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ATLAS Upgrade

ATLAS Upgrade. Université de Genève. CHIPP Workshop on Detector R&D. Centre de rencontre de Cartigny D. Ferrère, 11 June 2008. On behalf of the University of Geneva. Possible Machine Scenarios. 3 phases considered:

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ATLAS Upgrade

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  1. ATLAS Upgrade Université de Genève CHIPP Workshop on Detector R&D Centre de rencontre de Cartigny D. Ferrère, 11 June 2008 On behalf of the University of Geneva

  2. Possible Machine Scenarios 3 phases considered: Phase 0: Push the machine to its maximum performance without hardware change Luminosity of 3x1034 cm-2s-1. and ultimate energy 7.54 TeV (dipole field @ 9T) Phase 1 (SLHC): Interaction Region (IR) quadrupoles life expectancy < 10 years  Modify the insertion quadrupoles and their layout b* Phase 2: Rebuild the SPS with superconducting magnets, the transfer line to inject into LHC at 1 TeV and new 15T dipoles  proton energy of 12.5 TeV Far future 2011-12 2014-15 Baseline Alternative NB: Original scenario of 12.5 ns excluded since exceed the max local cooling capacity Cartigny, June 11th 2008 ATLAS Upgrade, Didier 2

  3. Possible sLHC Schedule From Nigel Hessey – Upgrade Steering Group Cartigny, June 11th 2008 ATLAS Upgrade, Didier 3

  4. Rough ATLAS Upgrade Schedule • Very rough outline for ID Upgrade: • Start 2007: 3 years R&D 2007-2009 • TDR April 2010 • Other documents 2010; design work; final prototypes • PRR's, start procurement 2011 • 2 years building modules (and continuous parts procurement) 2012-2013 • Surface assembly and test 2013-2014 • Stop LHC end 2014 • Install 2015 • Take data April 2016 • Other factors: • CMS do not believe they can upgrade their inner tracker to run before 2018 • LHC expects new injectors (new PS replacement) ready for full sLHC in 2017 (so no data in 2016 would get us ready in time) • ATLAS could need to install in 2015 if LHC starts up fast and reaches “Ultimate” 2-3.1034 • Clearly we should only have one major shutdown • Propose discussion within LHCC to agree which year is the major shutdown Cartigny, June 11th 2008 ATLAS Upgrade, Didier 4

  5. ATLAS Upgrade - Detector Due to increase of radiation level, pile-up, background each sub-detectors has to think of the consequences in term of detector performance, aging, radiation hardness! Inner Detector (ID): Completely new design and detectors – No TRT, more pixel and strips:  New detector and ASICs technologies to withstand the radiation level  Simulations drive optimal geometry (Strawman layers) and occupancies Focus LAr Calorimeter: FCAL: To be replaced with smaller gap size and special cooling close to the beam pipe. HEC: Cold electronics may have to be replaced (no need to get HEC wheels apart) Others: More R&D require about the Ion buid-up Tile Calorimeter: Front-end electronics and Low Voltage Power Supplies Muon System: MDT: Chambers and readout electronics are radhard at LHC or can stand 10 times the max nominal flux but further studies need to be performed in SLHC environment  2008: detail upgrade plan based on some tests and R&D TGC: Thick GEMs or MM can possibly replace forward chambers due to high occupancy. Cartigny, June 11th 2008 ATLAS Upgrade, Didier 5

  6. SLHC - Challenges Cartigny, June 11th 2008 ATLAS Upgrade, Didier 6

  7. ATLAS Upgrade – Organization Cartigny, June 11th 2008 ATLAS Upgrade, Didier 7

  8. ATLAS Upgrade – PO Cartigny, June 11th 2008 ATLAS Upgrade, Didier 8

  9. Module Integration – SLHC FP7-PP Cartigny, June 11th 2008 ATLAS Upgrade, Didier 9

  10. Short and Long Strip Occupancy 1.6% 1.2% 0.8% Inner Detector Upgrade - Layout The goal for b-layer replacement is fall 2012 Actual b-layer is expected to survive 3 years at LHC design luminosity (~300fb-1) The Upgrade of the entire tracker should take place in 2016 Including disks this leads to: Pixels: 5 m2, ~300,000,000 channels Short strips: 60 m2, ~30,000,000 channels Long strips: 100m2, ~15,000,000 channels Strawman 06 Cartigny, June 11th 2008 ATLAS Upgrade, Didier 10

