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Academic Festival Friday, April 26, 2013

The Physics of Baking!!!. Academic Festival Friday, April 26, 2013. Review Do Now. HW Review. Read directions Must use the grade portal – get your login info before you leave school today Must get this sheet signed!!!. Main Ideas. Baking is a science!

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Academic Festival Friday, April 26, 2013

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  1. The Physics of Baking!!! Academic Festival Friday, April 26, 2013

  2. Review Do Now

  3. HW Review • Read directions • Must use the grade portal – get your login info before you leave school today • Must get this sheet signed!!!

  4. Main Ideas • Baking is a science! • When food is cooking, multiple chemical reactions and phase changes occur

  5. Transformations of food require… ….temperature control!

  6. What Are We Learning Today? • Describe the heat transfer that occurs during baking • Investigate how the interior texture of a molten chocolate cake changes with baking time • Determine the ideal baking time to maintain a perfect molten chocolate center

  7. Expectations • All safety rules are followed and equipment is properly used • Avoid stepping over cords • Do not go to the desks at the front of the room unless asked • Do not leave seat without raising hand • Use correct traffic patterns • Lab is complete by the end of class today (or you will have to finish it as extra HW after school today!) • Room is cleaned up at the end of class!

  8. During the Lab While you are not baking, you should: • Start answering question #3 • Answer the remaining questions

  9. E Air currents D walls of the oven A Oven rack is touching the ramekin surface C Oven coils B Ramekin is touching the cake batter

  10. Describe the Heat Transfer A – Metal rack heats the ramekin by conduction

  11. E Air currents D walls of the oven A Oven rack is touching the ramekin surface C Oven coils B Ramekin is touching the cake batter

  12. H Air flow G Surface of the cake F Ramekin in contact with the cake

  13. I Surface of the cake J Air flow K Cake in contact with plate

  14. Lab Procedure

  15. Thickness

  16. Backup

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