposition

Pressure, T (source and substrate),

flow rate, deposition rate, pulse

duration, film properties

slide14

+

-

OH-

wafer

H+

e-

Cu2+(EDTA)

Cu2+

SO42-

SO42-

glyoxylic acid

wafer

anode

Cl-

Solution based deposition: electrochemical deposition (ECD),

Electroless deposition (ELD)

electrochemical deposition

Electroless deposition

(HO2CCH2)2NCH2CH2N(CH2CO2H)2

T~70o

Room T

slide15

Home work. 1. (Deadline: Sept 7, 8am)

Describe briefly five different devices or structures (with figures or drawing)

that require extensive thin film coating work. (One page per device.)