  11. Inner Detector Upgrade – Layout cont’d Strawman 07 Nb of hits into the ID volume Strawman06 vs Strawman07 A new version is about to come with single length barrel for Short- and Long-Strips… Cartigny, June 11th 2008 ATLAS Upgrade, Didier 11

  12. Effect of Tilt Angle Some simulations have started and comparisons with ATLAS Pixel data were done Timothy Greenshaw (Liverpool) – Presented a MIWG 05.06.2008 Cartigny, June 11th 2008 ATLAS Upgrade, Didier 12

  13. ATLAS – ID Detector https://twiki.cern.ch/twiki/bin/view/Atlas/AtlasTechnicalPaper Next time, lets not just get hung up over material at η=0. This is supposed to be a tracker up to |η|≤2.5 Cartigny, June 11th 2008 ATLAS Upgrade, Didier 13

  14. ATLAS - SCT A piece of art in term of services and engineering! Barrel modules were mounted with a robot not the endcap! Cartigny, June 11th 2008 ATLAS Upgrade, Didier 14

  15. Radiation Background in ATLAS at SLHC Simulation using FLUKA2006 • With safety factor of two, design short microstrip layers to withstand 1015neq/cm2 (50% neutrons) • Outer layers up to 4×1014neq/cm2(and mostly neutrons) Issues • Thermal management and shot noise. Silicon looks to need to be at ~ -25oC (Thermal runaway). Si power: 1W @ -20°C 4W @ -10°C 10W @ 0°C  High levels of activation will require careful consideration for access and maintenance. 1 MeV equivalent neutron fluences assuming an integrated luminosity of 3000fb-1 and 5cm of moderator lining the calorimeters (reduces fluences by ~25%) Cartigny, June 11th 2008 ATLAS Upgrade, Didier 15

  16. Pixel b-layer: 3D technology is an option (should be ready for b-layer replacement in 20012) Exist in single and double column type ionizing particle n+-columns p-Si electrons swept away by transversal field holes drift in central region and diffuse towards p+ contact Silicon Sensors Technology versus Radiation Choice of adequate material thanks to RD50 collaboration Pixel and Strips: n-in-p (planar technology) • No type inversion, full depletion is on structured side • Collection of electrons (faster than p-in-n) Still ~15000e- at 1.1015 cm-2s-1 (FZ or MCZ) 3D FZ 235mm P-FZ 280mm Cartigny, June 11th 2008 ATLAS Upgrade, Didier 16

  17. Short Strip Sensors - HPK • Strip segments • 4 rows of 2.38 cm strips (each row 1280 channels) 130 detectors ordered end of last year (15 for UniGe)! 9.75cm • Dimension • Full square • Wafer • 150 mm p-type FZ(100) • 138 mm dia. usable • 320 µm thick • Axial strips • 74.5 µm pitch • Stereo strips • 40 mrad • 71.5 µm pitch • Bond pads location • accommodating 24-40 mm distances • n-strip isolation • P-stop • Spray on miniatures 9.75cm Y. Unno Cartigny, June 11th 2008 ATLAS Upgrade, Didier 17

  18. First Engineering Layout Knowing the detector size and module and the layout… Cartigny, June 11th 2008 ATLAS Upgrade, Didier 18

  19. ABC-N Readout architecture FE Readout for Strip Upgrade Goal: Prepare a design of the FE ASIC in deep submicron radiation tolerant. Design and evaluation with 250 nm towards 130 nm technology Minimum requirements: • Implementation of an on-chip shunt regulation to allow any powering scheme (Serial or DC-DC) • Increased data bandwidth of 160 Mb/s • Compatibility with existing ATLAS SCT DAQ ROD hardware • Front-end for two signal polarities, 3 to 12 cm long silicon strips • Minimum power circuit techniques • Delay adjustment for control and data signals • Similar “core” functionality as for the present silicon strip tracker: signal amplification, discriminator, binary data storage for L1 latency, readout buffer with compression logic, and data serializer. Cartigny, June 11th 2008 ATLAS Upgrade, Didier 19

