Welcome to EE 130/230M Integrated Circuit Devices. Instructors: Prof. Tsu -Jae King Liu and Dr. Nuo Xu ( tking and nuoxu @eecs.berkeley.edu) TA: Khalid Ashraf (firstname.lastname@example.org) Web page: http://www-inst.eecs.berkeley.edu/~ee130/
Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author.While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server.
Welcome to EE 130/230MIntegrated Circuit Devices Instructors: Prof. Tsu-Jae King Liu and Dr. NuoXu (tking and nuoxu @eecs.berkeley.edu) TA: Khalid Ashraf (email@example.com) Web page: http://www-inst.eecs.berkeley.edu/~ee130/ bSpace site: EE 130/230M Spring 2013 Objectives: Fundamental understanding of the working principles of semiconductor devices used in modern ICs. An ability to design a transistor to meet performance requirements within realistic constraints.
Lectures (247 Cory): TuTh 11AM-12:30PM Discussion Section (beginning Wednesday 1/23): Section 101 (289 Cory): We 2-3PM Office Hours: Prof. Liu (225 Cory): Mo 4-5PM Nuo Xu (225 Cory): Tu 3-4PM Khalid Ashraf (382 Cory): We 4-5PM Schedule EE130/230M Spring 2013 Course Overview, Slide 2
Prerequisite: EECS40: Basic properties of semiconductors; basic understanding of transistor operation Familiarity with the Bohr atomic model Relation to other courses: EE130 is a prerequisite for EE231 (Solid State Devices) EE130 is also helpful (but not required) for IC analysis and design courses such as EE140 and EE141, as well as for the microfabrication technology course EE143 Relation to Other Courses EE130/230M Spring 2013 Course Overview, Slide 3
Reading Material • Textbook: Semiconductor Device Fundamentals by R. F. Pierret (Addison Wesley, 1996) • Reference: • Modern Semiconductor Devices for Integrated Circuits by C. Hu (Prentice Hall, 2009) EE130/230M Spring 2013 Course Overview, Slide 4
Homework (posted online) due Th (beginning of class) late homeworks not accepted! Design project assigned on 4/11, due on May 9 You may work in pairs 6 Quizzes 25 minutes each closed book (1pg of notes allowed) no make-up quizzes Final exam Th 5/16 from 8AM to 11AM closed book (6 pages of notes allowed) Grading Letter grades will be assigned based approximately on the following scales: 10% 20% EE130 A+: 98-100 A: 88-98 A-: 85-88 B+: 83-85 B: 73-83 B-: 70-73 C+: 68-70 C: 58-68 C-: 55-58 D: 45-55 F: <45 EE230M A+: 99-100 A: 91-99 A-: 90-91 B+: 89-90 B: 81-89 B-: 80-81 C+: 79-80 C: 71-79 C-: 70-71 D: 60-70 F: <60 30% 40% EE130/230M Spring 2013 Course Overview, Slide 5
Miscellany • Special accommodations: • Students may request accommodation of religious creed, disabilities, and other special circumstances. Please meet with Prof. Liu to discuss your request, in advance. • Academic (dis)honesty • Departmental policy will be strictly followed • Collaboration (not cheating!) is encouraged • Classroom etiquette: • Arrive in class on time! • Bring your own copy of the lecture notes. • Turn off cell phones, etc. • Avoid distracting conversations EE130/230M Spring 2013 Course Overview, Slide 6
In 1959, Robert Noyce (Fairchild Semiconductor) demonstrated an IC made in silicon using SiO2 as the insulator and Al for the metallic interconnects. The first planar IC (actual size: 0.06 in. diameter) The Integrated Circuit (IC) • An IC consists of interconnected electronic components in a single piece (“chip”) of semiconductor material. • In 1958, Jack S. Kilby (Texas Instruments) showed that it was possible to fabricate a simple IC in germanium. EE130/230M Spring 2013 Course Overview, Slide 7
300mm Si wafer From a Few, to Billions of Components • By connecting a large number of components, each performing simple operations, an IC that performs complex tasks can be built. • The degree of integration has increased at an exponential pace over the past ~40 years. • Moore’s Law: The # of devices on a chip doubles every ~2 yrs, for the same chip price. Intel Ivy Bridge Processor 1.4B transistors, 160 mm2 EE130/230M Spring 2013 Course Overview, Slide 8
Impact of Moore’s Law http://www.morganstanley.com/institutional/techresearch/pdfs/2SETUP_12142009_RI.pdf Transistor Scaling Investment Higher Performance, Lower Cost Market Growth # DEVICES (MM) CMOS generation: 1 um • • 180 nm • • 22 nm YEAR EE130/230M Spring 2013 Course Overview, Slide 9
MOSFET The Nanometer Size Scale Carbon nanotube 1 micrometer (1 mm) = 10-4 cm; 1 nanometer (nm) = 10-7 cm EE130/230M Spring 2013 Course Overview, Slide 10
Course Overview • Semiconductor Fundamentals – 3 weeks • Metal-Semiconductor Contacts – 1 week • P-N Junction Diode – 3 weeks • MOS Capacitor – 2 weeks • MOSFET – 2 weeks • Bipolar Junction Transistor – 2 weeks • Modern CMOS Technology – 1 week Metal-Oxide-Semiconductor (MOS) Field-Effect Transistor (FET) EE130/230M Spring 2013 Course Overview, Slide 11