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Radiation Monitors for LHCb. Goals. Radiation levels up to >10kGy predicted for 10 years of LHCb running Level of radiation has influence on detector and electronic performance Active radiation monitors give levels every second Feedback during run possible ->background

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radiation monitors for lhcb

Radiation Monitors for LHCb

Dirk Wiedner / LHCb

goals
Goals
  • Radiation levels up to >10kGy predicted for 10 years of LHCb running
  • Level of radiation has influence on detector and electronic performance
  • Active radiation monitors give levels every second
    • Feedback during run possible ->background
    • Time correlation to electronics or detector performance possible
    • Calibrate simulated radiation levels

Dirk Wiedner / LHCb

radiation levels

Radiation level after RICH2

versus x-coordinate

Gloria Corti

Radiation levels

Radiation level in

Bending plane over

5 years 2x1032

+ 5 years 5x1032

[1/(cm2s)]

Dirk Wiedner / LHCb

radiation levels1
Radiation levels
  • 103 to 104 Gy at silicon detectors
  • 102 to 103 Gy at outer tracker and calorimeters
  • 10 - >100 Gy at on detector electronics
  • <10 Gy in bunker and balcony racks

Estimates for 10 years of running

Dirk Wiedner / LHCb

active monitors
Active monitors
  • Thin Oxide RadFET: 0.1 to 10 kGy
  • Thick Oxide RadFET: 10-3 to 10 Gy
  • High sensitive silicon diode 108 to 2x1012 1MeV equ. Neutrons/cm2
  • Particle detector diode 1011 to 5x1014 1MeV equ. Neutrons/cm2
  • Temperature sensor
  • Chosen by RADMON group

Dirk Wiedner / LHCb

position active monitors
Position active monitors
  • Detector acceptance
    • x-y cross section after RICH2 at 50/100/180/280 mrad
    • 3 additional sensors along z at 320 mrad
  • Electronics
    • 12 sensors at major FE-electronic areas (boxes and racks)
  • Reference in D3

Dirk Wiedner / LHCb

position top view
Position top view

Dirk Wiedner / LHCb

package
Package
  • Small (few cm) package
  • Low material budget
    • 250 μm PCB
  • 4 sensors + PT100 + reference resistor
  • Developed by RADMON group

Dirk Wiedner / LHCb

measurement
Measurement
  • Threshold voltage for RadFETs
  • Forward Voltage PIN-diode
  • Leakage current detector diode
  • Readout system developed by Ljubljana ATLAS group
    • ELMB has 64 ADC channels
    • ELMB DAC for IBIAS

Dirk Wiedner / LHCb

data logging
Data logging
  • ELMB has CANbus interface
  • CAN to USB
  • PVSS control
  • 1Hz rate for radiation values
  • Data archive: Condition DB

Dirk Wiedner / LHCb

radmon box ts lea
Radmon box TS/LEA
  • LHC machine radiation monitor
  • 10 installed at point 8 (Cryogenics)
  • Allows x-check with RadFETs and diodes

Dirk Wiedner / LHCb

metal foil detector
Metal foil detector
  • Aluminum foil sensor for inner Tracker
    • Developed by the Kiew group
    • 28 cells covering 75 mm x 110 mm each
    • Complementary to RadFET/Diodes

535 mm

218 mm

Dirk Wiedner / LHCb

beam condition monitor
Beam condition monitor
  • Diamond sensors very close to the beam
  • 3 stations with 8 sensors each
  • Optical data transmission
  • TELL1 DAQ board used

CFC board

CVD diamond

Dirk Wiedner / LHCb

passive sensors
Passive sensors
  • Installation at active monitor positions for x-check
  • Additional 20 sensors per calorimeter:

SPD/PS, ECAL, HCAL

  • See talk of Ch. Ilgner

Dirk Wiedner / LHCb

positions
Positions

Beam Condition Monitor

Metal Foil Detector

TS/LEA boxes

Passive Radmon

Dirk Wiedner / LHCb

radiation background signal
Radiation background signal
  • Radiation background at detector for LHC
  • Combination of BCM, TS/LEA RADMON, Al-foil and active monitors
  • Technical implementation to be seen

Dirk Wiedner / LHCb

next steps
Next steps
  • Lab setup with sensors, ELMB (DAC)
  • Produce electronics for all 26 sensors
  • Order 32 sets of sensors from RADMON group / M. Glaser

Dirk Wiedner / LHCb

summary
Summary
  • Radiation map with RadFETs and diodes at 26 positions, ATLAS readout
  • Passive monitor radiation map
  • Dedicated radiation monitoring for
    • Inner tracker – metal foil detector
    • Beam condition – diamond sensors
    • Cryogenics at point 8 – TS/LEA box

Dirk Wiedner / LHCb

backup
Backup

Dirk Wiedner / LHCb

sensor details
Sensor details
  • Sensitive P-I-N CMRP 108–2×1012 cm-2
  • High rate P-I-N BPW 34 2•1012-4•1014cm-2
  • RadFET thick Oxide CNRS 10-3–10 Gy
  • RadFET thin Oxide REM Oxford 0.1–10kGy
  • PT100
  • 10KOhm reference resistor

Dirk Wiedner / LHCb

further sensors at lhcb
Further sensors at LHCb
  • Passive Dosimeters
    • Installation at same +additional positions for x-check
    • See talk of Ch. Ilgner
  • Beam Condition Monitor
    • Diamond sensors very close to the beam
  • RADMON box (TS/LEA)
    • LHC machine radiation monitor
    • 10 installed at point 8 (Cryogenics)
  • Aluminum foil sensor for inner Tracker,
    • Developed by the Kiew group
    • Complementary, covers IT detector

Dirk Wiedner / LHCb

metal foil detector1
Metal foil detector
  • 5 layers of Al foil
    • 2 shield
    • 2 acceleration
    • 1 sensor

Dirk Wiedner / LHCb

metal foil principle
Metal foil principle

Dirk Wiedner / LHCb

metal foil signal flow
Metal foil signal flow

Dirk Wiedner / LHCb

metal foil sensor
Metal foil sensor

Dirk Wiedner / LHCb