  20. • Daniel La Marra, Sebastien Pernecker, Geneva University • Wladek Dabrowski, Krzysztof Swientek, AGH-Cracow • Jan Kaplon, Karolina Poltorak, Francis Anghinolfi, CERN • Mitch Newcomer, Pennsylvania University Design team: FE Readout for Strip Upgrade Cartigny, June 11th 2008 ATLAS Upgrade, Didier 20

  21. A Break… • What do we have clear today? • Silicon sensors  n-in-p SS and LS OK • FE chips  Proceed with 0.25 mm technology then move this year to 0.13 mm • What are still unclear? • Layout: Hopefully a baseline will satisfy soon most of us! • Cooling: C3F8 or CO2…  Consequences are huge for the design • Powering with 4 options: Serial Powering + 3 flavors for the DC-DC • Modules integrations with 4 options: Stave + 3 module flavours (Just reviewed) • Endcap is not clearly defined in a modular or stave concept • Services: Keep or replace the services between PP1 and PP2 The engineering is requiring to work soon on one viable scenario! Cartigny, June 11th 2008 ATLAS Upgrade, Didier 21

  22. Cooling Cooling System is one of the key points for ID operation Heat density is 4-7 times higher than the current SCT module Detector thermal runaway impose to operate the silicon wafer below -20ºC Tsensor = Tcoolant + DTHeat_Path • Coolant: Less than -30 C is considered for the pipe temperature • Module design and choice of material is critical – Thermal FEA • 2 candidates for the cooling: • CO2 (~100 bar) • C3F8 (Medium-Low pressure) Pressure [bar] • Existing pipes are considered: • SCT & Pixel (ok for C2F6, C3F8) • TRT (ok for CO2 but limited number) 1g of evaporation @ -30ºC ~280 J (Where for C3F8 it is 100 J/g) CO2 Enthalpy [kJ/kg] Cartigny, June 11th 2008 ATLAS Upgrade, Didier 22

  23. Cooling – cont’d A very preliminar proposal for CO2 Middle muon • HEX is located at PP2 • Ex-TRT space available (+more? Other φ?), • Needs to be thermally neutral. • Plant stage • uses existing transfer network underneath inner muon system. • Throttling, back pressure regulation and heater close to HEX → accessible and “moderate” radiation. • Detector stage • uses new, insulated pipes from PP2 along calorimeter endplate to ID. • Pump close to PP2→ accessible and “moderate” radiation, but in magnetic field • No heaters or further HEXs needed • If we need throttle, it should also be located close to HEX for access, if the control allows. Access Inner muon Calorimeter ID Conceptual, not to scale Georg Vihausser – Presented at Thermal Management WG 10.06.2008 Cartigny, June 11th 2008 ATLAS Upgrade, Didier 23

  24. Powering From Marc Weber (RAL) Minimize current through cables by a) “recycling” current (SP) or b) “high-voltage” power lines (DC-DC) Serial powering BNL, Bonn, Cracow, Penn, Prague, RAL, Wuppertal, (FNAL) DC-DC buck converter BNL, CERN, Yale, (PSI) DC-DC charge pump LBNL Piezo transformer Masatoshi Imori, KEK and industry Cartigny, June 11th 2008 ATLAS Upgrade, Didier 24

  25. Element of Power Systems Off-detector power supply Constant-current source; HV supply Cables and power distribution scheme: IP; SP; PP On-detector power supplies: regulators; converters; transformers Monitor + control system DCS; protection; by-pass IP: independent powering; SP: Serial powering; PP: parallel powering On-detector supplies and understanding cables is most urgent, but we need all element! It is also time to see how elements would come together in a system. Cartigny, June 11th 2008 ATLAS Upgrade, Didier 25

