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quarterly flexible printed electronics workshop october 22 2009 hosted by semi n.
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Quarterly Flexible, Printed Electronics Workshop October 22, 2009 Hosted by SEMI PowerPoint Presentation
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Quarterly Flexible, Printed Electronics Workshop October 22, 2009 Hosted by SEMI

Quarterly Flexible, Printed Electronics Workshop October 22, 2009 Hosted by SEMI

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Quarterly Flexible, Printed Electronics Workshop October 22, 2009 Hosted by SEMI

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  1. Quarterly Flexible, Printed Electronics Workshop October 22, 2009 Hosted by SEMI

  2. Workshop Goals and Objectives • Flexible, Printed Electronics Market Outlook • Flexible Substrate Requirements for the Market • Substrate Requirements: Approaches & Challenges • WVP Testing & Barriers, Sensors & Medical Applications, Solar & Photovoltaics • Breakout Groups:Opportunities & Challenges for Successful Commercialization • Next generation materials, structures, processes, and equipment for low cost manufacturing of barriers and encapsulation • Advancing the understanding of failure mechanisms for OLEDs, TFPV, printed electronics on flex substrates • Real-time, on-line permeability measurements

  3. Flexible, Printed Electronics Market Outlook: NanoMarkets • Even under current conditions, the market can still support commercialization and growth of innovative ideas • Flexible substrates will be of growing importance, starting with metal foils • Development of robust encapsulation is an enabling technology for long-lived organic (and some inorganic) flexible products • Commercialization is just beginning in some sectors

  4. Flexible Substrate Requirements: Approaches & Needs • Roadmap of Substrate Requirements for Large Area Electronics • Industry Technology Development Efforts • Higher Ink Performance • Finer Printed Channels • Increased Circuit Density • But What About Substrates?? • Substrate Cost Represents Significant Percentage • Substrate must be compatible to fabrication process – temperature, materials, process environment, handling, etc. • Substrate Properties Determine Final Structure Features and Performance • Substrate Performs the “Heavy Lifting”

  5. Opportunities & Challenges for Successful Commercialization • Permation Methods for High Barrier Materials • Why Study Permeation? • All Polymers are Permeable!!! • Permeation rates are often a key measure of how well components and seals maintain a product’s shelf- life • Key Factors that Affect OLED Shelf-life • Oxygen- Commonly accepted to be 0.001 cc/(m2x day) or lower • Water Vapor- Commonly accepted to be 1e-6g/(m2 x day) or lower • How is High Barrier Permeation Measured • Water Vapor • Calcium Test • Tritium (Radio Active) in the form of HTO • Mass Spectrometry • Coulometric Sensor

  6. Opportunities & Challenges for Successful Commercialization • Flexible Sensors, Substrates for Medical Applications • Ideal Electronics for Biology & Medicine • Geometric conformability: direct biological interaction • Biocompatibility: mechanical; surface chemistry  • Scalability: micro to human size • On-board electronic: -rapid detection & analysis; communication alarms;on-board & remote decision making • Low cost: ubiquitous application; disposable  • Types of Biomedical Devices • External: remote sensing or skin contact • Biological sample: clinical chemistry; body fluids; cell or tissue • Direct Tissue Contact: sensors; bandages; implants • Challenges for Application of FlexE • Surface Biocompatibility:non-denaturing of Biomolecules; hydration; non-absorbing surfaces • Bulk Biocompatibilit: density & stiffness ~ that of biological tissues; minimize micromotion; complete integration into tissue • Implementation of FlexE Technology: engineering is basically available; stretchable electronics

  7. Opportunities & Challenges for Successful Commercialization • Reliability and Lifetime of Flexible Organic Electronics • Purpose: develop low cost, scalable PV manufacturing process; understanding how to encapsulate for environmental stability • Applications for Flexible Organic Photovoltaics • Thin, lightweight Organic Photovoltaics (OPV) on flexible substrates • Roll-to-Roll processing for high throughput • Portable applications, awnings, tents, marine • Required Performance, Stability Lifetime & Cost • 3 to 5 years -flex encapsulate; 10 to 15 yrs -glass encapsulate • $50/meter achievable by 2010; Translates to $1 watt @ 5% eff. • Encapsulation with Flexible Barriers • WVTR & OTR of Flexible Films; materials developed for OLED; std module size is approx. 164 cm2 • Adhesion Between Barrier Film, OPV Module • Important Considerations: adhesion at barrier film/adhesive interface, at adhesive/flexible substrate interface, at printed Ag/adhesive interface; chemical compatibility; physical compatibility; weathering • Summary -Further Down the Roadmap • Improved Stability: evaluation of higher quality barrier films; further improvements to encapsulation design • Improved Efficiency: new organic materials that; absorb over larger region of solar spectrum • Relatively Low Cost : improved processing & development for larger area modules

  8. FlexTech Alliance Technical Projects & Events • Current Projects: 28 Technical Development projects = $4.961 M • Materials & Components - 52% • Flex Substrate Tools & Manufacturing Technology - 28% • Military User Group (MAUG) Related -11% • Industry Data & Studies - 9% • Current Events 2010 • Feb. 1-4: 9th Annual Flexible Electronics & Displays Conference, Phoenix, Ariz • March: Flexible Display Center, Phoenix, Ariz • June: • September: • November: FlexTech Alliance HQ, San Jose, CA