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The Dynamic Part Average Test How It's Used in Semiconductor Testing and Yield Management

The Dynamic Part Average Test, or DPA, is a semiconductor testing method that helps yield managers monitor process variations in order to improve yields. By tracking the average performance of a group of parts over time, DPA can help identify process changes that may be causing yield loss. Additionally, DPA can be used to screen for process improvements that could result in increased yields.

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The Dynamic Part Average Test How It's Used in Semiconductor Testing and Yield Management

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  1. The Dynamic Part Average Test: How It's Used in Semiconductor Testing and Yield Management The Dynamic Part Average Test

  2. Dynamic Part Average Test • This blog post will introduce the Dynamic Part Average test, which is used in yield management and semiconductor testing to ensure the quality of the product. The dynamic part average is used to track defects that occur randomly during manufacturing. It includes a description of how this test is used in semiconductor testing and yield management as well as some examples of benefits that are seen with its use.

  3. What is DPAT? • The Dynamic Part Average Test, or DPA, is a semiconductor testing method that helps yield managers monitor process variations in order to improve yields. By tracking the average performance of a group of parts over time, DPA can help identify process changes that may be causing yield loss. Additionally, DPA can be used to screen for process improvements that could result in increased yields.

  4. DPAT in Semiconductor Testing • Semiconductor testing is a process used to identify, assess, and correct defects in semiconductor products. The dynamic part average test (DPA) is a type of test used in semiconductor testing to determine the mean number of parts per million (PPM) that are defective.

  5. Cont’d • The DPA test is performed by measuring the number of defective parts in a sample of products and then calculating the average number of defects per million parts. The DPA test can be used to screen for defects during manufacturing yield or to assess the quality of finished products.

  6. Cont’d • DPA tests are often used in yield management, which is the process of monitoring and improving the yield of semiconductor products. Yield management includes activities such as identifying yield-limiting factors, optimizing manufacturing processes, and developing corrective actions to improve yields.

  7. Cont’d • DPA testing can be used to monitor process changes and identify trends that may impact yields. By understanding the relationship between process changes and DPA results, manufacturers can make informed decisions about process improvements that will result in higher yields.

  8. DPAT for Yield Management • The Dynamic Part Average Test, or DPA, is a test used in semiconductor testing and yield management. It is a way to measure the average performance of a group of identical parts over time. • The Dynamic PAT test can be used to monitor the performance of a manufacturing process and identify process changes that may impact yield. It can also be used to evaluate new materials or processes, or to troubleshoot process issues.

  9. Cont’d • DPAT data can be used to generate control charts and other statistical tools to help manage process variation and improve yield.

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