  26. Proposed DCS Architecture D. Ferrere – PO April 08 Option 2 Option 1 LAN SCT DCS SCT DAQ CAN Bus CAN Bus Matrix CAN Bus Global Interlock Elmb Elmb ROD Ibox SPI bus daisy chain BOC BBIM DCS link 5 GB/s optical link Data/DCS DCS Type 2 cables PS Crate Env. Structure SMC Hybrid Environmental (Super-Module) Cooling Temp Hybrid Temp Hybrid Power Channel Interlock Detector PS Type 2  Type 4 cables Cartigny, June 11th 2008 ATLAS Upgrade, Didier 26

  27. Carbon honeycomb or foam Silicon sensors Carbon fiber facing Bus cable Coolant tube structure Hybrids Readout IC’s Module Integration - Stave • ATLAS specific design: 10, 10x10 cm sensors/side, doubled sided measurement • Embedded cooling and bus cable • Thickness and mass (Xo) depend upon choice of coolant, hybrid technology • Complete and inclusive except for barrel support cylinder and fixation points • Straightforward generalization to outer barrel modules • Baseline design has hybrids glued directly on sensors and small gaps in Z • Alternatives have been studied which include bridges and closed gaps Material budget announced to be relatively light: ~ 2.2 % for CO2 ~ 2.7 % for C3F8 (Only for the Stave) Cartigny, June 11th 2008 ATLAS Upgrade, Didier 27

  28. Module Integration – Stave07 30 modules with ABCD & serial power (ABCnext will be 30 V) Output noise Comparison 2 adjacent modules glued on a stave Cartigny, June 11th 2008 ATLAS Upgrade, Didier 28

  29. Module Integration – Module Concepts Module strongly inspired from SCT barrel. • Fundamental principle • Maximum Repairability and Replaceabiltiy • Separated function • Modularity • Double-sided module • 2D information in-situ - effective for track/hit finding • Minimum separation of axial and stereo sensors • Identical objects- effective for alignment • Above two are best realized with precision alignment of front-back sensors • Repairable and replaceable unit • Separated function of modules and service structures • Fabrications, QA's, Repairs, ..., in parallel • thus, minimizing risks and costs Cartigny, June 11th 2008 ATLAS Upgrade, Didier 29

  30. Module Integration – Super-Module Japan 2m long superframe for 20 modules Cartigny, June 11th 2008 ATLAS Upgrade, Didier 30

  31. Module Integration – Super-Module Japan Circumferential mounting with support jigs for 2 m long SM Cartigny, June 11th 2008 ATLAS Upgrade, Didier 31

  32. Module Integration – Local Support UniGe Individual module mounting Feb 07 10 Module structure Apr 07 With longitudinal insertion mechanism Local Support Row (LSR) Jul 07 Local Support with anchorage points (Valencia) Dec 07 Simplified Local Support Jan 08 Fabrication aspect taken into account Prototype program en route Demonstrator May 08 Review June 08 Cartigny, June 11th 2008 ATLAS Upgrade, Didier 32

  33. Module Integration – Local Support UniGe Stiff and self-handling structure. Module and barrel fixation precision as assembled! Local support on the jig for the assembly Cartigny, June 11th 2008 ATLAS Upgrade, Didier 33

  34. Module Integration – Local Support UniGe • Identified advantages of the end-insertion: • Flexibility: Barrel structures can be assembled before the SMs are integrated  Flexibility of the assembly procedure • Time saving:No need to test a fully populated barrel after another and then integrate the 5 barrel layers  Time saving about ~1 year (2-3 months per layer) • Parallel work: Assembly of the structure can be done in parallel with the SM/Stave production. Time saving can be considered! • Rework: The rework or replacement of a SM could occur even late (even after the commissioning). But when final services installed access is difficult! • SM/Stave replacement could happen in any working area (few light jigs). • It allows the use of either a single skin barrel cylinder with reinforcing rings or a CF sandwich • It allows double layer structure BUT … (see next slides) • Geometrical survey of the pre-assembled structures with and without SM/Stave. Cartigny, June 11th 2008 ATLAS Upgrade, Didier 34

