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EC and ZH XeF2_2ndgen_11272020

XeF2 2nd gen sensor

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EC and ZH XeF2_2ndgen_11272020

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  1. BGBX3: 10 cycles (1 min/cyc), 3 Torr SP, graphene was not fully fluorinated

  2. BGBX3: SEM

  3. BGBX4: 13 cycles (1 min/cyc), 3 Torr SP, graphene was fully fluorinated

  4. BGBX4: SEM graphene broke following its wrinkles

  5. BGBX5: 16 cycles (1 min/cyc), 3 Torr SP, graphene wasn’t fully fluorinated

  6. BGBX5: SEM graphene broke following its wrinkles

  7. BGBX6: 19 cycles (1 min/cyc), 3 Torr SP, graphene wasn’t fully fluorinated

  8. BGBX7: 13 cycles (1 min/cyc), 3 Torr SP, graphene was fully fluorinated, but bhBN got etched

  9. BGBX7: SEM thBN etching was non-uniform

  10. BGBX8: 13 cycles (1 min/cyc), 30 sec delay after etch cycle, 3 Torr SP, bhBN still got etched

  11. BGBX8: SEM

  12. BGBX9: 20 cycles (30 sec/cyc), 1 Torr SP, bhBN still got etched Raman only measures graphene in the small opening

  13. BGBX9: SEM

  14. BGBX10: 10 cycles (30 sec/cyc), 1 Torr SP, graphene was fully fluorinated

  15. BGBX11: 20 cycles (30 sec/cyc), 1 Torr SP, 30 sec delay after each cycle, PMMA trapped gas (?) after etching, thBN was not etched

  16. BGBX13: 20 cycles (30 sec/cyc), 1 Torr SP, 30 sec delay after each cycle, PMMA trapped gas (?) after etching

  17. BGBX14: 25 cycles (30 sec/cyc), 1 Torr SP, 30 sec delay after each cycle, PMMA trapped gas (?) after etching, bhBN was etched, also the BN surroundings Raman only measures graphene in the small opening

  18. BGBX12: 25 cycles (30 sec/cyc), 1 Torr SP, 60 sec delay after each cycle, PMMA trapped gas (?) after etching, bhBN was not fully etched, fluorination non-uniform

  19. Timeline • Monday: • Prepare more BGB stacks for XeF2 etch optimization; • Prepare GC stacks; • Tuesday • XPS with Edoardo; • Wednesday • GC device fabrication;

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