  35. Si-wafer Tmax = -22.3oC ASIC’s Tmax = -14.5 oC Module Integration – Local Support UniGe K.P. Streit Preview 05.06.2008 Excellent performance with respect to the thermal runaway sLHC Cartigny, June 11th 2008 ATLAS Upgrade, Didier 35

  36. Module Integration – Wing Support UK Module connectors • Space available to services is high making design insensitive to exact powering and data scheme • In particular space for stubs and transition boards required for fan-out and cross-over of traces • No additional service supports and/or protection needed. • Services not cantilevered avoiding possibility of stresses being applied to modules • Services do not dictate assembly order • Notes on rendering • Extreme number of connectors shown on module • Exact shape of tapes to be driven by electrical layout (in progress) • Both top and bottom of module plug in to backbone Tape backbone Module connectors SMC envelope Pipe not sliding and constrained into cooling blocks Also end-insertion proposed… I. Wilmut Review 06.06.2008 Cartigny, June 11th 2008 ATLAS Upgrade, Didier 36

  37. Module Integration – Endcap C. Lacasta Review 06.06.2008 Cartigny, June 11th 2008 ATLAS Upgrade, Didier 37

  38. Module Integration – Endcap Cont’d C. Lacasta Review 06.06.2008 Cartigny, June 11th 2008 ATLAS Upgrade, Didier 38

  39. Module Integration – Review Closeout Recommendation summary • The stave appears to have a number of advantages and is the most advanced development. It should be the collaborations priority to complete this understanding by setting up collaboration-wide subgroups to tackle critical issues (see p6 but start to complete this list and set up groups today). • The second priority should be to accelerate the development of an EC solution. The hope is that the stave concept can be morphed into a petal or ring and benefit from the barrel development. • There are open issues with the stave which might result in a fall-back. Concentrating all effort on the stave is not risk-free. Revisit progress at Nikhef. • Review committee will circulate a detailed list of concerns in a few days M. Tyndel Review 07.06.2008 Cartigny, June 11th 2008 ATLAS Upgrade, Didier 39

  40. Module Integration – Engineering 1 single ID element Integrated and commissioned at the surface building A. Catinaccio Review 07.06.2008 Cartigny, June 11th 2008 ATLAS Upgrade, Didier 40

  41. Module Integration – Engineering & Services Possible connector implementation on the SMC! Only 60 mm space between interlinks! D. Ferrere Preview 05.06.2008 Cartigny, June 11th 2008 ATLAS Upgrade, Didier 41

  42. ATLAS Strip Upgrade - UniGe Involvements Asics: Digital Architecture & Simulation: pipeline, Derandomizer, Data Compression Logic, Readout Logic and Control; Check after place and route!  250nm submission January 2008  130nm design from January 2008 Detectors: 135 sensors of size10X10cm2 ordered to Hamamatsu UniGe ordered 15 sensors: 12 p-stop and 3 p-spray Sensor characterization will be made and compared with other institutes • Module Concept: UniGe investigated 2 concepts module directly mounted on barrel or mounted on an intermediate local support! • UniGe operates 3D Thermal FEA to evaluate and optimize the design • Strategy is to make prototype modules in 2008 with above detectors and Asics DCS: Involvement in the strategy and decision for the detector safety. DCS will be part of the system design to optimize the service and resource issues. Mechanical Engineering: Involvement in the structure and service design. Cartigny, June 11th 2008 ATLAS Upgrade, Didier 42

  43. Few Conclusions • SLHC is clearly in the continuity of the machine and detector operation • Phase 1 will be to increase the luminosity up to a factor 10 (1035 cm-2s-1 ) • ATLAS and CMS are considering options to Upgrade the detectors in 2016 • The ATLAS Inner Tracker will be completely renewed (no TRT) and is in a design and specification phase • The B-layer replacement is foreseen already in 2012 using 3-D sensors • The major challenges are: Service and material reductions, Cooling, Powering scheme • The time scale is short and there is almost no time for R&D • Working groups start smoothly to grow and to be active • UniGe involved in various topics and keep an eye on the B-layer replacement activities • Next event: • ID Upgrade Workshop Nov 2008at Nikhef Cartigny, June 11th 2008 ATLAS Upgrade, Didier 43

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